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    • 3. 发明授权
    • Semiconductor device with transistor and capacitor and its manufacture method
    • 具有晶体管和电容器的半导体器件及其制造方法
    • US07112839B2
    • 2006-09-26
    • US10845153
    • 2004-05-14
    • Jun LinToshiya SuzukiKatsuhiko Hieda
    • Jun LinToshiya SuzukiKatsuhiko Hieda
    • H01L27/108
    • H01L27/10852H01L21/31604H01L27/10894H01L28/40H01L28/55H01L28/90
    • On a semiconductor substrate, a transistor and a capacitor electrically connected to the transistor are formed, the capacitor having two electrodes made of metal and a capacitor dielectric layer between the two electrodes made of oxide dielectric material. A temporary protective film is formed over the capacitor, the temporary protective film covering the capacitor. The semiconductor substrate with the temporary protective film is subjected to a heat treatment in a reducing atmosphere. The temporary protective film is removed. The semiconductor substrate with the temporary protective film removed is subjected to a heat treatment in an inert gas atmosphere or in a vacuum state. A protective film is formed over the capacitor, the protective film covering the capacitor. With these processes, leak current of the capacitor can be reduced.
    • 在半导体衬底上,形成与晶体管电连接的晶体管和电容器,该电容器具有由金属制成的两个电极和由氧化物介电材料制成的两个电极之间的电容器电介质层。 在电容器上形成临时保护膜,临时保护膜覆盖电容器。 具有临时保护膜的半导体衬底在还原气氛中进行热处理。 移除临时保护膜。 将除去了临时保护膜的半导体基板在惰性气体气氛或真空状态下进行热处理。 在电容器上形成保护膜,保护膜覆盖电容器。 通过这些处理,可以减小电容器的漏电流。
    • 5. 发明授权
    • Semiconductor device and its manufacture
    • 半导体器件及其制造
    • US06835976B2
    • 2004-12-28
    • US10457535
    • 2003-06-10
    • Jun LinHiroshi MinakataAkihiro ShimadaToshiya SuzukiDaisuke Matsunaga
    • Jun LinHiroshi MinakataAkihiro ShimadaToshiya SuzukiDaisuke Matsunaga
    • H01L27108
    • H01L28/91H01L27/10852H01L28/55H01L28/60
    • A method of manufacturing a semiconductor device has the steps of: (a) forming a lower electrode made of rare metal above a semiconductor substrate; (b) depositing a capacitor dielectric film made of a high dielectric material or ferroelectric oxide on the lower electrode; (c) forming a laminated layer on the capacitor dielectric film, the laminated layer including an upper electrode layer made of rare metal and an adhesive layer with or without an SiO2 mask layer thoreon; (d) patterning the laminated layer; (e) chemically processing the patterned, laminated layer to remove a surface layer of the laminated layer; and (f) forming an interlayer insulating film over the semiconductor substrate, covering the chemically processed, laminated layer. An adhesion force between the rare metal layer and insulating layer can be increased.
    • 制造半导体器件的方法具有以下步骤:(a)在半导体衬底上形成由稀有金属制成的下电极; (b)在下电极上沉积由高介电材料或铁电氧化物制成的电容器电介质膜; (c)在电容器电介质膜上形成层压层,所述层叠层包括由稀有金属制成的上电极层和具有或不具有SiO 2掩模层的粘合剂层; (d)图案化层叠层; (e)化学处理图案化的层压层以去除层压层的表面层; 和(f)在半导体衬底上形成层间绝缘膜,覆盖化学处理层压层。 可以增加稀土金属层与绝缘层之间的粘附力。
    • 6. 发明授权
    • Semiconductor device and its manufacture
    • 半导体器件及其制造
    • US06602756B2
    • 2003-08-05
    • US09735477
    • 2000-12-14
    • Jun LinHiroshi MinakataAkihiro ShimadaToshiya SuzukiDaisuke Matsunaga
    • Jun LinHiroshi MinakataAkihiro ShimadaToshiya SuzukiDaisuke Matsunaga
    • H01L2120
    • H01L28/91H01L27/10852H01L28/55H01L28/60
    • A method of manufacturing a semiconductor device has the steps of: (a) forming a lower electrode made of rare metal above a semiconductor substrate; (b) depositing a capacitor dielectric film made of a high dielectric material or ferroelectric oxide on the lower electrode; (c) forming a laminated layer on the capacitor dielectric film, the laminated layer including an upper electrode layer made of rare metal and an adhesive layer with or without an SiO2 mask layer thereon; (d) patterning the laminated layer; (e) chemically processing the patterned, laminated layer to remove a surface layer of the laminated layer; and (f) forming an interlayer insulating film over the semiconductor substrate, covering the chemically processed, laminated layer. An adhesion force between the rare metal layer and insulating layer can be increased.
    • 制造半导体器件的方法具有以下步骤:(a)在半导体衬底上形成由稀有金属制成的下电极; (b)在下电极上沉积由高介电材料或铁电氧化物制成的电容器电介质膜; (c)在电容器电介质膜上形成叠层,层叠层包括由稀有金属制成的上电极层和其上具有或不具有SiO 2掩模层的粘合剂层; (d)图案化层叠层; (e)化学处理图案化的层压层以去除层压层的表面层; 和(f)在半导体衬底上形成层间绝缘膜,覆盖化学处理层压层。 可以增加稀土金属层与绝缘层之间的粘附力。
    • 8. 发明申请
    • Method and system for transmitting 3D picture in multimedia message service message
    • 用于在多媒体消息服务消息中传输3D图像的方法和系统
    • US20140375765A1
    • 2014-12-25
    • US14344940
    • 2011-11-01
    • Wen FangYongqi LiJun Lin
    • Wen FangYongqi LiJun Lin
    • H04W4/12H04N13/00
    • H04W4/12H04N13/178H04N13/194H04N21/235H04N21/431H04N21/435H04N21/4786H04N21/8153H04N21/8543
    • A method for transmitting a three-dimensional (3D) picture in an MMS message is disclosed. The method includes: in a Synchronized Multimedia Integration Language (SMIL) file, a sender assigns a same Identifier (ID) for two different pictures, sets an attribute of each of the two pictures as a 3D display picture, and sends the two pictures to a receiver; or, a sender synthesizes two different pictures in the SMIL file into a file, assigns an ID for the synthesized file, sets an attribute of the ID as a 3D display picture, and sends the synthesized file to a receiver; and the receiver displays the two pictures in a 3D mode. A system for transmitting a 3D picture in an MMS message is also disclosed. With the technical solution of the disclosure, the problem that transmission of a 3D picture cannot be supported in an existing protocol can be solved.
    • 公开了一种用于在MMS消息中发送三维(3D)图像的方法。 该方法包括:在同步多媒体集成语言(SMIL)文件中,发送者为两个不同的图片分配相同的标识符(ID),将两个图像中的每一个的属性设置为3D显示图像,并将两个图像发送到 接收器 或者,发送者将SMIL文件中的两个不同图片合成为文件,为合成文件分配ID,将ID的属性设置为3D显示图片,并将合成文件发送给接收者; 并且接收器以3D模式显示两张照片。 还公开了一种用于在MMS消息中发送3D图像的系统。 通过本公开的技术方案,可以解决现有协议中不能支持3D图像传输的问题。