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    • 3. 发明申请
    • Light emitting device and method for fabricating the same
    • 发光元件及其制造方法
    • US20060097274A1
    • 2006-05-11
    • US11267320
    • 2005-11-07
    • Hyun LeeJun Ha
    • Hyun LeeJun Ha
    • H01L33/00
    • H01L33/64H01L33/0079H01L33/20H01L33/46H01L2933/0075
    • A light emitting device and a method for fabricating the same according to the present invention are advantageous in that since an LLO (Laser Lift Off) process is performed using a thick metal film grown through a growth process, an occurrence rate of a void is remarkably decreased due to dense bonding between metals so that an occurrence rate of a crack can be decreased. Further, the present invention has an advantage in that a metal is filled in trench regions formed through an isolation process for devices, thereby protecting the devices and ensuring excellent heat dissipation. The present invention has a further advantage in that a reflective film is formed on inclined sidewalls of a device-forming thin film layer so that light loss through lateral sides of the device can be reduced, thereby improving optical properties.
    • 根据本发明的发光器件及其制造方法的优点在于,由于使用通过生长工艺生长的厚金属膜进行LLO(激光剥离)工艺,所以空隙的发生率显着地 由于金属之间的致密结合而降低,从而可以降低裂缝的发生率。 此外,本发明的优点在于,金属填充在通过器件的隔离工艺形成的沟槽区域中,从而保护器件并确保优异的散热。 本发明的另一个优点在于,在器件形成薄膜层的倾斜侧壁上形成反射膜,从而可以减少通过器件侧面的光损失,从而提高光学性能。