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    • 1. 发明授权
    • EEPROM device with plurality of memory strings made of floating gate
transistors connected in series
    • 具有由串联连接的浮栅晶体管构成的多个存储串的EEPROM器件
    • US4962481A
    • 1990-10-09
    • US292107
    • 1988-12-30
    • Jung-Hyuk ChoiSoo-Chul LeeHyung-Kyu Yim
    • Jung-Hyuk ChoiSoo-Chul LeeHyung-Kyu Yim
    • G11C17/00G11C16/02G11C16/04G11C16/10G11C16/14G11C16/16G11C16/26H01L21/8247H01L23/528H01L27/10H01L27/115H01L29/788H01L29/792
    • G11C16/0483G11C16/10G11C16/14G11C16/16G11C16/26H01L23/528H01L27/115H01L27/11521H01L27/11524H01L29/7885H01L2924/0002
    • An electrically erasable programmable semiconductor memory array for high density including a plurality of column lines; a plurality of reference lines perpendicular to the column lines; a plurality of memory strings arranged in two columns at both sides of each column line and in upper and lower rows between the reference lines, each of upper and lower memory strings at one side of each column including a first transistor and a plurality of floating gate transistors, each of upper and lower memory strings at the other side of each column including a second transistor and a plurality of floating gate transistors, drain-source paths of the first or second transistor and the floating gate transistors in each memory string being connected in series, the first and second transistors and the floating gate transistors being arranged in an array of rows and columns, gates of the first and second transistors and the floating gate transistors in the upper memory strings and the first and second transistors and the floating gate transistors in the lower memory strings being respectively connected to first and second select lines, each other upper word lines, third and fourth select lines and each other lower word lines. The drains of the first and second transistors are connected to the column line through a single contact hole; the other ends of the serial connections in the upper memory strings are connected to the reference line adjacent thereto; and means for connecting the other ends of the serial connections in the lower memory strings to the reference line adjacent thereto.
    • 一种用于高密度的电可擦除可编程半导体存储器阵列,包括多个列线; 垂直于列线的多个参考线; 在列列线的两侧排列成两列的多个存储器串和参考线之间的上下行中的每一列的每一列的每一列包括第一晶体管和多个浮置栅极 晶体管,每列包括第二晶体管和多个浮置栅极晶体管的每列的另一侧的每个上和下存储器串,每个存储器串中的第一或第二晶体管的漏极 - 源极路径和浮置栅极晶体管被连接 串联的第一和第二晶体管和浮置栅极晶体管布置成行和列的阵列,第一和第二晶体管的栅极和上部存储器串中的浮动栅极晶体管以及第一和第二晶体管以及浮动栅极晶体管 在下部存储器串分别连接到第一和第二选择线,彼此之间的上部字线,第三和第四个字母 ect线和彼此较低的字线。 第一和第二晶体管的漏极通过单个接触孔连接到列线; 上部存储器串中的串行连接的另一端连接到与其相邻的参考线; 以及用于将下部存储器串中的串行连接的另一端连接到与其相邻的参考线的装置。
    • 2. 发明授权
    • Structure and method for manufacturing a series read only memory with
spacer film
    • 用间隔膜制造串联只读存储器的结构和方法
    • US5067001A
    • 1991-11-19
    • US607760
    • 1990-10-30
    • Jung-Hyuk Choi
    • Jung-Hyuk Choi
    • H01L21/8246H01L27/112
    • H01L27/1126H01L27/112Y10S257/90
    • Disclosed is a device and method for manufacturing a mask read only memory (ROM) using a spacing film and NAND logic to attain high integration density. Side wall layers are separated between connection regions and reference regions with gate oxide layers formed on a surface of the substrate and gate electrode formed over side walls of the side wall layers placed between each of the gate oxide layers and adjacent memory cells. Channel regions having a first conductivity type of ion are formed under memory cells adjacent to the connection region and oxide layers of selected memory cells. Channel regions exhibiting a second conductivity type of ion are formed under the oxide layers of the non-selected memory cells and the side wall layers.
    • 公开了一种使用间隔膜和NAND逻辑制造掩模只读存储器(ROM)以获得高集成度的装置和方法。 侧壁层在连接区域和参考区域之间分开,栅极氧化层形成在衬底的表面上,栅电极形成在位于每个栅氧化层和相邻存储单元之间的侧壁层的侧壁上。 具有第一导电类型的离子的通道区域形成在与选择的存储单元的连接区域和氧化物层相邻的存储单元的下方。 在未选择的存储单元和侧壁层的氧化物层的下方形成具有第二导电型离子的通道区域。