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1. 发明申请

US20070159801A1 Insert molded flexible circuit with stiffener and flip housing assembly and method of manufacture 审中-公开
标题翻译：嵌入式柔性电路与加强筋和翻盖外壳组件及其制造方法
公开(公告)号：US20070159801A1
公开(公告)日：2007-07-12
申请号：US11321289
申请日：2005-12-21
申请人： Julio Castaneda , Brian Belknap , Stephen Hunt , Francis Staszesky , William Steinhoff
发明人： Julio Castaneda , Brian Belknap , Stephen Hunt , Francis Staszesky , William Steinhoff
IPC分类号： H05K5/00
CPC分类号： H05K1/118 , H01R35/02 , H04M1/0214 , H05K3/0058 , H05K2201/2009 , H05K2203/1327
摘要： An electronic product (100) such as a phone includes a base housing assembly (102) and a flip housing assembly (40) coupled to the base housing assembly. The flip housing assembly includes a flexible circuit (10) having an appendage (14) having a hinge contact point, a stiffener (22) adhered to the flexible circuit, a hinge pin (32) formed by insert molding a substantial portion of the appendage to form a flexible circuit assembly (30), and an insert molded housing 42 molded about a substantial portion of the flexible circuit assembly. The base housing assembly and flip housing assembly can electronically couple via the portion of the hinge contact point that remains exposed. The flip housing assembly can include among a lens (52), a transducer (62), a bezel (72), a keypad (82) or a transducer grill (92) mounted on to the flexible circuit assembly.
摘要翻译：诸如电话的电子产品（100）包括底座壳体组件（102）和联接到基座壳体组件的翻盖壳体组件（40）。翻盖壳体组件包括具有附接件（14）的柔性电路（10），其具有铰链接触点，粘附到柔性电路的加强件（22），铰链销（32），其通过嵌入成型大部分附属物以形成柔性电路组件（30），以及围绕柔性电路组件的主要部分模制的插入模制外壳42。基座壳体组件和翻盖壳体组件可以通过保持暴露的铰链接触点的部分进行电子耦合。翻盖壳体组件可以包括安装在柔性电路组件上的透镜（52），换能器（62），边框（72），键盘（82）或换能器格栅（92）之间。

2. 发明申请

US20070263352A1 Plastics Utilizing Thermally Conductive Film 审中-公开
标题翻译：塑料使用导热膜
公开(公告)号：US20070263352A1
公开(公告)日：2007-11-15
申请号：US11383427
申请日：2006-05-15
申请人： Kinzy Jones , Christopher Bates , Brian Belknap , Emory Carroll
发明人： Kinzy Jones , Christopher Bates , Brian Belknap , Emory Carroll
IPC分类号： H05K7/20
CPC分类号： H05K7/20418
摘要： A device housing (105) and a method (500) of manufacturing the same. The method can include positioning within a mold (300) an insert (205) of thermally conductive film (210). For example, graphite film can be positioned within the mold. The graphite film can have a first thermal conductivity in an in-plane direction (215) and a second thermal conductivity in a normal direction (220) that is less than one-tenth the first thermal conductivity. For example, the graphite film can have a first thermal conductivity in an in-plane direction that is greater than about 150 W/m-K and a second thermal conductivity in a normal direction that is less than 15 W/m-K. An electronic circuit (400) including at least one thermal energy generator (405) can be positioned into the device housing. The thermal energy generator can be positioned proximate to the insert of thermally conductive film.
摘要翻译：一种装置外壳（105）及其制造方法（500）。该方法可以包括在模具（300）内定位导热膜（210）的插入件（205）。例如，石墨膜可以位于模具内。石墨膜可以在面内方向（215）上具有第一热导率，并且在正常方向（220）上具有小于第一热导率的十分之一的第二热导率。例如，石墨膜可以在面内方向上具有大于约150W / m-K的第一热传导率和小于15W / m-K的法向上的第二热导率。包括至少一个热能发生器（405）的电子电路（400）可以定位到装置壳体中。热能发生器可以靠近导热膜的插入件定位。

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