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2. 发明授权

US5397747A Vertical chip mount memory package and method 失效
标题翻译：垂直芯片安装存储器封装和方法
公开(公告)号：US5397747A
公开(公告)日：1995-03-14
申请号：US151455
申请日：1993-11-02
申请人： John M. Angiulli , Eugene S. Kolankowsky , Richard R. Konian , Leon L. Wu
发明人： John M. Angiulli , Eugene S. Kolankowsky , Richard R. Konian , Leon L. Wu
IPC分类号： H01L23/12 , H01L25/00 , H01L25/065 , H01L25/18 , H01L27/10 , H01L21/60
CPC分类号： H01L25/18 , H01L25/0652 , H01L2924/0002 , Y10T29/49144
摘要： A packaging substrate (10) is populated with memory chip cube(s) (40) and horizontally mounted interconnect chip(s) (19) mounted on the substrate which are joined during assembly using two kinds of lead tin solder alloys to form memory chip cube. One is a high melting point lead tin alloy (HMA), the other is a lower melting point lead tin alloy (LMA). The memory chip pairs (11) of the memory cube are formed by placing functional memory chips over another functional memory chips before they were diced. The chip pads of the individual memory chips and the lead tin pads of the memory chips within the wafer are aligned and the high melting point lead tin solder is reflowed, forming memory chip pairs. The memory cube (42) is formed by joining the memory chip pairs together in a boat (30) with a silicon bar (41) maintaining spacing during manufacture. The memory chip cube (42) as well as the supporting chips are then placed and joined to the packaging substrate. The supporting silicon bar is removed from the memory chip cube (42) by re-heating the cube after it is joined to the packaging substrate. The package is completed by following with capping of the chip package of the paired memory chip cube with its attached packaging substrate by attaching to the base member substrate an appropriate heat sink after appropriate I/O flex lines are in place.
摘要翻译：封装基板（10）上安装有安装在基板上的存储芯片立方体（40）和水平安装的互连芯片（19），其在组装期间使用两种铅锡焊料合金接合以形成存储芯片立方体。一种是高熔点铅锡合金（HMA），另一种是低熔点铅锡合金（LMA）。存储器立方体的存储器芯片对（11）通过在功能存储器芯片被切割之前将功能存储器芯片放置在另一个功能存储器芯片上而形成。单个存储器芯片的芯片焊盘和晶片内的存储器芯片的引线锡焊盘对准，并且高熔点铅锡焊料回流，形成存储器芯片对。存储器立方体（42）通过在存储器芯片对中将存储芯片组合在一起而形成，所述存储器芯片对在制造期间保持间隔的硅棒（41）在舟皿（30）中。然后将存储芯片立方体（42）以及支撑芯片放置并连接到封装基板。立方体在与包装基板接合后再加热立方体，从存储芯片立方体（42）移除支撑硅棒。通过在配对的存储芯片立方体的芯片封装与其附接的封装基板之间通过在适当的I / O柔性线就位之后附接到基底构件基板上的合适的散热器来完成封装。

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