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1. 发明授权

US08748917B2 Light emitting device and method thereof 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US08748917B2
公开(公告)日：2014-06-10
申请号：US13036394
申请日：2011-02-28
申请人： June O Song , Young Kyu Jeong , Kyung Wook Park , Kwang Ki Choi , Da Jeong Song
发明人： June O Song , Young Kyu Jeong , Kyung Wook Park , Kwang Ki Choi , Da Jeong Song
IPC分类号： H01L29/207 , H01L33/00
CPC分类号： H01L33/0079 , H01L27/15 , H01L33/20 , H01L2224/48091 , H01L2924/01087 , H01L2924/00014
摘要： Disclosed are a method of fabricating a light emitting device includes the steps of: forming a plurality of compound semiconductor layers on a substrate, the substrate including a plurality of chip regions and isolation region; selectively etching the compound semiconductor layers to form a light emitting structure on each chip region and form a buffer structure on the isolation region; forming a conductive support member on the light emitting structure and the buffer structure; removing the substrate by using a laser lift off process; and dividing the conductive support member into the a plurality of chips of the chip regions, wherein the buffer structure is spaced apart from the light emitting structure.
摘要翻译：公开了一种制造发光器件的方法，包括以下步骤：在衬底上形成多个化合物半导体层，所述衬底包括多个芯片区域和隔离区域; 选择性地蚀刻化合物半导体层以在每个芯片区域上形成发光结构，并在隔离区上形成缓冲结构; 在所述发光结构和所述缓冲结构上形成导电支撑构件; 通过使用激光剥离工艺去除衬底; 并且将导电支撑构件分成芯片区域的多个芯片，其中缓冲结构与发光结构间隔开。

2. 发明授权

US08552452B2 Light emitting device and lighting instrument including the same 有权
标题翻译：发光装置和照明器具等
公开(公告)号：US08552452B2
公开(公告)日：2013-10-08
申请号：US13213767
申请日：2011-08-19
申请人： Hwan Hee Jeong , Sang Youl Lee , Young kyu Jeong , Chung song Kim , June O Song , Kwang Ki Choi , Eun Joo Kim
发明人： Hwan Hee Jeong , Sang Youl Lee , Young kyu Jeong , Chung song Kim , June O Song , Kwang Ki Choi , Eun Joo Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/387 , H01L33/44 , H01L2224/48091 , H01L2924/00014
摘要： Disclosed is a light emitting device including, a second electrode layer, a light emitting structure that includes a second conductive semiconductor layer, an active layer and a first conductive semiconductor layer and that is provided on the second electrode layer, a first electrode layer that includes a pad part and an electrode part connected to the pad part and that is provided on the light emitting structure, and a current blocking layer arranged between the second electrode layer and the light emitting structure in such a way that a part of the current block layer overlaps to correspond to the first electrode layer, wherein a width of the current blocking layer corresponding to the electrode part is different depending upon a clearance with the pad part.
摘要翻译：公开了一种发光器件，包括第二电极层，发光结构，其包括第二导电半导体层，有源层和第一导电半导体层，并且设置在第二电极层上，第一电极层包括焊盘部分和连接到焊盘部分并且设置在发光结构上的电极部分以及布置在第二电极层和发光结构之间的电流阻挡层，使得当前阻挡层的一部分重叠以对应于第一电极层，其中对应于电极部分的电流阻挡层的宽度根据与焊盘部分的间隙而不同。

3. 发明授权

US08373152B2 Light-emitting element and a production method therefor 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US08373152B2
公开(公告)日：2013-02-12
申请号：US12934057
申请日：2009-03-27
申请人： June O Song
发明人： June O Song
IPC分类号： H01L29/06
CPC分类号： H01L33/14 , H01L33/0079
摘要： A light emitting element according to an exemplary embodiment includes: a support substrate; a second electrode layer formed on the support substrate; a current spreading layer formed on the support substrate; a second conductive semiconductor layer formed on the second electrode layer and the current spreading layer; an active layer formed on the second conductive semiconductor layer; a first conductive semiconductor layer formed on the active layer; and a first electrode layer formed on the first conductive semiconductor layer.
摘要翻译：根据示例性实施例的发光元件包括：支撑衬底; 形成在所述支撑基板上的第二电极层; 形成在所述支撑基板上的电流扩散层; 形成在第二电极层和电流扩散层上的第二导电半导体层; 形成在所述第二导电半导体层上的有源层; 形成在所述有源层上的第一导电半导体层; 以及形成在所述第一导电半导体层上的第一电极层。

4. 发明授权

US08324649B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US08324649B2
公开(公告)日：2012-12-04
申请号：US13216932
申请日：2011-08-24
申请人： Sang Youl Lee , Hwan Hee Jeong , Ji Hyung Moon , Young Kyu Jeong , Kwang Ki Choi , June O Song
发明人： Sang Youl Lee , Hwan Hee Jeong , Ji Hyung Moon , Young Kyu Jeong , Kwang Ki Choi , June O Song
IPC分类号： H01L33/00
CPC分类号： H01L33/44 , H01L33/0079 , H01L33/145 , H01L33/22 , H01L33/382 , H01L33/46 , H01L2224/48247 , H01L2924/12032 , H01L2924/00
摘要： A light emitting device is provided that includes a light emitting structure (including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer), a conductive layer, an insulation layer, and a current blocking layer. The conductive layer may have a first conductive portion that passes through the second conductive type semiconductor layer and the active layer to contact the first conductive type semiconductor layer. The insulation layer may have a first insulation portion that surrounds the first conductive portion of the conductive layer. The current blocking layer may substantially surround the first insulation portion of the insulation layer, the first insulation portion provided between the current blocking layer and the first conductive portion.
摘要翻译：提供一种发光器件，其包括发光结构（包括第一导电类型半导体层，有源层和第二导电类型半导体层），导电层，绝缘层和电流阻挡层。导电层可以具有穿过第二导电类型半导体层和有源层以接触第一导电类型半导体层的第一导电部分。绝缘层可以具有围绕导电层的第一导电部分的第一绝缘部分。电流阻挡层可以基本上围绕绝缘层的第一绝缘部分，设置在电流阻挡层和第一导电部分之间的第一绝缘部分。

5. 发明授权

US08179039B2 Light emitting device, method of manufacturing the same, light emitting device package, and illumination system 有权
标题翻译：发光器件，其制造方法，发光器件封装和照明系统
公开(公告)号：US08179039B2
公开(公告)日：2012-05-15
申请号：US13028686
申请日：2011-02-16
申请人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
发明人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
IPC分类号： H05B33/00 , F21V1/00
CPC分类号： H01L33/62 , H01L33/08 , H01L33/20 , H01L33/42 , H01L2224/48091 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Disclosed are a light emitting device, a method of manufacturing the same, a light emitting device package, and an illumination system. The light emitting device includes a transmissive substrate, an ohmic layer on the transmissive substrate, a light emitting structure on the ohmic layer and including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer between the first and second semiconductor layers, a electrode layer on a bottom surface of the transmissive substrate, and a conductive via electrically connecting the light emitting structure with the electrode layer through the transmissive substrate wherein an area of the transmissive substrate is increased toward an upper portion thereof from a lower portion.
摘要翻译：公开了发光器件，其制造方法，发光器件封装和照明系统。发光器件包括透射衬底，透射衬底上的欧姆层，欧姆层上的发光结构，并且包括第一和第二半导体层之间的第一导电半导体层，第二导电半导体层和有源层，透射基板的底面上的电极层，以及通过透射基板将发光结构与电极层电连接的导电通孔，其中透射基板的面积从下部向其上部增加。

6. 发明授权

US08872215B2 Light emitting device and light emitting device package 有权
标题翻译：发光器件和发光器件封装
公开(公告)号：US08872215B2
公开(公告)日：2014-10-28
申请号：US13033224
申请日：2011-02-23
申请人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song
发明人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song
IPC分类号： H01L33/36 , H01L33/38 , H01L33/14 , H01L27/15 , H01L33/22
CPC分类号： H01L27/15 , H01L29/78 , H01L33/22 , H01L33/38 , H01L33/385 , H01L33/46 , H01L33/62 , H01L2224/48091 , H01L2924/13062 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device according to the embodiment includes a first electrode; a light emitting structure including a first semiconductor layer, an active layer and a second semiconductor layer on the first electrode; a second electrode on the light emitting structure; and a control switch installed on the light emitting structure to control the light emitting structure.
摘要翻译：根据实施例的发光器件包括第一电极; 在第一电极上包括第一半导体层，有源层和第二半导体层的发光结构; 在发光结构上的第二电极; 以及安装在发光结构上以控制发光结构的控制开关。

7. 发明授权

US08791494B2 Light emitting device and light emitting device package 有权
公开(公告)号：US08791494B2
公开(公告)日：2014-07-29
申请号：US14055675
申请日：2013-10-16
申请人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
发明人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
IPC分类号： H01L33/00 , H01L33/36 , H01L33/44 , H01L33/40 , H01L33/42 , H01L33/10 , H01L33/22
CPC分类号： H01L33/44 , F21K9/23 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L33/0079 , H01L33/06 , H01L33/10 , H01L33/22 , H01L33/32 , H01L33/36 , H01L33/38 , H01L33/387 , H01L33/40 , H01L33/42 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/0002 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer, an adhesive layer contacting a top surface of the first conductive semiconductor layer, a first electrode contacting a top surface of the first conductive semiconductor and a top surface of the adhesive layer, and a second electrode contacting the second conductive semiconductor layer, wherein the adhesive layer contacting the first electrode is spaced apart from the second electrode.

8. 发明授权

US08791481B2 Light emitting device and manufacturing method for same 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US08791481B2
公开(公告)日：2014-07-29
申请号：US12936071
申请日：2009-04-01
申请人： June O Song
发明人： June O Song
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/0079 , H01L33/0095 , H01L33/08 , H01L33/145 , H01L33/387 , H01L33/44 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a support substrate, a reflective ohmic contact layer on the support substrate, a functional complex layer including a process assisting region and ohmic contact regions divided by the process assisting region on the reflective ohmic contact layer, and a light emitting semiconductor layer including a second conductive semiconductor layer, an active layer, and a first conductive semiconductor layer on each ohmic contact region.
摘要翻译：公开了一种发光器件及其制造方法。发光器件包括支撑衬底，支撑衬底上的反射欧姆接触层，包括由反射欧姆接触层上的工艺辅助区划分的工艺辅助区和欧姆接触区的功能复合层，以及发光半导体层，包括在每个欧姆接触区域上的第二导电半导体层，有源层和第一导电半导体层。

9. 发明授权

US08766287B2 Light emitting device, light emitting device package, and lighting device with the same 有权
标题翻译：发光装置，发光装置封装和照明装置
公开(公告)号：US08766287B2
公开(公告)日：2014-07-01
申请号：US13242345
申请日：2011-09-23
申请人： Ji Hyung Moon , Sang Youl Lee , Chung Song Kim , Kwang Ki Choi , June O Song
发明人： Ji Hyung Moon , Sang Youl Lee , Chung Song Kim , Kwang Ki Choi , June O Song
IPC分类号： H01L29/18 , H01L33/38 , H01L25/075 , H01L33/62 , H01L27/15 , H01L33/20 , F21K99/00
CPC分类号： H01L33/382 , F21K9/00 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/387 , H01L33/405 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2924/00
摘要： The present invention relates to a light emitting device, a light emitting device package, and a lighting device with the same.The light emitting device includes a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a second electrode layer formed on an underside of the light emitting structure connected to the second conductive type semiconductor layer electrically, a first electrode layer in contact with the first conductive type semiconductor layer passed through the second conductive type semiconductor layer and the active layer, and an insulating layer formed between the second electrode layer and the first electrode layer, between the second conductive type semiconductor layer and the first electrode layer, and between the active layer and the first electrode layer.
摘要翻译：本发明涉及一种发光器件，发光器件封装以及具有该发光器件的照明器件。发光器件包括：发光结构，包括第一导电类型半导体层，有源层和第二导电类型半导体层，形成在与第二导电类型半导体层连接的发光结构的下侧上的第二电极层与通过第二导电类型半导体层和有源层的第一导电类型半导体层接触的第一电极层和形成在第二电极层和第一电极层之间的绝缘层，在第二导电类型半导体层和第一电极层，以及有源层和第一电极层之间。

10. 发明授权

US08653547B2 Light emitting device and light emitting device package 有权
标题翻译：发光器件和发光器件封装
公开(公告)号：US08653547B2
公开(公告)日：2014-02-18
申请号：US12943628
申请日：2010-11-10
申请人： Hwan Hee Jeong , Sang Youl Lee , June O Song , Kwang Ki Choi
发明人： Hwan Hee Jeong , Sang Youl Lee , June O Song , Kwang Ki Choi
IPC分类号： H01L33/00
CPC分类号： H01L33/22 , H01L33/005 , H01L33/36 , H01L33/38 , H01L33/405 , H01L33/42 , H01L33/60 , H01L33/62 , H01L2224/45139 , H01L2224/48091 , H01L2924/12032 , H01L2933/0016 , H01L2924/00014 , H01L2924/00 , H01L2924/00011
摘要： Provided are a light emitting device and a light emitting device package. The light emitting device includes a first electrode, a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer on the first electrode, a second electrode on the light emitting structure, and a reflective member on at least lateral surface of the second electrode.
摘要翻译：提供了一种发光器件和发光器件封装。发光器件包括第一电极，在第一电极上包括第一半导体层，有源层和第二半导体层的发光结构，发光结构上的第二电极和至少侧向的反射构件第二电极的表面。

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