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1. 发明申请

US20050195585A1 Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making 有权
标题翻译：具有信号线屏蔽的电路基板，利用其组合的电气组件和制造方法
公开(公告)号：US20050195585A1
公开(公告)日：2005-09-08
申请号：US10790747
申请日：2004-03-03
申请人： John Lauffer , Voya Markovich , Corey Seastrand , David Thomas
发明人： John Lauffer , Voya Markovich , Corey Seastrand , David Thomas
IPC分类号： H01K3/10 , H01L23/552 , H05K1/02 , H05K1/11 , H05K1/14
CPC分类号： H01L23/552 , H01L23/3128 , H01L23/5383 , H01L25/0652 , H01L25/0655 , H01L25/18 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011 , H01L2924/3025 , H05K1/0219 , H05K1/024 , H05K1/113 , H05K3/4623 , H05K3/4688 , H05K2201/0715 , H05K2201/09236 , H05K2201/09536 , H05K2201/096 , H05K2203/061 , H01L2224/05599
摘要： A circuitized substrate in which at least one signal line used therein is shielded by a pair of opposingly positioned ground lines which in turn are electrically coupled to a ground plane located beneath the signal and ground lines and separated therefrom by a common interim dielectric layer. An electrical assembly including the circuitized substrate as part thereof and a method of making the circuitized substrate are also included. The substrate may form part of a larger structure such as a PCB, chip carrier or the like.
摘要翻译：其中其中使用的至少一个信号线被一对相对定位的接地线屏蔽的电路化基板，所述接地线又电耦合到位于信号和接地线下方的接地平面，并通过共同的中间介质层与其分离。包括作为其一部分的电路化基板的电气组件和制造电路化基板的方法也包括在内。衬底可以形成较大结构的一部分，例如PCB，芯片载体等。

2. 发明申请

US20060200977A1 Method of making circuitized substrate with signal wire shielding 有权
公开(公告)号：US20060200977A1
公开(公告)日：2006-09-14
申请号：US11429990
申请日：2006-05-09
申请人： John Lauffer , Voya Markovich , Corey Seastrand , David Thomas
发明人： John Lauffer , Voya Markovich , Corey Seastrand , David Thomas
IPC分类号： H05K1/11
CPC分类号： H01L23/552 , H01L2924/0002 , H01L2924/3011 , H05K1/0219 , H05K2201/0715 , H05K2201/09236 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A method of making a circuitized substrate in which at least one signal line used therein is shielded by a pair of opposingly positioned ground lines which in turn are electrically coupled to a ground plane located beneath the signal and ground lines and separated therefrom by a common interim dielectric layer. The substrate may form part of a larger structure such as a PCB, chip carrier or the like.

3. 发明授权

US07478472B2 Method of making circuitized substrate with signal wire shielding 有权
标题翻译：用信号线屏蔽制作电路化基板的方法
公开(公告)号：US07478472B2
公开(公告)日：2009-01-20
申请号：US11429990
申请日：2006-05-09
申请人： John M. Lauffer , Voya Markovich , Corey Seastrand , David L. Thomas
发明人： John M. Lauffer , Voya Markovich , Corey Seastrand , David L. Thomas
IPC分类号： H05K3/36 , H01B7/29
CPC分类号： H01L23/552 , H01L2924/0002 , H01L2924/3011 , H05K1/0219 , H05K2201/0715 , H05K2201/09236 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A method of making a circuitized substrate in which at least one signal line used therein is shielded by a pair of opposingly positioned ground lines which in turn are electrically coupled to a ground plane located beneath the signal and ground lines and separated therefrom by a common interim dielectric layer. The substrate may form part of a larger structure such as a PCB, chip carrier or the like.
摘要翻译：一种制造电路化基板的方法，其中使用的至少一个信号线被一对相对定位的接地线屏蔽，所述接地线又电耦合到位于信号和接地线下方的接地平面，并且通过共同的中间电介质层。衬底可以形成较大结构的一部分，例如PCB，芯片载体等。

4. 发明授权

US07209368B2 Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making 有权
标题翻译：具有信号线屏蔽的电路基板，利用其组合的电气组件和制造方法
公开(公告)号：US07209368B2
公开(公告)日：2007-04-24
申请号：US10790747
申请日：2004-03-03
申请人： John M. Lauffer , Voya Markovich , Corey Seastrand , David L. Thomas
发明人： John M. Lauffer , Voya Markovich , Corey Seastrand , David L. Thomas
IPC分类号： H05K9/00
CPC分类号： H01L23/552 , H01L23/3128 , H01L23/5383 , H01L25/0652 , H01L25/0655 , H01L25/18 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011 , H01L2924/3025 , H05K1/0219 , H05K1/024 , H05K1/113 , H05K3/4623 , H05K3/4688 , H05K2201/0715 , H05K2201/09236 , H05K2201/09536 , H05K2201/096 , H05K2203/061 , H01L2224/05599
摘要： A circuitized substrate in which at least one signal line used therein is shielded by a pair of opposingly positioned ground lines which in turn are electrically coupled to a ground plane located beneath the signal and ground lines and separated therefrom by a common interim dielectric layer. An electrical assembly including the circuitized substrate as part thereof and a method of making the circuitized substrate are also included. The substrate may form part of a larger structure such as a PCB, chip carrier or the like.
摘要翻译：其中其中使用的至少一个信号线被一对相对定位的接地线屏蔽的电路化基板，所述接地线又电耦合到位于信号和接地线下方的接地平面，并通过共同的中间介质层与其分离。包括作为其一部分的电路化基板的电气组件和制造电路化基板的方法也包括在内。衬底可以形成较大结构的一部分，例如PCB，芯片载体等。

5. 发明申请

US20070249089A1 Method of making circuitized substrate with internal organic memory device 失效
标题翻译：制造具有内部有机存储器件的电路化衬底的方法
公开(公告)号：US20070249089A1
公开(公告)日：2007-10-25
申请号：US11808596
申请日：2007-06-12
申请人： Subahu Desai , How Lin , John Lauffer , Voya Markovich , David Thomas
发明人： Subahu Desai , How Lin , John Lauffer , Voya Markovich , David Thomas
IPC分类号： H01L51/40
CPC分类号： G11C11/22 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011 , H05K1/16 , H05K2201/0166 , H05K2201/0179 , H05K2201/09763 , H05K2201/10159 , H01L2224/0401
摘要： A method of making circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device.
摘要翻译：一种制造电路化衬底的方法，所述电路化衬底由其上具有导电图案的至少一种电介质材料组成。图案的至少一部分被用作有机存储器件的第一层，该有机存储器件还包括在图案上方的至少第二介电层和相对于下部对准的第二图案，用于实现几个接触点，从而形成设备。

6. 发明申请

US20050133257A1 Printed circuit board with low cross-talk noise 失效
标题翻译：具有低串扰噪声的印刷电路板
公开(公告)号：US20050133257A1
公开(公告)日：2005-06-23
申请号：US10740398
申请日：2003-12-22
申请人： John Lauffer , Voya Markovich , James McNamara , David Thomas
发明人： John Lauffer , Voya Markovich , James McNamara , David Thomas
IPC分类号： H05K1/02 , H05K3/46 , H05K1/11 , H05K3/42
CPC分类号： H05K1/0216 , H05K1/0228 , H05K2201/09236 , H05K2201/09672 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A printed circuit board and a method of making same in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric layers, each signal layer comprising a plurality of substantially parallel signal lines running in substantially similar directions across said signal layers. Predetermined portions of the signal lines in one signal layer are aligned relative to and also parallel to corresponding signal lines in the other signal layer, with the power plane being located between these portions. Through hole connections are provided between selected signal lines in the two layers, these occurring through clearance holes in the power plane so as to be isolated therefrom.
摘要翻译：一种印刷电路板及其制造方法，其中所述板包括在其相对侧上具有电介质层的公共电源平面和每个所述电介质层上的信号层，每个信号层包括多条基本上平行的信号线，基本相似的方向跨越所述信号层。一个信号层中的信号线的预定部分相对于并且平行于另一个信号层中的相应的信号线，而功率平面位于这些部分之间。在两层中的选定信号线之间提供通孔连接，这些连接通过电源平面中的间隙而发生，从而与其隔离。

7. 发明申请

US20070089290A1 Method of making a printed circuit board with low cross-talk noise 失效
标题翻译：制造具有低串扰噪声的印刷电路板的方法
公开(公告)号：US20070089290A1
公开(公告)日：2007-04-26
申请号：US11634287
申请日：2006-12-06
申请人： John Lauffer , Voya Markovich , James McNamara , David Thomas
发明人： John Lauffer , Voya Markovich , James McNamara , David Thomas
IPC分类号： H05K3/36 , H05K3/20
CPC分类号： H05K1/0216 , H05K1/0228 , H05K2201/09236 , H05K2201/09672 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A method of making a printed circuit board in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric layers, each signal layer comprising a plurality of substantially parallel signal lines running in substantially similar directions across said signal layers. Predetermined portions of the signal lines in one signal layer are aligned relative to and also parallel to corresponding signal lines in the other signal layer, with the power plane being located between these portions. Through hole connections are provided between selected signal lines in the two layers, these occurring through clearance holes in the power plane so as to be isolated therefrom.
摘要翻译：一种制造印刷电路板的方法，其中所述基板包括在其相对侧上具有电介质层的公共电源平面和每个所述电介质层上的信号层，每个信号层包括基本相似的多条基本上平行的信号线跨越所述信号层的方向。一个信号层中的信号线的预定部分相对于并且平行于另一个信号层中的相应的信号线，而功率平面位于这些部分之间。在两层中的选定信号线之间提供通孔连接，这些连接通过电源平面中的间隙而发生，从而与其隔离。

8. 发明申请

US20060022310A1 Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same 失效
标题翻译：具有位于其上的电子部件的具有内部存储器电路化基板的电气组件，其制造方法以及利用其的信息处理系统
公开(公告)号：US20060022310A1
公开(公告)日：2006-02-02
申请号：US10900386
申请日：2004-07-28
申请人： Frank Egitto , John Lauffer , How Lin , Voya Markovich , David Thomas
发明人： Frank Egitto , John Lauffer , How Lin , Voya Markovich , David Thomas
IPC分类号： H01L23/58
CPC分类号： G11C5/06 , B82Y10/00 , G02B6/43 , H01L23/48 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011 , H01L2924/3025 , H05K1/16 , H05K1/181 , H05K3/429 , H05K3/4611 , H05K2201/0166 , H05K2201/0179 , H05K2201/09763 , H05K2201/10159 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electrical assembly which includes a circuitized substrate comprised of an organic dielectric material having a first electrically conductive pattern thereon. At least part of the dielectric layer and pattern form the first, base portion of an organic memory device, the remaining portion being a second, polymer layer formed over the part of the pattern and a second conductive circuit formed on the polymer layer. A second dielectric layer if formed over the second conductive circuit and first circuit pattern to enclose the organic memory device. The device is electrically coupled to a first electrical component through the second dielectric layer and this first electrical component is electrically coupled to a second electrical component. A method of making the electrical assembly is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.
摘要翻译：一种电气组件，其包括由其上具有第一导电图案的有机电介质材料构成的电路化衬底。电介质层和图案的至少一部分形成有机存储器件的第一基底部分，其余部分是形成在图案部分上的第二聚合物层和形成在聚合物层上的第二导电电路。如果形成在第二导电电路上的第二电介质层和第一电路图案以包围有机存储器件。该器件通过第二介电层电耦合到第一电气部件，并且该第一电气部件电耦合到第二电气部件。还提供了制造电气组件的方法，以及适于使用一个或多个这样的电气组件作为其一部分的信息处理系统。

9. 发明申请

US20060022303A1 Circuitized substrate with internal organic memory device, method of making same, electrical assembly utilizing same, and information handling system utilizing same 失效
标题翻译：具有内部有机存储器件的电路化衬底，其制造方法，利用其组合的电气组件以及利用其的信息处理系统
公开(公告)号：US20060022303A1
公开(公告)日：2006-02-02
申请号：US10900385
申请日：2004-07-28
申请人： Subahu Desai , How Lin , John Lauffer , Voya Markovich , David Thomas
发明人： Subahu Desai , How Lin , John Lauffer , Voya Markovich , David Thomas
IPC分类号： H01L29/00 , H01L21/00
CPC分类号： G11C11/22 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011 , H05K1/16 , H05K2201/0166 , H05K2201/0179 , H05K2201/09763 , H05K2201/10159 , H01L2224/0401
摘要： A circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device. The substrate is preferably combined with other dielectric-circuit layered assemblies to form a multilayered substrate on which can be positioned discrete electronic components (e.g., a logic chip) coupled to the internal memory device to work in combination therewith. An electrical assembly capable of using the substrate is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.
摘要翻译：一种电路化衬底，由至少一层具有导电图案的电介质材料构成。图案的至少一部分被用作有机存储器件的第一层，该有机存储器件还包括在图案上方的至少第二介电层和相对于下部对准的第二图案，用于实现几个接触点，从而形成设备。衬底优选地与其它介电电路分层组件组合以形成多层衬底，在多层衬底上，可以将耦合到内部存储器件的分立电子部件（例如，逻辑芯片）放置在其上以与之组合工作。还提供了能够使用基板的电气组件，以及适于使用一个或多个这样的电气组件作为其一部分的信息处理系统。

10. 发明申请

US20070166944A1 Method of making circuitized substrate 有权
标题翻译：制造电路化基板的方法
公开(公告)号：US20070166944A1
公开(公告)日：2007-07-19
申请号：US11324432
申请日：2006-01-04
申请人： Robert Japp , John Lauffer , Voya Markovich , William Wilson
发明人： Robert Japp , John Lauffer , Voya Markovich , William Wilson
IPC分类号： H01L21/20
CPC分类号： H05K3/4641 , H05K3/429 , H05K2203/068
摘要： A method of making a circuitized substrate and an electrical assembly utilizing same in which the substrate is comprised of at least two sub-composites in which the dielectric material of at least one of these sub-composites is heated during bonding (e.g., lamination) to the other sufficiently to cause the dielectric material to flow into and substantially fill openings in a conductive layer for the bonded structure. Conductive thru-holes are formed within the bonded structure to couple selected ones of the structure's conductive layers. Formation of an electrical assembly is possible by positioning one or more electrical components (e.g., semiconductor chips or chip carriers) on the final structure and electrically coupling these to the structure's external circuitry.
摘要翻译：一种制造电路化基板的方法和使用其的电气组件，其中基板由至少两个亚复合材料构成，其中这些亚复合材料中的至少一个的介电材料在粘合（例如，层压）期间被加热到另一个足以使电介质材料流入并基本上填充用于接合结构的导电层中的开口。导电通孔形成在接合结构内，以耦合所选择的结构导电层。通过将一个或多个电气部件（例如，半导体芯片或芯片载体）定位在最终结构上并将其电耦合到结构的外部电路，可以形成电组件。

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