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1. 发明授权

US06822258B2 Self-organized nanometer interface structure and its applications in electronic and opto-electronic devices 失效
公开(公告)号：US06822258B2
公开(公告)日：2004-11-23
申请号：US10377693
申请日：2003-03-04
申请人： Jong-Hong Lu , Huai-Luh Chang , Chiung-Hsiung Chen , Yi-Ping Huang , Sheng-Ju Liao , Yuh-Fwu Chou , Ho-Yin Pun
发明人： Jong-Hong Lu , Huai-Luh Chang , Chiung-Hsiung Chen , Yi-Ping Huang , Sheng-Ju Liao , Yuh-Fwu Chou , Ho-Yin Pun
IPC分类号： H01L2912
CPC分类号： B82Y30/00 , B82Y10/00 , H01L21/2855 , H01L29/861
摘要： A self-organized nanometer interface structure is disclosed. During the reactive sputtering process, the chemical dynamics difference among reactants induces self-organization to form a special nanometer interface structure. The nanometer interface structure naturally form an interface potential difference so that it has a rectifying effect in a particular range of potential variation range. Therefore, it functions like a diode. Such a self-organized nanometer interface structure can be used in the manufacturing of diodes, transistors, light-emitting devices, and sonic devices. The invention has the advantages of a wide variety of material selections, highly compatible processes, easy operations, and low-cost fabrications.

2. 发明申请

US20100116893A1 RFID TAG 有权
标题翻译： RFID标签
公开(公告)号：US20100116893A1
公开(公告)日：2010-05-13
申请号：US12506367
申请日：2009-07-21
申请人： Jiun-Jang Yu , Hsin-Hsien Yeh , Hong-Ching Lin , Chiung-Hsiung Chen
发明人： Jiun-Jang Yu , Hsin-Hsien Yeh , Hong-Ching Lin , Chiung-Hsiung Chen
IPC分类号： G06K19/06
CPC分类号： G06K19/07749 , G06K19/0775
摘要： A radio frequency identification (RFID) tag including a substrate, an RFID chip, a chip contact part, a folding circuit and a radiation part is provided. The chip contact part is formed on the substrate and electrically coupled to the RFID chip. The folding circuit is formed on the substrate and electrically coupled to the chip contact part. The folding circuit has a winding part, which forms a hollow region, for compensating the antenna electric length. The radiation part is formed on the substrate and electrically coupled to the folding circuit, wherein one terminal of the winding part of the folding circuit is open, and the other terminal is electrically coupled to the radiation part. At least one of the folding circuit and the radiation part is asymmetric to the chip contact part.
摘要翻译：提供了包括基板，RFID芯片，芯片接触部件，折叠电路和辐射部件的射频识别（RFID）标签。芯片接触部分形成在基板上并电耦合到RFID芯片。折叠电路形成在基板上并电耦合到芯片接触部分。折叠电路具有绕组部分，其形成中空区域，用于补偿天线电长度。辐射部分形成在基板上并电耦合到折叠电路，其中折叠电路的绕组部分的一个端子是开放的，另一个端子电耦合到辐射部分。折叠电路和辐射部分中的至少一个与芯片接触部分不对称。

3. 发明申请

US20090160653A1 Anti-metal RFID tag and manufacturing method thereof 审中-公开
标题翻译：反金属RFID标签及其制造方法
公开(公告)号：US20090160653A1
公开(公告)日：2009-06-25
申请号：US12003615
申请日：2007-12-28
申请人： Hsin-Hsien Yeh , Ying-Chang Hung , Jiun-Jang Yu , Hong-Ching Lin , Chiung-Hsiung Chen
发明人： Hsin-Hsien Yeh , Ying-Chang Hung , Jiun-Jang Yu , Hong-Ching Lin , Chiung-Hsiung Chen
IPC分类号： G08B1/00
CPC分类号： G06K19/07749 , G06K19/07771 , H01Q1/2208 , H01Q7/00
摘要： An anti-metal radio frequency identification (RFID) tag and a manufacturing method thereof are described. The anti-metal RFID tag includes a substrate having a first surface and a second surface on an opposite side thereof; a planar integral antenna formed on the first surface of the substrate; a RFID transceiver chip (i.e., RFID chip) disposed on the surface of the substrate and coupled to a signal feed point of the planar integral antenna. The flexible planar integral antenna and substrate are folded and then fixed by a fixing mechanism to form an anti-metal RFID tag with a feed-in structure, a RFID transceiver chip, and a radiator on one side, and a ground plane on the opposite side. A spacer is further sandwiched in the center of the folded structure, which is helpful for improving the antenna gain of the anti-metal RFID tag.
摘要翻译：描述了一种反金属射频识别（RFID）标签及其制造方法。所述反金属RFID标签包括具有第一表面和在其相对侧上的第二表面的基板; 形成在所述基板的第一表面上的平面集成天线; RFID收发器芯片（即，RFID芯片），其布置在基板的表面上并且耦合到平面一体式天线的信号馈送点。柔性平面一体化天线和基板被折叠然后通过固定机构固定，以形成具有馈入结构的反金属RFID标签，RFID收发器芯片和一侧的散热器，以及相对的接地平面侧。间隔件进一步夹在折叠结构的中心，这有助于提高反金属RFID标签的天线增益。

4. 发明申请

US20130123726A1 RADIO FREQUENCY IDENTIFICATION TAG AND DIAPER, ABSORBER AND SENSING SYSTEM USING THE SAME 有权
标题翻译：无线电频率识别标签和DIAPER，吸收和感应系统
公开(公告)号：US20130123726A1
公开(公告)日：2013-05-16
申请号：US13524192
申请日：2012-06-15
申请人： Jiun-Jang Yu , Chiung-Hsiung Chen , Chun-An Lu , Hong-Ching Lin
发明人： Jiun-Jang Yu , Chiung-Hsiung Chen , Chun-An Lu , Hong-Ching Lin
IPC分类号： A61F13/42 , G06K19/077
CPC分类号： H01Q1/2225 , H01Q1/273 , H01Q9/285
摘要： A radio frequency (RF) identification tag including a substrate, a planar antenna, an RF chip, a plurality of signal conductors and a plurality of ground conductors is provided. The RF chip receives an RF signal from the planar antenna to generate an identification code. The signal conductors are coupled to the planar antenna. The ground conductors, interlaced on two opposite sides of the signal conductors, and the signal conductors are adjacent to each other and disposed on the substrate to form a coplanar waveguide structure which includes an impedance match portion and a transmission portion. The impedance match portion has an input end coupled to the signal conductors and a ground plane coupled to the ground conductors. The RF chip is disposed between the input end and the ground plane. The transmission portion is connected between the impedance match portion and the planar antenna.
摘要翻译：提供了包括基板，平面天线，RF芯片，多个信号导体和多个接地导体的射频（RF）识别标签。 RF芯片从平面天线接收RF信号以产生识别码。信号导体耦合到平面天线。在信号导体的两个相对侧交织的接地导体和信号导体彼此相邻并且设置在基板上以形成包括阻抗匹配部分和透射部分的共面波导结构。阻抗匹配部分具有耦合到信号导体的输入端和耦合到接地导体的接地平面。 RF芯片设置在输入端和接地平面之间。传输部分连接在阻抗匹配部分和平面天线之间。

5. 发明授权

US09160054B2 Radio frequency identification tag and diaper, absorber and sensing system using the same 有权
标题翻译：射频识别标签和尿布，吸收器和感应系统使用相同
公开(公告)号：US09160054B2
公开(公告)日：2015-10-13
申请号：US13524192
申请日：2012-06-15
申请人： Jiun-Jang Yu , Chiung-Hsiung Chen , Chun-An Lu , Hong-Ching Lin
发明人： Jiun-Jang Yu , Chiung-Hsiung Chen , Chun-An Lu , Hong-Ching Lin
IPC分类号： A61F13/15 , A61F13/20 , H01Q1/22 , H01Q1/27 , H01Q9/28
CPC分类号： H01Q1/2225 , H01Q1/273 , H01Q9/285
摘要： A radio frequency (RF) identification tag including a substrate, a planar antenna, an RF chip, a plurality of signal conductors and a plurality of ground conductors is provided. The RF chip receives an RF signal from the planar antenna to generate an identification code. The signal conductors are coupled to the planar antenna. The ground conductors, interlaced on two opposite sides of the signal conductors, and the signal conductors are adjacent to each other and disposed on the substrate to form a coplanar waveguide structure which includes an impedance match portion and a transmission portion. The impedance match portion has an input end coupled to the signal conductors and a ground plane coupled to the ground conductors. The RF chip is disposed between the input end and the ground plane. The transmission portion is connected between the impedance match portion and the planar antenna.
摘要翻译：提供了包括基板，平面天线，RF芯片，多个信号导体和多个接地导体的射频（RF）识别标签。 RF芯片从平面天线接收RF信号以产生识别码。信号导体耦合到平面天线。在信号导体的两个相对侧交织的接地导体和信号导体彼此相邻并且设置在基板上以形成包括阻抗匹配部分和透射部分的共面波导结构。阻抗匹配部分具有耦合到信号导体的输入端和耦合到接地导体的接地平面。 RF芯片设置在输入端和接地平面之间。传输部分连接在阻抗匹配部分和平面天线之间。

6. 发明授权

US08042744B2 RFID tag 有权
标题翻译： RFID标签
公开(公告)号：US08042744B2
公开(公告)日：2011-10-25
申请号：US12506367
申请日：2009-07-21
申请人： Jiun-Jang Yu , Hsin-Hsien Yeh , Hong-Ching Lin , Chiung-Hsiung Chen
发明人： Jiun-Jang Yu , Hsin-Hsien Yeh , Hong-Ching Lin , Chiung-Hsiung Chen
IPC分类号： G06K19/06 , G06K7/08
CPC分类号： G06K19/07749 , G06K19/0775
摘要： A radio frequency identification (RFID) tag including a substrate, an RFID chip, a chip contact part, a folding circuit and a radiation part is provided. The chip contact part is formed on the substrate and electrically coupled to the RFID chip. The folding circuit is formed on the substrate and electrically coupled to the chip contact part. The folding circuit has a winding part, which forms a hollow region, for compensating the antenna electric length. The radiation part is formed on the substrate and electrically coupled to the folding circuit, wherein one terminal of the winding part of the folding circuit is open, and the other terminal is electrically coupled to the radiation part. At least one of the folding circuit and the radiation part is asymmetric to the chip contact part.
摘要翻译：提供了包括基板，RFID芯片，芯片接触部件，折叠电路和辐射部件的射频识别（RFID）标签。芯片接触部分形成在基板上并电耦合到RFID芯片。折叠电路形成在基板上并电耦合到芯片接触部分。折叠电路具有绕组部分，其形成中空区域，用于补偿天线电长度。辐射部分形成在基板上并电耦合到折叠电路，其中折叠电路的绕组部分的一个端子是开放的，另一个端子电耦合到辐射部分。折叠电路和辐射部分中的至少一个与芯片接触部分不对称。

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