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1. 发明授权

US06957116B2 Quality assurance system and method 失效
标题翻译：质量保证体系和方法
公开(公告)号：US06957116B2
公开(公告)日：2005-10-18
申请号：US10679162
申请日：2003-10-03
申请人： Jung-Yi Tsai , Chao-Yu Chang , Chui-Chung Chiu , Shu-Jung Tseng
发明人： Jung-Yi Tsai , Chao-Yu Chang , Chui-Chung Chiu , Shu-Jung Tseng
IPC分类号： G06F19/00 , G06Q10/00
CPC分类号： G06Q10/06
摘要： A quality assurance system and method for use between a service provider having a sequence of process stages and a quality assurance stage, and a control center. The service provider performs a plurality of processes on goods at the process stages, transfers engineering data corresponding to the processes to the control center via Internet, and holds the goods at the quality assurance. The control center compares the engineering data with a standard specification, and transfers a confirmation message to the service provider if the engineering data conforms to the standard specification. The service provider may ship the goods to customers after the confirmation message is received.
摘要翻译：在具有一系列处理阶段的服务提供者和质量保证阶段之间使用的质量保证系统和方法以及控制中心。服务提供商在处理阶段对货物执行多个处理，通过互联网将对应于处理的工程数据传送到控制中心，并将货物保持在质量保证。控制中心将工程数据与标准规范进行比较，如果工程数据符合标准规范，则将确认消息传送给服务提供商。在接收到确认消息之后，服务提供商可以将货物运送给客户。

2. 发明申请

US20050075749A1 Quality assurance system and method 失效
公开(公告)号：US20050075749A1
公开(公告)日：2005-04-07
申请号：US10679162
申请日：2003-10-03
申请人： Jung-Yi Tsai , Chao-Yu Chang , Chui-Chung Chiu , Shu-Jung Tseng
发明人： Jung-Yi Tsai , Chao-Yu Chang , Chui-Chung Chiu , Shu-Jung Tseng
IPC分类号： G06F19/00 , G06Q10/00
CPC分类号： G06Q10/06
摘要： A quality assurance system and method for use between a service provider having a sequence of process stages and a quality assurance stage, and a control center. The service provider performs a plurality of processes on goods at the process stages, transfers engineering data corresponding to the processes to the control center via Internet, and holds the goods at the quality assurance. The control center compares the engineering data with a standard specification, and transfers a confirmation message to the service provider if the engineering data conforms to the standard specification. The service provider may ship the goods to customers after the confirmation message is received.

3. 发明授权

US07315827B2 Method and system for communicating semiconductor manufacturing information to customers 有权
标题翻译：向客户传达半导体制造信息的方法和系统
公开(公告)号：US07315827B2
公开(公告)日：2008-01-01
申请号：US10822522
申请日：2004-04-12
申请人： Hui-Jye Hshieh , Tu Shao Chi , Jung-Yi Tsai , Chui-Chung Chiu , Wendy Chang
发明人： Hui-Jye Hshieh , Tu Shao Chi , Jung-Yi Tsai , Chui-Chung Chiu , Wendy Chang
IPC分类号： G06F17/50
CPC分类号： G06Q10/10 , G06Q10/063 , G06Q10/087
摘要： A method of communicating semiconductor manufacturing information. The method includes providing, by a first service provider, a lot of semiconductor components to a second service provider for processing. The method also includes receiving from the second service provider, by the first service provider, first information associated with the processing. The method further includes outputting to a customer, by the first service provider, second information determined in response to the first information.
摘要翻译：一种传送半导体制造信息的方法。该方法包括由第一服务提供商将许多半导体组件提供给第二服务提供商进行处理。该方法还包括由第一服务提供商从第二服务提供商接收与该处理相关联的第一信息。该方法还包括由第一服务提供商向客户输出响应于第一信息确定的第二信息。

4. 发明申请

US20080071415A1 METHOD AND SYSTEM FOR COMMUNICATING SEMICONDUCTOR MANUFACTURING INFORMATION TO CUSTOMERS 审中-公开
标题翻译：向客户传达半导体制造信息的方法和系统
公开(公告)号：US20080071415A1
公开(公告)日：2008-03-20
申请号：US11936001
申请日：2007-11-06
申请人： Hui-Jye HSHIEH , Tu Shao Chi , Jung-Yi Tsai , Chui-Chung Chiu , Wendy Chang
发明人： Hui-Jye HSHIEH , Tu Shao Chi , Jung-Yi Tsai , Chui-Chung Chiu , Wendy Chang
IPC分类号： G06F19/00
CPC分类号： G06Q10/10 , G06Q10/063 , G06Q10/087
摘要： A method of communicating semiconductor manufacturing information. The method includes providing, by a first service provider, a lot of semiconductor components to a second service provider for processing. The method also includes receiving from the second service provider, by the first service provider, first information associated with the processing. The method further includes outputting to a customer, by the first service provider, second information determined in response to the first information.
摘要翻译：一种传送半导体制造信息的方法。该方法包括由第一服务提供商将许多半导体组件提供给第二服务提供商进行处理。该方法还包括由第一服务提供商从第二服务提供商接收与该处理相关联的第一信息。该方法还包括由第一服务提供商向客户输出响应于第一信息确定的第二信息。

5. 发明申请

US20050240454A1 Method and system for communicating semiconductor manufacturing information to customers 有权
标题翻译：向客户传达半导体制造信息的方法和系统
公开(公告)号：US20050240454A1
公开(公告)日：2005-10-27
申请号：US10822522
申请日：2004-04-12
申请人： Hui-Jye Hshieh , Tu Shao Chi , Jung-Yi Tsai , Chui-Chung Chiu , Wendy Chang
发明人： Hui-Jye Hshieh , Tu Shao Chi , Jung-Yi Tsai , Chui-Chung Chiu , Wendy Chang
IPC分类号： G06Q10/00 , G06F17/60
CPC分类号： G06Q10/10 , G06Q10/063 , G06Q10/087
摘要： A method of communicating semiconductor manufacturing information. The method includes providing, by a first service provider, a lot of semiconductor components to a second service provider for processing. The method also includes receiving from the second service provider, by the first service provider, first information associated with the processing. The method further includes outputting to a customer, by the first service provider, second information determined in response to the first information.
摘要翻译：一种传送半导体制造信息的方法。该方法包括由第一服务提供商将许多半导体组件提供给第二服务提供商进行处理。该方法还包括由第一服务提供商从第二服务提供商接收与该处理相关联的第一信息。该方法还包括由第一服务提供商向客户输出响应于第一信息确定的第二信息。

6. 发明申请

US20070042532A1 System and methods for packing in turnkey services 审中-公开
标题翻译：打包服务的系统和方法
公开(公告)号：US20070042532A1
公开(公告)日：2007-02-22
申请号：US11208102
申请日：2005-08-19
申请人： Jung-Yi Tsai , Chao-Hsin Chang , Wen-Sze Huang
发明人： Jung-Yi Tsai , Chao-Hsin Chang , Wen-Sze Huang
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , H01L21/67271 , H01L21/67276 , H01L21/67333
摘要： A system of packing for turnkey services. An input port receives first and second wafer lots from a semiconductor manufacturer. The first wafer lot comprises a first number of dies, and the second wafer lot comprises a second number of dies. A packing device loads dies of the first wafer lot in a provided carrier having a preset capacity, and each of the loaded carriers is filled to capacity. A controller determines whether there is a remaining die of the first wafer lot that cannot fill one of the carriers, and directs the packing device to load the remaining dies of the first wafer lot and dies of the second wafer lot sequentially.
摘要翻译：交钥匙服务包装系统。输入端口从半导体制造商接收第一和第二晶圆批次。第一晶片块包括第一数量的管芯，第二晶片块包括第二数量的管芯。包装装置在具有预设容量的所提供的载体中装载第一晶片批次的管芯，并且将每个加载的载体填充到容量。控制器确定是否存在不能填充一个载体的第一晶片批次的剩余的芯片，并且引导封装装置依次加载第一晶片批次的剩余模具和第二晶片批次的模具。

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