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    • 2. 发明授权
    • Method for enhanced dielectric film uniformity
    • 提高介电膜均匀性的方法
    • US6156675A
    • 2000-12-05
    • US407575
    • 1999-09-28
    • Jonathon M. LobbinsLeonard J. Olmer
    • Jonathon M. LobbinsLeonard J. Olmer
    • C23C16/509H01L21/316B05D3/06H01L21/44
    • H01L21/02129C23C16/5096H01L21/02274H01L21/31625
    • The present invention relates to an apparatus and method for depositing a film on a wafer. A reactor for depositing a film on a surface of a wafer comprises a processing chamber having an electrode, a ceramic wafer support supporting the wafer and separated from the electrode by a distance of between 230 and 240 millimeters, a gas inlet supplying gas reactants, and a radio frequency inlet supplying radio frequency energy. The reactor further comprises a heating chamber having at least one heat source which heats the wafer. A method for depositing a film on a surface of a semiconductor wafer comprises providing a processing chamber having a ceramic wafer support supporting the wafer and an electrode, separating the electrode from the ceramic wafer support by a distance of between 230 and 240 millimeters, supplying radio frequency energy into the processing chamber, supplying gas reactants into the processing chamber, and heating the wafer.
    • 本发明涉及一种在晶片上沉积薄膜的设备和方法。 用于在晶片表面上沉积薄膜的反应器包括具有电极的处理室,支撑晶片的陶瓷晶片支架,并与电极隔开230-240毫米的距离,供气气体反应物的气体入口和 射频入口提供射频能量。 反应器还包括具有加热晶片的至少一个热源的加热室。 一种用于在半导体晶片的表面上沉积薄膜的方法包括提供一个处理室,该处理室具有支撑该晶片的陶瓷晶片支撑件和一个电极,将该电极与陶瓷晶片支撑件分开距离为230至240毫米, 将频率能量进入处理室,将气体反应物供应到处理室中,并加热晶片。