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1. 发明申请

US20120169447A1 NANOCOMPOSITE POWDER FOR INNER ELECTRODE OF MULTILAYER CERAMIC ELECTRONIC DEVICE AND FABRICATING METHOD THEREOF 审中-公开
标题翻译：用于多层陶瓷电子器件内电极的纳米复合粉末及其制造方法
公开(公告)号：US20120169447A1
公开(公告)日：2012-07-05
申请号：US13111270
申请日：2011-05-19
申请人： Ju Hwan YANG , Jeong Min Cho , Sung Kwon Wi , Ji Hwan Shin
发明人： Ju Hwan YANG , Jeong Min Cho , Sung Kwon Wi , Ji Hwan Shin
IPC分类号： H01F5/00 , H01B1/02 , B05D5/12
CPC分类号： H01B1/22 , H01F17/0013 , H01G4/008 , H01G4/30
摘要： There are disclosed a nanocomposite powder for an inner electrode of a multilayer ceramic electronic device and a manufacturing method thereof. The nanocomposite powder for an inner electrode of a multilayer ceramic electronic device includes a first metal particle having electrical conductivity, and a second metal coating layer formed on a top surface or a bottom surface of the first metal particle and having a higher melting point than that of the first metal particle.
摘要翻译：公开了一种用于多层陶瓷电子器件的内部电极的纳米复合粉末及其制造方法。用于多层陶瓷电子器件的内部电极的纳米复合粉末包括具有导电性的第一金属颗粒和形成在第一金属颗粒的顶表面或底表面上并且具有比其高的熔点的第二金属涂层的第一金属颗粒。

2. 发明申请

US20130241684A1 METHOD FOR MANUFACTURING COMMON MODE FILTER AND COMMON MODE FILTER 审中-公开
标题翻译：用于制造共模滤波器和共模滤波器的方法
公开(公告)号：US20130241684A1
公开(公告)日：2013-09-19
申请号：US13784310
申请日：2013-03-04
申请人： Ju Hwan YANG , Won Chul SIM , Young Seuck YOO , Sung Kwon WI
发明人： Ju Hwan YANG , Won Chul SIM , Young Seuck YOO , Sung Kwon WI
IPC分类号： H01F5/00 , H01F41/04
CPC分类号： H01F5/003 , H01F17/0013 , H01F41/042
摘要： Disclosed herein are a method for manufacturing common mode filter and a common mode filter. The method includes: performing electroplating on first coil patterns made of a conductive material to form second coil patterns having a cross-sectional area increased as compared to the first coil patterns. Therefore, the common mode filter fulfilling a miniaturization demand and having the improved characteristics such as the inductance, the DC resistance, and the like, may be implemented.
摘要翻译：这里公开了一种用于制造共模滤波器和共模滤波器的方法。该方法包括：在由导电材料制成的第一线圈图案上进行电镀以形成与第一线圈图案相比具有增加的横截面面积的第二线圈图案。因此，可以实现满足小型化需求并且具有改善的特性（例如电感，直流电阻等）的共模滤波器。

3. 发明申请

US20130014795A1 THERMOELECTRIC MODULE 审中-公开
标题翻译：热电模块
公开(公告)号：US20130014795A1
公开(公告)日：2013-01-17
申请号：US13473209
申请日：2012-05-16
申请人： Ju Hwan YANG , Dong Hyeok CHOI , Sung Ho LEE , Sung Kwon WI
发明人： Ju Hwan YANG , Dong Hyeok CHOI , Sung Ho LEE , Sung Kwon WI
IPC分类号： H01L35/28
CPC分类号： H01L35/30
摘要： Disclosed herein is a thermoelectric module. The thermoelectric module includes: an upper substrate and a lower substrate each having a plurality of grooves formed on one surface thereof; a plurality of heat radiation pads embedded in the plurality of grooves; a plurality of electrodes formed on surfaces of the plurality of heat radiation pads and corresponding to the plurality of heat radiation pads one by one; and thermoelectric elements including p-type elements and n-type elements and electrically connected to the plurality of electrodes. According to the present invention, the heat radiation pads are embedded in the respective grooves formed on the upper substrate and the lower substrate, thereby maximizing heat transfer efficiency, and functioning as an insulator for preventing an electric short between the substrates and the electrodes.
摘要翻译：这里公开了一种热电模块。该热电模块包括：上基板和下基板，每一个在其一个表面上具有多个槽; 嵌入在所述多个槽中的多个散热垫; 多个电极，形成在所述多个散热垫的表面上，并且一个接一个地对应于所述多个散热垫; 以及包括p型元件和n型元件并且电连接到多个电极的热电元件。根据本发明，散热垫嵌入形成在上基板和下基板上的相应凹槽中，从而最大限度地提高传热效率，并且用作用于防止基板和电极之间短路的绝缘体。

4. 发明申请

US20130081663A1 THERMOELECTRIC MODULE 审中-公开
标题翻译：热电模块
公开(公告)号：US20130081663A1
公开(公告)日：2013-04-04
申请号：US13620925
申请日：2012-09-15
申请人： Ju Hwan YANG , Kang Heon Hur , Sung Ho Lee , Dong Hyeok Choi
发明人： Ju Hwan YANG , Kang Heon Hur , Sung Ho Lee , Dong Hyeok Choi
IPC分类号： H01L35/32 , F25B21/02
CPC分类号： H01L35/32
摘要： The present invention relates to a thermoelectric module, there is provided a thermoelectric module including a metal layer surface treated for securing roughness at one surface thereof and a top substrate and a bottom substrate made of an insulating film formed on the surface treated one surface.
摘要翻译：热电模块技术领域本发明涉及一种热电模块，其特征在于，包括：金属层表面被处理以确保在其一个表面处的粗糙度的热电模块，以及在表面处理过的一个表面上形成的由绝缘膜形成的顶部基板和底部基板。

5. 发明申请

US20130074897A1 THERMOELECTRIC MODULE AND MANUFACTURING METHOD FOR THERMOELECTRIC MODULE 审中-公开
标题翻译：热电模块的热电模块和制造方法
公开(公告)号：US20130074897A1
公开(公告)日：2013-03-28
申请号：US13620898
申请日：2012-09-15
申请人： Ju Hwan YANG , Dong Hyeok Choi , Sung Ho Lee
发明人： Ju Hwan YANG , Dong Hyeok Choi , Sung Ho Lee
IPC分类号： H01L35/28 , H01L35/34
CPC分类号： H01L35/32 , H01L35/34
摘要： The present invention is related to a thermoelectric module and a method for manufacturing the same. The thermoelectric module includes a substrate, a bottom electrode and a thermoelectric semiconductor. The thermoelectric module further includes an insulating layer integrally formed on a whole exposed surface of the bottom electrode, a portion of exposed surface of the thermoelectric semiconductor and a portion of exposed surface of the substrate; a contact hole provided in the insulating layer to expose a portion of a top surface of the thermoelectric semiconductor; and a top electrode to electrically connect at least two thermoelectric semiconductors by being formed on a surface of at least two thermoelectric semiconductors exposed by the contact hole and a portion of a top surface of the insulating layer.
摘要翻译：本发明涉及一种热电模块及其制造方法。热电模块包括基板，底部电极和热电半导体。热电模块还包括整体形成在底部电极的整个暴露表面上的绝缘层，热电半导体的暴露表面的一部分和基板的暴露表面的一部分; 设置在所述绝缘层中以暴露所述热电半导体的顶表面的一部分的接触孔; 以及顶部电极，其通过形成在由接触孔暴露的至少两个热电半导体的表面和绝缘层的顶表面的一部分上而形成在至少两个热电半导体上。

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