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    • 1. 发明授权
    • Semiconductor probe having embossed resistive tip and method of fabricating the same
    • 具有压电电阻端头的半导体探针及其制造方法
    • US07671616B2
    • 2010-03-02
    • US11772441
    • 2007-07-02
    • Ju-hwan JungJae-hong LeeHyung-cheol ShinJun-soo KimSeung-bum Hong
    • Ju-hwan JungJae-hong LeeHyung-cheol ShinJun-soo KimSeung-bum Hong
    • G01R31/02G01N23/00
    • G01Q60/30
    • A semiconductor probe having an embossed resistive tip and a method of fabricating the semiconductor probe are provided. The semiconductor probe includes a protrusion portion protruded to a predetermined height on a cantilever in a first direction crossing a length direction of the cantilever, an embossed resistive tip formed on the protrusion portion, and first and second semiconductor electrode regions formed at opposite sides of the embossed resistive tip at the protrusion portion, wherein the cantilever is doped with a first dopant, the first and second semiconductor electrode regions and the embossed resistive tip are doped with a second dopant having a different polarity from the first dopant, and the embossed resistive tip is doped with a concentration lower than the first and second semiconductor electrode regions.
    • 提供具有压花电阻端头的半导体探针和制造半导体探针的方法。 半导体探针包括突起部,该突起部在与悬臂的长度方向交叉的第一方向上在悬臂上突出规定的高度,形成在突出部上的压电电阻端子以及形成在突起部的相反侧的第一和第二半导体电极区域 在突出部分处的压电电阻尖端,其中所述悬臂掺杂有第一掺杂剂,所述第一和第二半导体电极区域和所述压电电阻尖端掺杂有与所述第一掺杂剂具有不同极性的第二掺杂剂,并且所述压花电阻尖端 掺杂浓度低于第一和第二半导体电极区域。