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1. 发明申请

US20100330714A1 MOLD FOR FORMING A MOLDING MEMBER AND METHOD OF FABRICATING A MOLDER MEMBER USING THE SAME 有权
标题翻译：用于形成模制构件的模具和使用其制造模具构件的方法
公开(公告)号：US20100330714A1
公开(公告)日：2010-12-30
申请号：US12881657
申请日：2010-09-14
申请人： Jung Hwa JUNG , Chung Hoon LEE
发明人： Jung Hwa JUNG , Chung Hoon LEE
IPC分类号： H01L21/56 , B29C45/14 , H01L33/52
CPC分类号： H01L21/565 , B29C33/10 , B29C39/006 , B29C39/10 , B29C39/26 , B29C45/14655 , B29C45/34 , B29L2011/00 , H01L23/49861 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2924/00014
摘要： There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. Injection and discharge holes extend from the upper surface to the lower surface. Accordingly, after the mold and the package are coupled so that the discharge hole is directed upward, a molding member can be formed on the package by injecting the molding material through the injection hole, whereby it is possible to prevent air bubbles from being captured in the molding member.
摘要翻译：提供了用于形成模制构件的模具和使用其形成模制构件的方法。模具包括上表面和具有外周表面和由外周围包围的凹面的下表面。注射和排出孔从上表面延伸到下表面。因此，在模具和包装件联接成使得排出孔向上指向之后，可以通过从注射孔注入成型材料而在包装上形成成型构件，由此可以防止气泡被捕获模制构件。

2. 发明申请

US20120217885A1 LIGHT EMITTING DEVICE FOR AC POWER OPERATION 有权
标题翻译：用于交流电源运行的发光装置
公开(公告)号：US20120217885A1
公开(公告)日：2012-08-30
申请号：US13461505
申请日：2012-05-01
申请人： Chung Hoon LEE , James S. SPECK , Hong San KIM , Jae Jo KIM , Sung Han KIM , Jae Ho LEE
发明人： Chung Hoon LEE , James S. SPECK , Hong San KIM , Jae Jo KIM , Sung Han KIM , Jae Ho LEE
IPC分类号： H05B37/00
CPC分类号： H05B33/0827 , H01L27/153 , H01L27/156 , H01L2224/48137 , H01L2224/49107 , H01L2224/73265 , H05B33/02 , H05B33/08 , H05B33/0806 , H05B33/0815 , H05B33/0821 , H05B33/0824 , H05B33/083 , H05B33/0848 , H05B37/029
摘要： Disclosed is an improved light-emitting device for an AC power operation. An AC light-emitting device according to the present invention employs a variety of means by which light emission time is prolonged during a ½ cycle in response to a phase change of an AC power source and a flicker effect can be reduced. For example, the means may be switching blocks respectively connected to nodes between the light emitting cells, switching blocks connected to a plurality of arrays, or a delay phosphor. Further, there is provided an AC light-emitting device, wherein a plurality of arrays having the different numbers of light emitting cells are employed to increase light emission time and to reduce a flicker effect.
摘要翻译：公开了一种用于AC电力操作的改进的发光装置。根据本发明的交流发光装置采用各种手段，响应于交流电源的相变而在1/2周期期间发光时间延长，并且可以减少闪烁效应。例如，装置可以是分别连接到发光单元，连接到多个阵列的切换块或延迟荧光体之间的节点的切换块。此外，提供了一种交流发光装置，其中采用具有不同数量的发光单元的多个阵列来增加发光时间并减少闪烁效果。

3. 发明申请

US20120097996A1 LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES 审中-公开
标题翻译：具有连接在一起的发光细胞阵列的LED封装
公开(公告)号：US20120097996A1
公开(公告)日：2012-04-26
申请号：US13341659
申请日：2011-12-30
申请人： Chung Hoon LEE , Keon Young LEE , Hong San KIM , Dae Won KIM , Hyuck Jung CHOI
发明人： Chung Hoon LEE , Keon Young LEE , Hong San KIM , Dae Won KIM , Hyuck Jung CHOI
IPC分类号： H01L27/15
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.
摘要翻译：公开了具有串联耦合的发光单元阵列的发光二极管（LED）封装。 LED封装包括安装在封装主体上的封装体和LED芯片。 LED芯片具有串联耦合的发光单元阵列。由于具有串联耦合的发光单元阵列的LED芯片安装在LED封装上，所以可以使用AC电源直接驱动。

4. 发明申请

US20120001205A1 LIGHT EMITTING DEVICE HAVING STRONTIUM OXYORTHOSILICATE TYPE PHOSPHORS 有权
标题翻译：具有氧化硅酸钠型磷光体的发光装置
公开(公告)号：US20120001205A1
公开(公告)日：2012-01-05
申请号：US12972996
申请日：2010-12-20
申请人： Chung Hoon LEE , Walter TEWS , Gundula ROTH , Detlef STARICK
发明人： Chung Hoon LEE , Walter TEWS , Gundula ROTH , Detlef STARICK
IPC分类号： H01L27/15 , H01L33/50
CPC分类号： C09K11/7734 , H01L33/50 , H01L33/647 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： Exemplary embodiments of the present invention relate to light emitting devices including strontium oxyorthosilicate-type phosphors. The light emitting device includes a light emitting diode, which emits light in the UV or visible range, and phosphors disposed around the light emitting diode to absorb light emitted from the light emitting diode and emit light having a different wavelength from the absorbed light. The phosphors include an oxyorthosilicate phosphor having a general formula of Sr3-x-y-zCaxMIIySiO5: Euz with a calcium molar fraction in the range of 0
摘要翻译：本发明的示例性实施例涉及包括氧化硅酸锶型磷光体的发光器件。发光装置包括发射紫外或可见光范围的光的发光二极管，以及设置在发光二极管周围的荧光体，以吸收从发光二极管发出的光并发射具有与吸收光不同的波长的光。磷光体包括具有通式Sr3-x-y-zCaxMIIySiO5：Euz的氧化正硅酸盐荧光体，钙摩尔分数在0

5. 发明申请

US20110204291A1 LUMINESCENT MATERIAL 有权
标题翻译：发光材料
公开(公告)号：US20110204291A1
公开(公告)日：2011-08-25
申请号：US13099879
申请日：2011-05-03
申请人： Gundula ROTH , Walter TEWS , Chung Hoon LEE
发明人： Gundula ROTH , Walter TEWS , Chung Hoon LEE
IPC分类号： C09K11/55 , C09K11/54 , C09K11/57 , C09K11/66 , C09K11/77 , C09K11/74
CPC分类号： C09K11/7734 , C09K11/58 , C09K11/592 , C09K11/66 , C09K11/665 , C09K11/666 , C09K11/7457 , C09K11/753 , C09K11/756 , C09K11/757 , C09K11/758 , C09K11/7706 , C09K11/7707 , C09K11/7709 , C09K11/7714 , C09K11/7735 , C09K11/7737 , C09K11/7738 , C09K11/7739 , C09K11/774 , C09K11/7742 , C09K11/7783 , C09K11/7792
摘要： A luminescent material is disclosed. The luminescent material may include a first compound having a host lattice comprising first ions and oxygen. A first portion of the first ions may be substituted by copper ions. In one embodiment, the host lattice may include silicon, the copper ions may be divalent copper ions and the first compound may have an Olivine crystal structure, β-K.2SO4 crystal structure, a trigonal Glaserite (K3Na(SO4)2) or monoclinic Merwinite crystal structure, a tetragonal Ackermanite crystal structure, a tetragonal crystal structure or an orthorhombic crystal structure. In another embodiment, the copper ions do not act as luminescent ions upon excitation with the ultraviolet or visible light.
摘要翻译：公开了一种发光材料。发光材料可以包括具有包含第一离子和氧的主晶格的第一化合物。第一离子的第一部分可以被铜离子取代。在一个实施例中，主晶格可以包括硅，铜离子可以是二价铜离子，并且第一化合物可以具有橄榄石晶体结构，K 2 SO 4晶体结构，三角形镓石（K3Na（SO4）2）或单斜晶系的Merwinite晶体结构，四方晶系晶体结构，四方晶体结构或正交晶体结构。在另一个实施方案中，当用紫外线或可见光激发时，铜离子不作为发光离子。

6. 发明申请

US20100193808A1 LIGHT EMITTING DEVICE HAVING A PLURALITY OF LIGHT EMITTING CELLS AND PACKAGE MOUNTING THE SAME 有权
公开(公告)号：US20100193808A1
公开(公告)日：2010-08-05
申请号：US12766656
申请日：2010-04-23
申请人： Chung Hoon LEE , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
发明人： Chung Hoon LEE , Lacroix Yves , Hyung Soo Yoon , Young Ju Lee
IPC分类号： H01L27/15 , H01L33/00
CPC分类号： H01L27/153 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2924/01322 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

7. 发明申请

US20090189166A1 LIGHT EMITTING DEVICE HAVING A PLURALITY OF LIGHT EMITTING CELLS AND METHOD OF FABRICATING THE SAME 有权
标题翻译：具有多个发光单元的发光装置及其制造方法
公开(公告)号：US20090189166A1
公开(公告)日：2009-07-30
申请号：US12410101
申请日：2009-03-24
申请人： Chung Hoon LEE , Hong San Kim , James S. Speck
发明人： Chung Hoon LEE , Hong San Kim , James S. Speck
IPC分类号： H01L33/00
CPC分类号： H01L27/153 , H01L33/62 , H01L33/64 , H01L2224/48095 , H01L2224/73265 , H01L2924/01012 , H01L2924/01079
摘要： Disclosed is a light emitting device having a plurality of light emitting cells. The light emitting device comprises a thermally conductive substrate, such as a SiC substrate, having a thermal conductivity higher than that of a sapphire substrate. The plurality of light emitting cells are connected in series on the thermally conductive substrate. Meanwhile, a semi-insulating buffer layer is interposed between the thermally conductive substrate and the light emitting cells. For example, the semi-insulating buffer layer may be formed of AlN or semi-insulating GaN. Since the thermally conductive substrate having a thermal conductivity higher than that of a sapphire substrate is employed, heat-dissipating performance can be enhanced as compared with a conventional sapphire substrate, thereby increasing the maximum light output of a light emitting device that is driven under a high voltage AC power source. In addition, since the semi-insulating buffer layer is employed, it is possible to prevent an increase in a leakage current through the thermally conductive substrate and between the light emitting cells.
摘要翻译：公开了具有多个发光单元的发光器件。发光器件包括具有高于蓝宝石衬底的热导率的导热衬底，例如SiC衬底。多个发光单元串联连接在导热基板上。同时，在导热基板和发光单元之间插入半绝缘缓冲层。例如，半绝缘缓冲层可以由AlN或半绝缘GaN形成。由于采用具有高于蓝宝石基板的导热性的导热性基板，所以与以往的蓝宝石基板相比，能够提高散热性能，从而能够增大驱动下的发光元件的最大光输出高压交流电源。此外，由于采用了半绝缘缓冲层，因此可以防止通过导热基板和发光单元之间的漏电流的增加。

8. 发明申请

US20080265374A1 (Al, Ga, In)N-BASED COMPOUND SEMICONDUCTOR AND METHOD OF FABRICATING THE SAME 有权
标题翻译：（Al，Ga，In）N基化合物半导体及其制造方法
公开(公告)号：US20080265374A1
公开(公告)日：2008-10-30
申请号：US12132760
申请日：2008-06-04
申请人： Chung Hoon LEE
发明人： Chung Hoon LEE
IPC分类号： H01L29/20 , H01L21/205
CPC分类号： H01L33/40 , H01L33/0095 , H01L33/32
摘要： Disclosed are a (Al, Ga, In)N-based compound semiconductor device and a method of fabricating the same. The (Al, Ga, In)N-based compound semiconductor device of the present invention comprises a substrate; a (Al, Ga, In)N-based compound semiconductor layer grown on the substrate; and an electrode formed of at least one material or an alloy thereof selected from the group consisting of Pt, Pd and Au on the (Al, Ga, In)N-based compound semiconductor layer. Further, the method of fabricating the (Al, Ga, In)N-based compound semiconductor device comprises the steps of growing a P layer including P type impurities in a growth chamber; discharging hydrogen and a hydrogen source gas in the growth chamber; lowering the temperature of the (Al, Ga, In)N-based compound semiconductor with the P layer formed thereon to such an extent that it can be withdrawn to the outside from the growth chamber; withdrawing the (Al, Ga, In)N-based compound semiconductor from the growth chamber; and forming an electrode of at least one material or an alloy thereof selected from the group consisting of Pt, Pd and Au on the p layer. According to the present invention, it is possible to sufficiently secure P type conductivity and obtain good ohmic contact characteristics without performing an annealing process. And, no further annealing is necessary when Pt, Pd, Au electrode are used.
摘要翻译：公开了一种（Al，Ga，In）N基化合物半导体器件及其制造方法。本发明的（Al，Ga，In）N基化合物半导体器件包括：衬底; 在衬底上生长的（Al，Ga，In）N基化合物半导体层; 以及在（Al，Ga，In）N基化合物半导体层上由选自Pt，Pd和Au的至少一种材料或其合金形成的电极。此外，制造（Al，Ga，In）N基化合物半导体器件的方法包括在生长室中生长包含P型杂质的P层的步骤; 在生长室中排出氢和氢源气体; 降低其上形成有P层的（Al，Ga，In）N基化合物半导体的温度至可从生长室抽出到外部的程度; 从生长室中取出（Al，Ga，In）N基化合物半导体; 以及在p层上形成选自Pt，Pd和Au中的至少一种材料或其合金的电极。根据本发明，可以在不进行退火处理的情况下充分确保P型导电性并获得良好的欧姆接触特性。并且，当使用Pt，Pd，Au电极时，不需要进一步的退火。

9. 发明申请

US20170317247A1 METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND SEMICONDUCTOR DEVICE FABRICATED BY THE SAME 审中-公开
公开(公告)号：US20170317247A1
公开(公告)日：2017-11-02
申请号：US15646099
申请日：2017-07-11
申请人： Chung Hoon LEE , Dae Sung KAL , Ki Bum NAM
发明人： Chung Hoon LEE , Dae Sung KAL , Ki Bum NAM
IPC分类号： H01L33/50 , H01L33/44 , H01L23/00 , H01L33/00 , H01L23/498 , H01L33/36 , H01L33/48
CPC分类号： H01L33/507 , H01L23/49805 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/33 , H01L24/83 , H01L24/94 , H01L33/005 , H01L33/0079 , H01L33/0095 , H01L33/36 , H01L33/44 , H01L33/486 , H01L33/50 , H01L2224/04026 , H01L2224/05073 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05171 , H01L2224/05553 , H01L2224/05571 , H01L2224/06151 , H01L2224/11462 , H01L2224/16013 , H01L2224/16057 , H01L2224/16151 , H01L2224/27462 , H01L2224/32238 , H01L2224/325 , H01L2224/33151 , H01L2224/81893 , H01L2224/83447 , H01L2224/83455 , H01L2224/83893 , H01L2224/94 , H01L2224/97 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2933/0033 , H01L2924/00012 , H01L2924/00014 , H01L2224/81 , H01L2924/00
摘要： A semiconductor device including a first lead electrode and a second lead electrode; a semiconductor stack structure disposed on the member, the semiconductor stack structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active region interposed between the first and second conductive semiconductor layers; a first electrode electrically connected to the first conductive semiconductor layer; a second electrode electrically connected to the second conductive semiconductor layer; a plating layer configured to bond the semiconductor stack structure to the member; and a first wavelength converter that covers at least side surfaces of the semiconductor stack structure.

10. 发明申请

US20110140135A1 LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES 审中-公开
公开(公告)号：US20110140135A1
公开(公告)日：2011-06-16
申请号：US13033702
申请日：2011-02-24
申请人： Chung Hoon LEE , Keon Young LEE , Hong San KIM , Dae Won KIM , Hyuck Jung CHOI
发明人： Chung Hoon LEE , Keon Young LEE , Hong San KIM , Dae Won KIM , Hyuck Jung CHOI
IPC分类号： H01L33/08 , H01L33/48 , H01L33/60
CPC分类号： H01L33/36 , F21K9/00 , H01L27/153 , H01L33/20 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

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