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1. 发明申请

US20080293332A1 POLISHING PAD AND METHOD OF POLISHING 失效
标题翻译：抛光垫和抛光方法
公开(公告)号：US20080293332A1
公开(公告)日：2008-11-27
申请号：US12126383
申请日：2008-05-23
申请人： Jun Watanabe , Tetsujiro Tada , Takashi Arahata , Jun Tamura , Moriaki Akazawa , Masaru Sakamoto , Takahiko Kawasaki
发明人： Jun Watanabe , Tetsujiro Tada , Takashi Arahata , Jun Tamura , Moriaki Akazawa , Masaru Sakamoto , Takahiko Kawasaki
IPC分类号： B24B1/00 , B24D11/00
CPC分类号： B24B37/26
摘要： A circular polishing pad has grooves formed on the surface in a spiral pattern with its center point offset from the center of the pad. The spiral pattern is an Archimedean spiral pattern or a parabolic spiral pattern. A target object is polished by using such a polishing pad without oscillating the platen to which the polishing pad is pasted or the polishing head that holds the target object.
摘要翻译：圆形抛光垫具有以螺旋形图案形成在其表面上的凹槽，其中心点偏离垫的中心。螺旋图案是阿基米德螺旋图案或抛物线螺旋图案。也就是说，通过使用这样的抛光垫，抛光目标物体，而不会使保持目标物体的抛光头摆动。

2. 发明授权

US07927187B2 Method of polishing a target surface 失效
标题翻译：抛光目标表面的方法
公开(公告)号：US07927187B2
公开(公告)日：2011-04-19
申请号：US12126383
申请日：2008-05-23
申请人： Jun Watanabe , Tetsujiro Tada , Takashi Arahata , Jun Tamura , Moriaki Akazawa , Masaru Sakamoto , Takahiko Kawasaki
发明人： Jun Watanabe , Tetsujiro Tada , Takashi Arahata , Jun Tamura , Moriaki Akazawa , Masaru Sakamoto , Takahiko Kawasaki
IPC分类号： B24B7/22
CPC分类号： B24B37/26
摘要： A circular polishing pad has grooves formed on the surface in a spiral pattern with its center point offset from the center of the pad. The spiral pattern is an Archimedean spiral pattern or a parabolic spiral pattern. A target object is polished by using such a polishing pad without oscillating the platen to which the polishing pad is pasted or the polishing head that holds the target object.
摘要翻译：圆形抛光垫具有以螺旋形图案形成在其表面上的凹槽，其中心点偏离垫的中心。螺旋图案是阿基米德螺旋图案或抛物线螺旋图案。也就是说，通过使用这样的抛光垫，抛光目标物体，而不会使保持目标物体的抛光头摆动。

3. 发明授权

US07241204B2 Polishing pad, method of producing same and method of polishing 失效
标题翻译：抛光垫，其制造方法和抛光方法
公开(公告)号：US07241204B2
公开(公告)日：2007-07-10
申请号：US11518065
申请日：2006-09-07
申请人： Jun Watanabe , Takuya Nagamine , Jun Tamura , Takashi Arahata
发明人： Jun Watanabe , Takuya Nagamine , Jun Tamura , Takashi Arahata
IPC分类号： B24B1/00
CPC分类号： B24B37/245 , B24D3/28
摘要： A polishing pad has a resin sheet having a flat surface and abrading particles fixed inside and on the surface of this resin sheet. Its tensile strength is in the range of 30 MPa or greater and 70 MPa or less and preferably in the range of 40 MPa or greater and 60 MPa or less. Its tensile tear elongation is in the range of 50% or less, preferably 20% or less and more preferably 5% or less. The average diameter of the primary particles of the abrading particles is in the range of 0.005 μm or greater and less than 0.5 μm, and preferably in the range of 0.005 μm or greater and 0.2 μm or less. The content of the abrading particles fixed to the resin sheet is 10 volume % or greater and 50 volume % or less, or preferably 10 volume % or greater and 24 volume or less.
摘要翻译：抛光垫具有平坦表面的树脂片和固定在该树脂片的内部和表面上的研磨颗粒。其拉伸强度为30MPa以上且70MPa以下，优选为40MPa以上且60MPa以下的范围。其拉伸撕裂伸长率为50％以下，优选为20％以下，更优选为5％以下。研磨颗粒的一次颗粒的平均直径在0.005μm以上且小于0.5μm的范围内，优选在0.005μm以上且0.2μm以下的范围内。固定在树脂片上的研磨粒子的含量为10体积％以上且50体积％以下，优选为10体积％以上且24体积以下。

4. 发明申请

US20070054600A1 Polishing pad, method of producing same and method of polishing 失效
标题翻译：抛光垫，其制造方法和抛光方法
公开(公告)号：US20070054600A1
公开(公告)日：2007-03-08
申请号：US11518065
申请日：2006-09-07
申请人： Jun Watanabe , Takuya Nagamine , Jun Tamura , Takashi Arahata
发明人： Jun Watanabe , Takuya Nagamine , Jun Tamura , Takashi Arahata
IPC分类号： B24B1/00 , B24B7/30 , B24D11/00
CPC分类号： B24B37/245 , B24D3/28
摘要： A polishing pad has a resin sheet having a flat surface and abrading particles fixed inside and on the surface of this resin sheet. Its tensile strength is in the range of 30MPa or greater and 70 MPa or less and preferably in the range of 40MPa or greater and 60MPa or less. Its tensile tear elongation is in the range of 50% or less, preferably 20% or less and more preferably 5% or less. The average diameter of the primary particles of the abrading particles is in the range of 0.005 μm or greater and less than 0.5 μm, and preferably in the range of 0.005 μm or greater and 0.2 μm or less. The content of the abrading particles fixed to the resin sheet is 10 volume % or greater and 50 volume % or less, or preferably 10 volume % or greater and 24 volume or less.
摘要翻译：抛光垫具有平坦表面的树脂片和固定在该树脂片的内部和表面上的研磨颗粒。其拉伸强度为30MPa以上且70MPa以下，优选为40MPa以上且60MPa以下的范围。其拉伸撕裂伸长率为50％以下，优选为20％以下，更优选为5％以下。研磨颗粒的一次颗粒的平均直径在0.005μm以上且小于0.5μm的范围内，优选在0.005μm以上且0.2μm以下的范围内。固定在树脂片上的研磨粒子的含量为10体积％以上且50体积％以下，优选为10体积％以上且24体积以下。

5. 发明申请

US20070264919A1 Polishing pad 审中-公开
标题翻译：抛光垫
公开(公告)号：US20070264919A1
公开(公告)日：2007-11-15
申请号：US11879413
申请日：2007-07-16
申请人： Toshihiro Kobayashi , Toshihiro Izumi , Jun Tamura , Takuya Nagamine , Takashi Arahata
发明人： Toshihiro Kobayashi , Toshihiro Izumi , Jun Tamura , Takuya Nagamine , Takashi Arahata
IPC分类号： B24D11/00
CPC分类号： B24B37/24
摘要： A polishing pad includes a main body having a polishing surface and a backing that is affixed to the back surface of the main body. The elasticity of the main body is within the range of 600 psi-16000 psi and preferably within the range of 1600 psi-16000 psi when a compressive pressure of 2 psi-16 psi is applied, and the thickness of the main body is within the range of 0.5 mm-3.0 mm. The elasticity of the backing is lower than that of the main body and exceeds 300 psi when a compressive pressure of 2 psi-16 psi is applied.
摘要翻译：抛光垫包括具有抛光表面的主体和固定到主体背面的背衬。当施加2psi-16psi的压缩压力时，主体的弹性在600psi-16000psi的范围内，优选在1600psi-16000psi的范围内，并且主体的厚度在范围为0.5 mm-3.0 mm。当施加2psi-16psi的压缩压力时，背衬的弹性低于主体的弹性并且超过300psi。

6. 发明申请

US20060229000A1 Polishing pad 审中-公开
标题翻译：抛光垫
公开(公告)号：US20060229000A1
公开(公告)日：2006-10-12
申请号：US11447425
申请日：2006-06-05
申请人： Toshihiro Izumi , Jun Tamura , Takuya Nagamine , Takashi Arahata
发明人： Toshihiro Izumi , Jun Tamura , Takuya Nagamine , Takashi Arahata
IPC分类号： B24B7/30 , B32B1/00 , B32B3/28
CPC分类号： B24B37/24 , Y10T428/24628 , Y10T428/24669
摘要： A polishing pad for planarizing the surface of a wafer has a planar main body of a non-foamed synthetic resin, having Shore D hardness of 66.0-78.5, preferably 70.0-78.5, or more preferably 70.0-78.0, compressibility of 4% or less or preferably 2% or less, and compression recovery rate of 50% or greater or preferably 70% or greater.
摘要翻译：用于平坦化晶片表面的抛光垫具有非发泡合成树脂的平面主体，肖氏D硬度为66.0-78.5，优选为70.0-78.5，更优选为70.0-78.0，压缩率为4％以下或优选为2％以下，压缩恢复率为50％以上，优选为70％以上。

7. 发明申请

US20070087668A1 Method of texturing magnetic hard disk substrate 审中-公开
标题翻译：磁性硬盘基板纹理方法
公开(公告)号：US20070087668A1
公开(公告)日：2007-04-19
申请号：US11543578
申请日：2006-10-04
申请人： Yasuyuki Yokota , Takashi Arahata , Hiromitsu Okuyama
发明人： Yasuyuki Yokota , Takashi Arahata , Hiromitsu Okuyama
IPC分类号： B24B7/30 , B24B1/00
CPC分类号： B24B21/04 , B24B19/028 , B24D11/00 , G11B5/82 , G11B5/8404
摘要： Texturing marks are formed on the surface of a substrate of a magnetic hard disk first by forming approximately concentric circular preliminary marks in a first step and then forming in a second step approximately concentric circular texturing marks on the surface of the substrate based on the preliminary marks formed in the first step. The surface after the texturing marks are formed in the second step has average surface roughness in the range of 1 Å or more and 6 Å or less and a ratio of maximum surface roughness to the average surface roughness in the range of less than 10. A foamed tape and a lubricant not containing any abrading particles are used in the second step. The foamed tape has a foamed layer having average diameter of air bubbles in the range of 1 μm or more and 50 μm or less, compressibility in the range of 3% or more and 7% or less, compression recovery ratio in the range of 40% or more and 60% or less, Shore D hardness in the range of 20 degrees or more and 30 degrees or less, and thickness in the range of 50 μm or more and 80 μm or less.
摘要翻译：首先通过在第一步骤中形成大致同心圆形的初步标记形成磁性硬盘的基板的表面上的纹理标记，然后基于初步标记在第二步骤中在基板的表面上形成大致同心的圆形纹理标记形成于第一步。在第二步骤中形成纹理标记之后的表面的平均表面粗糙度在1以上且6以下的范围内，最大表面粗糙度与平均表面粗糙度的比例在小于10的范围内。在第二步骤中使用发泡胶带和不含任何研磨颗粒的润滑剂。泡沫带具有气泡平均直径为1μm以上且50μm以下的发泡层，3％以上且7％以下的压缩率，压缩回复率在40以下％以上且60％以下的肖氏D硬度为20度以上且30度以下，厚度为50μm以上且80μm以下的厚度。

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