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1. 发明授权

US4512963A Palladium compound synthesis procedure 失效
标题翻译：钯化合物合成程序
公开(公告)号：US4512963A
公开(公告)日：1985-04-23
申请号：US620671
申请日：1984-06-14
申请人： Joseph A. Abys , Yutaka Okinaka
发明人： Joseph A. Abys , Yutaka Okinaka
IPC分类号： C25D3/52
CPC分类号： C25D3/52
摘要： The invention is a process for electroplating palladium in which at least part of the palladium in the electroplating bath is added as a palladium ammine hydroxide. Both the solid form and solution form of palladium ammine hydroxide are useful in supplying palladium to the palladium electroplating bath. Both solution and crystals are chemically stable and can be stored for long periods of time. Further, use of the palladium ammine hydroxide compounds permit replenishment without accumulation of undesirable ions in the bath and also neutralizes hydrogen ions formed in the plating process.
摘要翻译：本发明是用于电镀钯的方法，其中将电镀浴中的至少一部分钯作为氢氧化钯加入。钯氢氧化铵的固体形式和溶液形式均可用于向钯电镀浴提供钯。溶液和晶体都是化学稳定的，可以长时间储存。此外，使用氢氧化钯钯化合物允许补充，而不会在浴中积累不期望的离子，并且还中和镀覆过程中形成的氢离子。

2. 发明授权

US4493754A Electrodes for palladium electroplating process 失效
标题翻译：电镀钯电镀工艺
公开(公告)号：US4493754A
公开(公告)日：1985-01-15
申请号：US567348
申请日：1983-12-30
申请人： Joseph A. Abys , Yutaka Okinaka
发明人： Joseph A. Abys , Yutaka Okinaka
IPC分类号： C25D3/52 , C25D17/10
CPC分类号： C25D17/10 , C25D3/52
摘要： A palladium electroplating process is described in which certain unique anode structures are used. These anodes have surfaces made of conducting ferrites such as nickel ferrite. Such anodes have low oxygen overvoltage, high chemical stability and minimum decomposition of complexing agent in the palladium electroplating bath.
摘要翻译：描述了使用某些独特的阳极结构的钯电镀工艺。这些阳极具有由铁氧体形成的表面，例如镍铁氧体。这种阳极在钯电镀浴中具有低氧过电压，高化学稳定性和络合剂的最小分解。

3. 发明授权

US4468296A Process for electroplating palladium 失效
标题翻译：电镀钯的方法
公开(公告)号：US4468296A
公开(公告)日：1984-08-28
申请号：US448514
申请日：1982-12-10
申请人： Joseph A. Abys , Yutaka Okinaka
发明人： Joseph A. Abys , Yutaka Okinaka
IPC分类号： C25D3/52
CPC分类号： C25D3/52
摘要： The invention is a process for electroplating palladium in which at least part of the palladium in the electroplating bath is added as a palladium ammine hydroxide. Both the solid form of and solution form of palladium ammine hydroxide are useful in supplying palladium to the palladium electroplating bath. Both solution and crystals are chemically stable and can be stored for long periods of time. Further, use of the palladium ammine hydroxide compounds permit replenishment without accumulation of undesirable ions in the bath and also neutralizes hydrogen ions formed in the plating process.
摘要翻译：本发明是用于电镀钯的方法，其中将电镀浴中的至少一部分钯作为氢氧化钯加入。钯氢氧化铵的固体形式和溶液形式都可用于向钯电镀浴提供钯。溶液和晶体都是化学稳定的，可以长时间储存。此外，使用氢氧化钯钯化合物允许补充，而不会在浴中积累不期望的离子，并且还中和镀覆过程中形成的氢离子。

4. 发明授权

US3992152A Gold plating test procedure 失效
标题翻译：镀金试验程序
公开(公告)号：US3992152A
公开(公告)日：1976-11-16
申请号：US682323
申请日：1976-05-03
申请人： Yutaka Okinaka , Miles Vincent Sullivan
发明人： Yutaka Okinaka , Miles Vincent Sullivan
IPC分类号： C25D3/48 , G01N33/20
CPC分类号： C25D3/48
摘要： A process is described for making devices with gold plated surfaces in which a procedure is carried out to determine if visual defects in the gold plated surface have exposed base metal. This procedure is advantageous because defects with exposed base metal are detrimental to device reliability and longevity.
摘要翻译：描述了一种用于制造具有镀金表面的器件的过程，其中执行过程以确定镀金表面中的视觉缺陷是否具有暴露的基底金属。该方法是有利的，因为暴露的贱金属的缺陷对器件的可靠性和使用寿命是不利的。

5. 发明授权

US4349411A Etch procedure for aluminum alloy 失效
标题翻译：铝合金蚀刻程序
公开(公告)号：US4349411A
公开(公告)日：1982-09-14
申请号：US308270
申请日：1981-10-05
申请人： Yutaka Okinaka
发明人： Yutaka Okinaka
IPC分类号： C23F1/36 , H01F41/34 , H01L21/3213 , C23F1/00 , C23F1/02
CPC分类号： H01F41/34 , C23F1/36 , H01L21/32134
摘要： A process is described for making devices with aluminum-copper alloy in which the aluminum-copper alloy is etched in a basic solution. This procedure is particularly applicable to memory devices and bubble memory devices containing magnetic material (i.e., permalloy) where acid etches cannot be used. Excellent results are obtained with the basic etching solution. In particular the aluminum-copper alloy is completely removed and etching rates are sufficiently fast for commercial manufacturing operations.
摘要翻译：描述了一种用于制造铝 - 铜合金的装置的方法，其中铝 - 铜合金在碱性溶液中被蚀刻。该方法特别适用于含有不能使用酸蚀刻的磁性材料（即坡莫合金）的存储器件和气泡存储器件。使用基本的蚀刻溶液获得了很好的效果。特别地，铝 - 铜合金被完全去除，并且对于商业制造操作，蚀刻速率足够快。

6. 发明授权

US4340451A Method of replenishing gold/in plating baths 失效
标题翻译：补充金/电镀液的方法
公开(公告)号：US4340451A
公开(公告)日：1982-07-20
申请号：US104181
申请日：1979-12-17
申请人： Yutaka Okinaka , Catherine Wolowodiuk
发明人： Yutaka Okinaka , Catherine Wolowodiuk
IPC分类号： C25D21/18 , C25D3/48
CPC分类号： C25D21/18 , Y10S204/13
摘要： The gold content of a gold plating bath is replenished by circulating the plating solution through an AuCN containing vessel. The plating solution contains sufficient free cyanide to render the gold soluble by producing the soluble Au(CN).sub.2.sup.- ion.
摘要翻译：通过使镀覆溶液通过含有AuCN的容器循环来补充金镀液的金含量。电镀溶液含有足够的游离氰化物以通过产生可溶性Au（CN）2 - 离子使金溶解。

7. 发明授权

US4469564A Copper electroplating process 失效
标题翻译：铜电镀工艺
公开(公告)号：US4469564A
公开(公告)日：1984-09-04
申请号：US407151
申请日：1982-08-11
申请人： Yutaka Okinaka , Craig G. Smith , Lawrence E. Smith
发明人： Yutaka Okinaka , Craig G. Smith , Lawrence E. Smith
IPC分类号： C25D3/38 , C25D17/10 , C25D21/12 , H05K3/24 , C25D7/00
CPC分类号： C25D3/38 , C25D17/10 , C25D21/12 , H05K3/241
摘要： A copper electroplating process is described in which the anode is surrounded by a cation-permeable membrane so as to prevent decomposition of additives in the electrochemical bath. Such a feature adds to bath lifetime and permits better control of bath chemistry and plating quality during the electroplating process. The feature is especially advantageous for copper electroplating processes using nonconsumable electrodes because of the high consumption of additives and that the copper can be added to the cathode side of the membrane so that acid copper ions need not pass through the membrane.
摘要翻译：描述了一种铜电镀工艺，其中阳极被阳离子可渗透膜包围，以防止电化学浴中的添加剂分解。这样的特征增加了浴的寿命，并且允许在电镀过程中更好地控制浴化学和电镀质量。该特征对于使用非消耗性电极的铜电镀工艺是特别有利的，因为添加剂的消耗量高，并且可以将铜添加到膜的阴极侧，使得酸性铜离子不需要通过膜。

8. 发明授权

US4437948A Copper plating procedure 失效
标题翻译：镀铜工艺
公开(公告)号：US4437948A
公开(公告)日：1984-03-20
申请号：US312266
申请日：1981-10-16
申请人： Yutaka Okinaka , Craig G. Smith , Lawrence E. Smith
发明人： Yutaka Okinaka , Craig G. Smith , Lawrence E. Smith
IPC分类号： C25D3/38 , C25D17/10
CPC分类号： C25D17/10 , C25D3/38
摘要： A process is described for the electrodepositon of copper on various surfaces. The process involves use of a nonconsumable counterelectrode. Of particular significance is the composition of the surface of the counterelectrode. The surface of the counterelectrode comprises iridium oxide and tantalum oxide. Such processes can be carried out at high speeds, with smaller and more efficient equipment and can use various copper compounds as a source of copper.
摘要翻译：对于各种表面上的铜的电沉积描述了一种方法。该过程涉及使用非消耗性反电极。特别重要的是反电极表面的组成。反电极的表面包括氧化铱和氧化钽。这种方法可以高速进行，具有更小和更有效的设备，并且可以使用各种铜化合物作为铜源。

9. 发明申请

US20070095440A1 Plated film of gold-cobalt amorphous alloy, electroplating bath, and method for electroplating 失效
标题翻译：金 - 钴非晶合金镀膜，电镀浴，电镀方法
公开(公告)号：US20070095440A1
公开(公告)日：2007-05-03
申请号：US11529537
申请日：2006-09-29
申请人： Kazutaka Senda , Masaru Kato , Tetsuya Osaka , Yutaka Okinaka
发明人： Kazutaka Senda , Masaru Kato , Tetsuya Osaka , Yutaka Okinaka
IPC分类号： C22C45/00 , C22C5/02
CPC分类号： C22C5/02 , B32B15/018 , C22C9/00 , C22C45/003 , C22C45/02 , C25D3/562 , C25D3/62 , C25D7/00 , H01H1/023 , H01R13/03 , H05K3/244
摘要： A gold-cobalt based amorphous alloy plated film consisting of a homogeneous amorphous phase not having microcrystals is formed by electroplating conducted by use of an electroplating bath containing a gold cyanide salt in a concentration of 0.01 to 0.1 mol/dm3 in terms of gold, a cobalt salt in a concentration of 0.02 to 0.2 mol/dm3 in terms of cobalt, and a tungstate in a concentration of 0.1 to 0.5 mol/dm3 in terms of tungsten. The gold-cobalt based amorphous alloy plated film obtained consists of a homogeneous amorphous phase not having microcrystals, and has an enhanced hardness while retaining the good contact resistance and chemical stability intrinsic of gold on such levels as to be free of problems on a practical use basis; therefore, the gold-cobalt based amorphous alloy plated film is effective for use as a contact material in electric and electronic component parts such as relays.
摘要翻译：通过使用含有浓度为0.01〜0.1mol / dm 3的金氰化物盐的电镀浴进行电镀，形成由不具有微晶的均匀非晶相组成的金钴系非晶合金镀膜， SUP>以金为基准，钴浓度为0.02〜0.2mol / dm 3的钴盐，钴浓度为0.1〜0.5mol / dm 3的钨酸盐以钨为主。获得的金 - 钴基非晶态合金镀膜由不具有微晶的均匀非晶相组成，并且具有增强的硬度，同时保持金的良好接触电阻和化学稳定性，使得在实际使用中没有问题基础; 因此，金钴系非晶合金镀膜可以有效地用作电气和电子部件如继电器中的接触材料。

10. 发明授权

US5384153A Monitoring electroless plating baths 失效
标题翻译：监控化学镀浴
公开(公告)号：US5384153A
公开(公告)日：1995-01-24
申请号：US28847
申请日：1993-03-10
申请人： Alfred J. Grady, Jr. , Sudarshan Lal , Mary J. Mitchell , Yutaka Okinaka , Craig G. Smith , Harvey S. Trop , Chwan-Tsann Wang
发明人： Alfred J. Grady, Jr. , Sudarshan Lal , Mary J. Mitchell , Yutaka Okinaka , Craig G. Smith , Harvey S. Trop , Chwan-Tsann Wang
IPC分类号： C23C18/31 , C23C18/16 , G01N21/75 , H05K3/18 , H05K3/42 , B05D1/00
CPC分类号： C23C18/1683 , C23C18/1675 , H05K3/187
摘要： Disclosed is a method of monitoring electroless plating solutions. The solutions are used to plate a light-transmitting medium. Measurements are made to determine the time it takes for light transmission through the medium to be reduced to a certain level. This measurement can be used to determine whether articles will be sufficiently plated by the solutions.
摘要翻译：公开了一种监测化学镀溶液的方法。解决方案用于平板透光介质。进行测量以确定通过介质的光透射所需的时间减少到一定水平。该测量可用于确定物品是否将被溶液充分镀覆。

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