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    • 10. 发明申请
    • METHOD FOR TESTING AND REPAIRING ADHESIVE BONDS
    • 测试和修复胶粘剂的方法
    • US20090277563A1
    • 2009-11-12
    • US12348955
    • 2009-01-06
    • Pei-Chung WangJohn D. Fickes
    • Pei-Chung WangJohn D. Fickes
    • B32B38/00G01N3/00
    • G01N19/04
    • A method for testing adhesive bond quality includes subjecting an adhesively-bonded workpiece to a known loading function. The loading function may be cyclic, linear, or nonlinear, and configured not to damage the workpiece. Response characteristics of the workpiece are measured during the loading. Measured response characteristics are compared with baseline or nominal characteristics and the adhesive bond quality is determined from the resulting comparison. A differential signal may be generated based upon the comparison of measured response and baseline characteristics and used to determine the adhesive bond quality, possibly with an algorithm. Being within the acceptable range is indicative of acceptable adhesive bond quality. The root cause of failure may be determined and a course of action based thereupon; including: localized curing, inspection, repair, and destruction. Following corrective courses of action, the workpiece may be re-tested and compared again to the baseline.
    • 用于测试粘合剂粘合质量的方法包括使粘合的工件经受已知的加载功能。 加载功能可以是循环的,线性的或非线性的,并且被配置成不会损坏工件。 在加载期间测量工件的响应特性。 将测量的响应特性与基线或标称特性进行比较,并从所得到的比较中确定粘合剂粘合质量。 可以基于测量的响应和基线特性的比较来生成差分信号,并且可以用算法确定粘合剂粘合质量。 在可接受的范围内表示可接受的胶粘剂质量。 可能确定失败的根本原因,并根据此而采取的行动方针; 包括:局部固化,检查,修理和破坏。 在纠正行动过程之后,可以重新测试工件并再次对基准进行比较。