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    • 2. 发明授权
    • Microwave field effect transistor structure on silicon carbide substrate
    • 微波场效应晶体管结构在碳化硅衬底上
    • US06521923B1
    • 2003-02-18
    • US10156221
    • 2002-05-25
    • Pablo D'AnnaJoseph H. Johnson
    • Pablo D'AnnaJoseph H. Johnson
    • H01L31119
    • H01L29/41766H01L21/743H01L23/552H01L29/0847H01L29/1608H01L29/402H01L29/4175H01L29/7835H01L2924/0002H01L2924/00
    • A microwave transistor structure comprising: (a) a SiC substrate having a top surface; (b) a silicon semiconductor material of a first conductivity type overlaying the top surface of the semiconductor substrate and having a top surface; (c) a conductive gate overlying and insulated from the top surface of the silicon semiconductor material; (d) a channel region of the first conductivity type formed completely within the silicon semiconductor material including a channel dopant concentration; (e) a drain region of the second conductivity type formed in the silicon semiconductor material and contacting the channel region; (f) a body region of the first conductivity type and having a body region dopant concentration formed in the silicon semiconductor material under the conductive gate region; (g) a source region of the second conductivity type and having a source region dopant concentration formed in the silicon semiconductor material within the body region; (h) a shield plate region being adjacent and being parallel to the drain region formed on the top surface of the silicon semiconductor material over a portion of the channel region; wherein the shield plate region is adjacent and parallel to the conductive gate region; and wherein the shield plate extends above the top surface of the silicon semiconductor material to a shield plate height level, and is insulated from the top-surface of the silicon semiconductor material; and (i) a conductive plug region formed in the body region of the silicon semiconductor material to connect a lateral surface of the body region to the top surface of the substrate.
    • 一种微波晶体管结构,包括:(a)具有顶表面的SiC衬底; (b)覆盖半导体衬底的顶表面并具有顶表面的第一导电类型的硅半导体材料; (c)覆盖并与硅半导体材料的顶表面绝缘的导电栅极; (d)在包含沟道掺杂剂浓度的硅半导体材料内完全形成第一导电类型的沟道区; (e)形成在硅半导体材料中并与沟道区接触的第二导电类型的漏极区; (f)第一导电类型的体区,并且在导电栅区下形成在硅半导体材料中的体区掺杂浓度; (g)第二导电类型的源区,并且具有在体区内的硅半导体材料中形成的源区掺杂浓度; (h)屏蔽板区域,其与所述沟道区域的一部分上形成在所述硅半导体材料的顶表面上的所述漏极区域相邻并平行; 其中所述屏蔽板区域与所述导电栅极区域相邻并平行; 并且其中所述屏蔽板在所述硅半导体材料的顶表面上方延伸到屏蔽板高度水平面,并且与所述硅半导体材料的顶表面绝缘; 以及(i)形成在硅半导体材料的主体区域中的导电插塞区域,以将本体区域的侧表面连接到衬底的顶表面。
    • 4. 发明授权
    • Modular poultry automatic vaccine injection and spray apparatus
    • 模块化家禽自动疫苗注射和喷雾装置
    • US5312353A
    • 1994-05-17
    • US36462
    • 1993-03-24
    • Gregory D. BoggessJoseph H. JohnsonRichard M. KightJohn D. MasonRoger D. Luke
    • Gregory D. BoggessJoseph H. JohnsonRichard M. KightJohn D. MasonRoger D. Luke
    • A61D1/02A61M5/20A61D7/00
    • A61D1/025
    • A modular poultry automatic injection and spraying apparatus (10) featuring a dual-sensor switch means (41) and a dual-action, fluid-actuated drive means (101) is disclosed. The apparatus has a casing construction (11) including an upper housing (12) mounted on a lower housing (13) such that the lower housing (13), which contains water-sensitive pneumatic logic circuitry (261), can be easily removed prior to cleaning. The casing construction (11) has the additional advantage of allowing substitute upper and lower housings (12, 13) to be interchanged during maintenance and repair. The dual sensor switch means (41) ensures that the injections are performed accurately and consistently. The dual-action, fluid-actuated drive means (101) allows for the simultaneous injection and spraying functions of the apparatus (10) obviating the need for an additional apparatus or separate compressed air signal. The apparatus (10) also features a compressed air flushing system which prevents the switch means (41) from clogging, and periodically flushes contaminants from the lower housing (13), using exhaust from an alarm means (71), which notifies an operator of a complete run. Additionally, a separation means (21) prevents chicks,y missed by the apparatus (10) due to operator error, from mixing with chicks already inoculated by the apparatus (10).
    • 公开了一种具有双传感器开关装置(41)和双作用流体致动驱动装置(101)的模块化家禽自动喷射和喷涂装置(10)。 该装置具有壳体结构(11),其包括安装在下壳体(13)上的上壳体(12),使得包含水敏气动逻辑电路(261)的下壳体(13)可以容易地先除去 清洗。 壳体结构(11)具有允许在维护和修理期间更换替换的上壳体和下壳体(12,13)的附加优点。 双传感器开关装置(41)确保注射被精确且一致地执行。 双作用流体致动驱动装置(101)允许装置(10)的同时喷射和喷射功能,从而避免需要附加装置或单独的压缩空气信号。 该设备(10)还具有压缩空气冲洗系统,其防止开关装置(41)堵塞,并且使用来自报警装置(71)的排气周期性地从下壳体(13)冲洗污染物,该报警装置(71)通知操作者 一个完整的运行。 此外,分离装置(21)防止由于操作者错误而被设备(10)错过的与由已经由设备(10)接种的小鸡混合的小鸡。
    • 5. 发明授权
    • Temperature compensating transistor bias device
    • 温度补偿晶体管偏置器件
    • US4242598A
    • 1980-12-30
    • US511882
    • 1974-10-02
    • Joseph H. JohnsonLee B. Max
    • Joseph H. JohnsonLee B. Max
    • H03F1/30H03F3/04
    • H03F1/302H01L2224/48091H01L2924/3011
    • The base-to-emitter bias voltage and current of a high frequency transistor, operating class AB or class A, is derived from a semiconductive bias device consisting of a semiconductive diode junction fed with current from a constant current source to derive a V.sub.BE voltage thereacross which is the bias source voltage. This source voltage is applied across the base-to-emitter junction of the RF transistor via the intermediary of a positive temperature coefficient silicon resistor. The diode and silicon resistor are packaged together for mounting on a heat sink common to the transistor, whereby the transistor is compensated for temperature dependent changes in V.sub.BE and h.sub.FE.
    • 来自由半导体偏置装置组成的半导体偏置装置的高频晶体管的基极 - 发射极偏置电压和电流由一个半导体二极管结组成,该半导体二极管结馈入来自恒流源的电流,从而导出其中的VBE电压 这是偏压源电压。 该源极电压通过正温度系数硅电阻的中间施加在RF晶体管的基极到发射极结两端。 二极管和硅电阻器封装在一起,用于安装在晶体管公共的散热片上,由此补偿晶体管与VBE和hFE中的温度相关的变化。
    • 8. 发明授权
    • High performance active and passive structures based on silicon material bonded to silicon carbide
    • 基于与碳化硅结合的硅材料的高性能主动和被动结构
    • US08080826B1
    • 2011-12-20
    • US10656613
    • 2003-09-04
    • Joseph H. JohnsonPablo D'Anna
    • Joseph H. JohnsonPablo D'Anna
    • H01L31/0256
    • H01L21/2007H01L21/8213H01L27/0635
    • The present invention discloses and claims the Silicon Carbide based Silicon structure comprising: (1) a Silicon Carbide substrate, (2) a Silicon semiconductor material having a top surface, and either bonded to the Silicon Carbide substrate via the bonding layer, or epitaxially grown on the Silicon Carbide substrate; and (3) at least one separation plug formed in the Silicon semiconductor material. The single bonding layer, or either layer of the double bonding layer, is selected from the group consisting of: {a Silicon dioxide layer; a Silicon layer; a carbon layer; a Silicon germanium (SiGe) layer; a tungsten silicide layer; a titanium suicide layer; and a cobalt silicide layer}. The separation plug extends from the top surface of the Silicon semiconductor material into the Silicon Carbide substrate at a separation plug depth level, and is configured to block the coupling between at least two adjacent active/passive structures formed in the Silicon semiconductor material.
    • 本发明公开并要求所述的基于碳化硅的硅结构,其包括:(1)碳化硅基板,(2)具有顶表面的硅半导体材料,以及经由所述接合层与所述碳化硅基板结合或外延生长 在碳化硅基板上; 和(3)形成在硅半导体材料中的至少一个分离塞。 单键合层或双键合层的任一层选自:{二氧化硅层; 硅层; 碳层; 硅锗(SiGe)层; 硅化钨层; 钛硅化物层; 和硅化钴层}。 分离塞以分离塞深度水平从硅半导体材料的顶表面延伸到碳化硅衬底中,并且被配置为阻挡形成在硅半导体材料中的至少两个相邻的主动/被动结构之间的耦合。
    • 9. 发明授权
    • Microwave transistor structure having step drain region
    • 具有阶跃漏极区域的微波晶体管结构
    • US06838731B1
    • 2005-01-04
    • US10410908
    • 2003-04-09
    • Pablo D'AnnaJoseph H. Johnson
    • Pablo D'AnnaJoseph H. Johnson
    • H01L29/06H01L29/08H01L29/417H01L29/76H01L29/78
    • H01L29/41766H01L29/0657H01L29/0847H01L29/402H01L29/4175H01L29/7835
    • A microwave transistor structure having a step drain region comprising: (A) a substrate having a top surface; (B) a silicon semiconductor material of a first conductivity type, having a first dopant concentration and a top surface; (C) a conductive gate overlying and insulated from the top surface of the silicon semiconductor material; (D) at least one horizontal drain extension region of a second conductivity type and having a horizontal drain extension dopant concentration; (E) a step drain region formed in the silicon semiconductor material, and contacting the horizontal drain extension region; (F) a body region of the first conductivity type and having a body region dopant concentration; (G) a source region of the second conductivity type and having a source region dopant concentration; (H) a shield plate region formed on the top surface of the silicon semiconductor material over a portion of the horizontal drain extension region, the shield plate being adjacent and parallel to the horizontal drain extension region; the shield plate being adjacent and parallel to the conductive gate region; and (I) a conductive plug region.
    • 一种具有阶跃漏极区域的微波晶体管结构,包括:(A)具有顶表面的衬底; (B)具有第一掺杂剂浓度和顶表面的第一导电类型的硅半导体材料; (C)覆盖并与硅半导体材料的顶表面绝缘的导电栅极; (D)至少一个第二导电类型的水平漏极延伸区域并具有水平漏极延伸掺杂剂浓度; (E)形成在所述硅半导体材料中并与所述水平漏极延伸区域接触的阶跃漏极区域; (F)具有第一导电类型并具有体区掺杂浓度的体区; (G)第二导电类型的源极区域,并具有源极区掺杂剂浓度; (H)在所述水平漏极延伸区域的一部分上形成在所述硅半导体材料的顶表面上的屏蔽板区域,所述屏蔽板与所述水平漏极延伸区域相邻并平行; 所述屏蔽板与所述导电栅极区域相邻并平行; 和(I)导电塞区域。
    • 10. 发明授权
    • Microwave field effect transistor structure
    • 微波场效应晶体管结构
    • US06831332B2
    • 2004-12-14
    • US10156605
    • 2002-05-25
    • Pablo D'AnnaJoseph H. Johnson
    • Pablo D'AnnaJoseph H. Johnson
    • H01L2976
    • H01L29/7835H01L29/0847H01L29/402H01L29/41766H01L2924/0002H01L2924/00
    • A microwave transistor structure comprising: (1) a substrate having a top surface; (2) a silicon semiconductor material of a first conductivity type; (3) a conductive gate; (4) a channel region of a second conductivity type; (5) a drain region of the second conductivity type; (6) a body of the first conductivity type; (7) a source region of the second conductivity type; (8) a shield plate region formed on the top surface of the silicon semiconductor material over a portion of the channel region, wherein the shield plate is adjacent and parallel to the drain region, and to the conductive gate region; and (9) a conductive plug region formed in the body region of the silicon semiconductor material, wherein the conductive plug region connects a lateral surface of the body region to the top surface of the substrate.
    • 一种微波晶体管结构,包括:(1)具有顶表面的衬底; (2)第一导电类型的硅半导体材料; (3)导电栅极; (4)第二导电类型的沟道区; (5)第二导电类型的漏区; (6)第一导电类型的主体; (7)第二导电类型的源极区; (8)在所述沟道区域的一部分上形成在所述硅半导体材料的上表面上的屏蔽板区域,其中所述屏蔽板与所述漏极区域相邻并且平行于所述导电栅极区域; 以及(9)形成在硅半导体材料的主体区域中的导电插塞区域,其中导电插塞区域将本体区域的侧表面连接到衬底的顶表面。