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    • 6. 发明申请
    • METHODS OF FABRICATING CMOS IMAGE SENSORS
    • 制作CMOS图像传感器的方法
    • US20080182354A1
    • 2008-07-31
    • US11950249
    • 2007-12-04
    • Jong-Jin LeeJu-Hyun KoJong-Eun ParkHyun-Suk KimDong-Yoon Jang
    • Jong-Jin LeeJu-Hyun KoJong-Eun ParkHyun-Suk KimDong-Yoon Jang
    • H01L31/18
    • H01L27/14643H01L27/14603H01L27/1463H01L27/14681H01L27/14689
    • CMOS image sensors and related methods of fabricating CMOS image sensors are disclosed. Fabrication of a CMOS image sensor can include forming a first impurity region having a first conductivity type in a semiconductor substrate. A second impurity region having a second conductivity type is formed in the semiconductor substrate adjacent to the first impurity region. A third impurity region having the first conductivity type is formed in the semiconductor substrate and located below the second impurity region. A transfer gate is formed on the semiconductor substrate and at least partially overlaps the first, second, and third impurity regions. A photo sensitive device is formed in the semiconductor substrate and adjacent to one side of the transfer gate. A floating diffusion region is formed in the semiconductor substrate and located adjacent to an opposite side of the transfer gate from the photosensitive device.
    • 公开了CMOS图像传感器和制造CMOS图像传感器的相关方法。 CMOS图像传感器的制造可以包括在半导体衬底中形成具有第一导电类型的第一杂质区域。 在与第一杂质区相邻的半导体衬底中形成具有第二导电类型的第二杂质区。 具有第一导电类型的第三杂质区形成在半导体衬底中并位于第二杂质区的下方。 传输栅极形成在半导体衬底上并且至少部分地与第一,第二和第三杂质区重叠。 光敏元件形成在半导体衬底中并与传输门的一侧相邻。 浮动扩散区域形成在半导体衬底中并且位于与传感栅极的与光敏器件相反的一侧。