专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07067172B2 Component formation via plating technology 有权
标题翻译：通过电镀技术形成组件
公开(公告)号：US07067172B2
公开(公告)日：2006-06-27
申请号：US10829639
申请日：2004-04-22
申请人： Andrew P. Ritter , John L. Galvagni , Jason MacNeal , Robert Heistand, II , Sriram Dattaguru
发明人： Andrew P. Ritter , John L. Galvagni , Jason MacNeal , Robert Heistand, II , Sriram Dattaguru
IPC分类号： B05D5/12 , H01G7/00 , C25D5/02
CPC分类号： H01G4/232 , Y10T29/43 , Y10T29/435
摘要： Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such plated termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed varying width internal electrode tabs and additional anchor tab portions. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. The combination of electrode tabs and anchor tabs may be exposed in respective arrangements to form generally discoidal portions of plated material. Such plated material may ultimately form generally round portions of ball limiting metallurgy (BLM) to which solder balls may be reflowed. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and materials may be employed in the formation of the subject self-determining plated terminations and inductive components.
摘要翻译：根据公开的电镀技术形成改进的端接，互连技术和用于多层电子部件的电感元件特征。单片组件设置有电镀端接，从而消除或大大简化了对典型厚膜端接条的需要。这种电镀终端技术消除了许多典型的终端问题，并且能够以更细的间距实现更高数量的终端，这对于较小的电子部件可能是特别有益的。受电镀的终端由暴露的变化宽度的内部电极片和附加的锚定片部分引导和锚定。这种锚定片可以相对于芯片结构位于内部或外部，以使附加的金属化电镀材料成核。电极片和锚定片的组合可以以各自的布置暴露以形成电镀材料的大致盘形部分。这种电镀材料最终可以形成通常圆球形限制冶金（BLM）的圆形部分，焊球可以回流到该部分。所公开的技术可以与多个单片多层组件一起使用，包括交错电容器，多层电容器阵列和集成无源组件。各种不同的电镀技术和材料可用于形成受试者自确定的电镀终端和电感组分。

2. 发明授权

US07161794B2 Component formation via plating technology 有权
标题翻译：通过电镀技术形成组件
公开(公告)号：US07161794B2
公开(公告)日：2007-01-09
申请号：US10900787
申请日：2004-07-28
申请人： John L. Galvagni , Jason MacNeal , Andrew P. Ritter , Robert Heistand, II , Sriram Dattaguru
发明人： John L. Galvagni , Jason MacNeal , Andrew P. Ritter , Robert Heistand, II , Sriram Dattaguru
IPC分类号： H01G4/228 , H01G2/20
CPC分类号： H01G4/232 , Y10T29/43 , Y10T29/435
摘要： Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such plated termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed varying width internal electrode tabs and additional anchor tab portions. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. The combination of electrode tabs and anchor tabs may be exposed in respective arrangements to form generally discoidal portions of plated material. Such plated material may ultimately form generally round portions of ball limiting metallurgy (BLM) to which solder balls may be reflowed. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and materials may be employed in the formation of the subject self-determining plated terminations and inductive components.
摘要翻译：根据公开的电镀技术形成改进的端接，互连技术和用于多层电子部件的电感元件特征。单片组件设置有电镀端接，从而消除或大大简化了对典型厚膜端接条的需要。这种电镀终端技术消除了许多典型的终端问题，并且能够以更细的间距实现更高数量的终端，这对于较小的电子部件可能是特别有益的。受电镀的终端由暴露的变化宽度的内部电极片和附加的锚定片部分引导和锚定。这种锚定片可以相对于芯片结构位于内部或外部，以使附加的金属化电镀材料成核。电极片和锚定片的组合可以以各自的布置暴露以形成电镀材料的大致盘形部分。这种电镀材料最终可以形成通常圆球形限制冶金（BLM）的圆形部分，焊球可以回流到该部分。所公开的技术可以与多个单片多层组件一起使用，包括交错电容器，多层电容器阵列和集成无源组件。各种不同的电镀技术和材料可用于形成受试者自确定的电镀终端和电感组分。

3. 发明授权

US06982863B2 Component formation via plating technology 有权
公开(公告)号：US06982863B2
公开(公告)日：2006-01-03
申请号：US10409036
申请日：2003-04-08
申请人： John L. Galvagni , Jason MacNeal , Andrew P. Ritter , Robert Heistand, II , Sriram Dattaguru
发明人： John L. Galvagni , Jason MacNeal , Andrew P. Ritter , Robert Heistand, II , Sriram Dattaguru
IPC分类号： H01G4/228 , H01G4/32
CPC分类号： H01G4/232 , Y10T29/43 , Y10T29/435
摘要： Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such plated termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed varying width internal electrode tabs and additional anchor tab portions. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. The combination of electrode tabs and anchor tabs may be exposed in respective arrangements to form generally discoidal portions of plated material. Such plated material may ultimately form generally round portions of ball limiting metallurgy (BLM) to which solder balls may be reflowed. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and materials may be employed in the formation of the subject self-determining plated terminations and inductive components.

4. 发明授权

US07344981B2 Plated terminations 有权
标题翻译：电镀端接
公开(公告)号：US07344981B2
公开(公告)日：2008-03-18
申请号：US11066575
申请日：2005-02-25
申请人： Andrew P. Ritter , Robert Heistand, II , John L. Galvagni , Sriram Dattaguru , Jeffrey A. Horn , Richard A. Ladew
发明人： Andrew P. Ritter , Robert Heistand, II , John L. Galvagni , Sriram Dattaguru , Jeffrey A. Horn , Richard A. Ladew
IPC分类号： H01L21/44 , H01L21/76 , H01G7/00 , H01G4/228
CPC分类号： H01G4/012 , H01G4/232 , H01G4/30 , H01L2924/01029 , Y10T29/42 , Y10T29/43 , Y10T29/435
摘要： A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrode elements and a plurality of internal anchor tabs. Portions of the internal electrode elements and anchor tabs are exposed along the periphery of the electronic component in one or more aligned columns. Each exposed portion is within a predetermined distance from other exposed portions in a given column such that bridged terminations may be formed by depositing one or more plated termination materials over selected of the respectively aligned columns. Internal anchor tabs may be provided and exposed in prearranged relationships with other exposed conductive portions to help nucleate metallized plating material along the periphery of a device. External anchor tabs or lands may be provided to form terminations that extend to top and/or bottom surfaces of the device. Selected of the conductive elements may be formed by a finite volume percentage of ceramic material for enhanced durability, and external lands may be thicker than internal conductive elements and/or may also be embedded in top and/or bottom component surfaces. A variety of potential internal electrode configurations are possible including ones configured for orientation-insensitive component mounting and for high density peripheral termination interdigitated capacitors.
摘要翻译：多层电子部件包括与多个内部电极元件和多个内部固定突片交错的多个电介质层。内部电极元件和锚定片的部分沿着电子元件的外围在一个或多个对齐的列中露出。每个暴露部分在与给定列中的其它暴露部分预定距离内，使得桥接端接可以通过在选定的分别对准的柱上沉积一个或多个电镀终止材料而形成。可以提供内部锚定突片并以与其它暴露的导电部分的预定关系暴露，以帮助沿着装置的周边使金属化电镀材料成核。可以提供外部锚定片或平台以形成延伸到装置的顶部和/或底部表面的终端。选择的导电元件可以由有限体积百分比的陶瓷材料形成，以增强耐久性，并且外部焊盘可以比内部导电元件厚，和/或也可以嵌入在顶部和/或底部部件表面中。各种潜在的内部电极配置是可能的，包括被配置用于定向不敏感元件安装和用于高密度外围端接叉指电容器的构造。

5. 发明授权

US06960366B2 Plated terminations 有权
公开(公告)号：US06960366B2
公开(公告)日：2005-11-01
申请号：US10632514
申请日：2003-08-01
申请人： Andrew P. Ritter , Robert Heistand, II , John L. Galvagni , Sriram Dattaguru
发明人： Andrew P. Ritter , Robert Heistand, II , John L. Galvagni , Sriram Dattaguru
IPC分类号： H01G4/252 , B05D5/12 , C23C18/16 , H01C1/142 , H01F5/00 , H01F27/29 , H01G2/06 , H01G4/12 , H01G4/228 , H01G4/232 , H01G4/30 , H01G4/38 , H01G7/00 , H01L21/60 , H01L23/50 , H05K1/09 , H05K1/11 , H05K3/40
CPC分类号： H01C1/14 , C23C18/1605 , C23C18/1639 , C23C18/1886 , H01C7/008 , H01C7/10 , H01G4/005 , H01G4/232 , H01G4/30 , H05K1/181 , Y02P70/611 , Y10T29/43 , Y10T29/435
摘要： Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on one or both of top and bottom surfaces of a monolithic structure can facilitate the formation of selective wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

6. 发明授权

US09666366B2 Method of making multi-layer electronic components with plated terminations 有权
公开(公告)号：US09666366B2
公开(公告)日：2017-05-30
申请号：US10951972
申请日：2004-09-28
申请人： Andrew P. Ritter , Robert Heistand, II , John L. Galvagni , Sriram Dattaguru
发明人： Andrew P. Ritter , Robert Heistand, II , John L. Galvagni , Sriram Dattaguru
IPC分类号： H01G4/008 , H01C1/14 , H01C7/00 , H01C7/10 , H01G4/005 , H01G4/012 , H01G4/228 , H01G4/232 , H01G4/30 , C25D5/02 , H05K3/02 , C23C18/16 , C23C18/32 , C23C18/38 , C23C18/48 , C23C28/02 , C25D7/00 , H01G4/12 , H05K3/40
CPC分类号： H01G4/30 , C23C18/1651 , C23C18/1653 , C23C18/32 , C23C18/38 , C23C18/48 , C23C28/021 , C23C28/023 , C25D3/56 , C25D5/02 , C25D5/34 , C25D7/00 , H01C1/14 , H01C7/008 , H01C7/10 , H01C17/28 , H01F41/04 , H01G4/005 , H01G4/008 , H01G4/012 , H01G4/06 , H01G4/12 , H01G4/228 , H01G4/232 , H05K3/02 , H05K3/403 , H05K2201/09709 , Y10T29/417 , Y10T29/42 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/49099 , Y10T29/49101
摘要： Improved method steps for making a multilayer electronic components are disclosed. Monolithic components are formed with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. Electrodes and insulating substrates are provided in an interleaved arrangement and selected portions of the electrodes are exposed along selected edges of the substrates. Anchor tabs, which are not in direct contact with the electrodes and offer additional nucleation points for plated structures, may also optionally be provided and exposed in some embodiments. Termination material is then plated to the exposed portions of the electrodes and optional anchor tabs, such as via electroless and/or electrochemical processes, until exposed portions of selected groups thereof are connected.

7. 发明授权

US07177137B2 Plated terminations 有权
标题翻译：电镀端接
公开(公告)号：US07177137B2
公开(公告)日：2007-02-13
申请号：US10818951
申请日：2004-04-06
申请人： Andrew P. Ritter , Robert Heistand, II , John L. Galvagni , Sriram Dattaguru , Jeffrey A. Horn , Richard A. Ladew
发明人： Andrew P. Ritter , Robert Heistand, II , John L. Galvagni , Sriram Dattaguru , Jeffrey A. Horn , Richard A. Ladew
IPC分类号： H01G4/228
CPC分类号： H01G4/012 , H01G4/232 , H01G4/30 , H01L2924/01029 , Y10T29/42 , Y10T29/43 , Y10T29/435
摘要： A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrode elements and a plurality of internal anchor tabs. Portions of the internal electrode elements and anchor tabs are exposed along the periphery of the electronic component in one or more aligned columns. Each exposed portion is within a predetermined distance from other exposed portions in a given column such that bridged terminations may be formed by depositing one or more plated termination materials over selected of the respectively aligned columns. Internal anchor tabs may be provided and exposed in prearranged relationships with other exposed conductive portions to help nucleate metallized plating material along the periphery of a device. External anchor tabs or lands may be provided to form terminations that extend to top and/or bottom surfaces of the device. Selected of the conductive elements may be formed by a finite volume percentage of ceramic material for enhanced durability, and external lands may be thicker than internal conductive elements and/or may also be embedded in top and/or bottom component surfaces. A variety of potential internal electrode configurations are possible including ones configured for orientation-insensitive component mounting and for high density peripheral termination interdigitated capacitors.
摘要翻译：多层电子部件包括与多个内部电极元件和多个内部固定突片交错的多个电介质层。内部电极元件和锚定片的部分沿着电子元件的外围在一个或多个对齐的列中露出。每个暴露部分在与给定列中的其它暴露部分预定距离内，使得桥接端接可以通过在选定的分别对准的柱上沉积一个或多个电镀终止材料而形成。可以提供内部锚定突片并以与其它暴露的导电部分的预定关系暴露，以帮助沿着装置的周边使金属化电镀材料成核。可以提供外部锚定片或平台以形成延伸到装置的顶部和/或底部表面的终端。选择的导电元件可以由有限体积百分比的陶瓷材料形成，以增强耐久性，并且外部焊盘可以比内部导电元件厚，和/或也可以嵌入在顶部和/或底部部件表面中。各种潜在的内部电极配置是可能的，包括被配置用于定向不敏感元件安装和用于高密度外围端接叉指电容器的构造。

8. 发明授权

US09627132B2 Method of making multi-layer electronic components with plated terminations 有权
公开(公告)号：US09627132B2
公开(公告)日：2017-04-18
申请号：US10951972
申请日：2004-09-28
申请人： Andrew P. Ritter , Robert Heistand, II , John L. Galvagni , Sriram Dattaguru
发明人： Andrew P. Ritter , Robert Heistand, II , John L. Galvagni , Sriram Dattaguru
IPC分类号： H01G4/008 , H01C1/14 , H01C7/00 , H01C7/10 , H01G4/005 , H01G4/012 , H01G4/228 , H01G4/232 , H01G4/30 , C25D5/02 , H05K3/02 , C23C18/16 , C23C18/32 , C23C18/38 , C23C18/48 , C23C28/02 , C25D7/00 , H01G4/12 , H05K3/40
摘要： Improved method steps for making a multilayer electronic components are disclosed. Monolithic components are formed with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. Electrodes and insulating substrates are provided in an interleaved arrangement and selected portions of the electrodes are exposed along selected edges of the substrates. Anchor tabs, which are not in direct contact with the electrodes and offer additional nucleation points for plated structures, may also optionally be provided and exposed in some embodiments. Termination material is then plated to the exposed portions of the electrodes and optional anchor tabs, such as via electroless and/or electrochemical processes, until exposed portions of selected groups thereof are connected.

9. 发明授权

US07154374B2 Plated terminations 有权
公开(公告)号：US07154374B2
公开(公告)日：2006-12-26
申请号：US10858427
申请日：2004-06-01
申请人： Andrew P. Ritter , Robert Heistand, II , John L. Galvagni , Sriram Dattaguru
发明人： Andrew P. Ritter , Robert Heistand, II , John L. Galvagni , Sriram Dattaguru
IPC分类号： H01C1/14
CPC分类号： H01G4/30 , C23C18/1651 , C23C18/1653 , C23C18/32 , C23C18/38 , C23C18/48 , C23C28/021 , C23C28/023 , C25D3/56 , C25D5/02 , C25D5/34 , C25D7/00 , H01C1/14 , H01C7/008 , H01C7/10 , H01C17/28 , H01F41/04 , H01G4/005 , H01G4/008 , H01G4/012 , H01G4/06 , H01G4/12 , H01G4/228 , H01G4/232 , H05K3/02 , H05K3/403 , H05K2201/09709 , Y10T29/417 , Y10T29/42 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/49099 , Y10T29/49101
摘要： Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

10. 发明授权

US07152291B2 Method for forming plated terminations 有权
标题翻译：电镀端接方法
公开(公告)号：US07152291B2
公开(公告)日：2006-12-26
申请号：US10409023
申请日：2003-04-08
申请人： Andrew P. Ritter , Robert Heistand, II , John L. Galvagni , Sriram Dattaguru
发明人： Andrew P. Ritter , Robert Heistand, II , John L. Galvagni , Sriram Dattaguru
IPC分类号： H01G7/00
CPC分类号： H01G4/30 , C23C18/1651 , C23C18/1653 , C23C18/32 , C23C18/38 , C23C18/48 , C23C28/021 , C23C28/023 , C25D3/56 , C25D5/02 , C25D5/34 , C25D7/00 , H01C1/14 , H01C7/008 , H01C7/10 , H01C17/28 , H01F41/04 , H01G4/005 , H01G4/008 , H01G4/012 , H01G4/06 , H01G4/12 , H01G4/228 , H01G4/232 , H05K3/02 , H05K3/403 , H05K2201/09709 , Y10T29/417 , Y10T29/42 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/49099 , Y10T29/49101
摘要： Improved method steps for terminating multilayer electronic components are disclosed. Monolithic components are formed with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. Electrode and dielectric layers are provided in an interleaved arrangement and selected portions of the electrode layers are exposed. Electrically isolated anchor tabs may optionally be provided and exposed in some embodiments. Termination material is then plated to the exposed portions of the electrode layers until exposed portions of selected such portions thereof are connected. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.
摘要翻译：公开了用于终止多层电子部件的改进的方法步骤。由电镀端子形成单片部件，由此消除或大大简化了对典型厚膜端接条的需要。这种终端技术消除了许多典型的终端问题，并且能够以更细的间距实现更高数量的终端，这对于较小的电子部件可能是特别有益的。以交错布置提供电极和电介质层，暴露电极层的选定部分。在一些实施例中，电隔离的锚定片可以可选地被提供和暴露。然后将端接材料电镀到电极层的暴露部分，直到连接了选定的这些部分的露出部分。可以采用各种不同的电镀技术和终止材料来形成受试者自确定的电镀终端。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式