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    • 7. 发明授权
    • Method and apparatus for semiconductor integrated circuit testing and burn-in
    • 用于半导体集成电路测试和老化的方法和装置
    • US06574763B1
    • 2003-06-03
    • US09473886
    • 1999-12-28
    • Claude L. BertinErik L. HedbergRussell J. HoughtonWilliam R. Tonti
    • Claude L. BertinErik L. HedbergRussell J. HoughtonWilliam R. Tonti
    • G01R3128
    • G01R31/287
    • A burn-in process is provided for a memory array having redundant bits and addressable storage locations. The burn-in process includes the steps of raising the temperature of the memory array to a pre-determined temperature, testing all bits in the array, detecting faulty bits and operable bits, replacing faulty bits with redundant operable bits, correcting any defects in the array in-situ, and lowering the temperature of the memory array to ambient temperature to complete the burn-in process. An apparatus for carrying out the above process is provided that includes a test circuit for generating a test pattern and for applying the test pattern to the memory array so as to test all bits within the memory array. A comparison circuit, coupled to the test circuit and adapted to couple to the memory array, compares an actual response and an expected response of the memory array to the test pattern and detects faulty and operable bits based thereon. A failed address buffer register, coupled to the comparison circuit and to the test circuit, stores an address of each addressable storage location that has a faulty bit. Sparing control logic, coupled to the failed address buffer register and adapted to couple to the memory array, reads out each address stored by the failed address buffer register and replaces each faulty bit with a redundant operable bit.
    • 为具有冗余位和可寻址存储位置的存储器阵列提供老化过程。 老化过程包括以下步骤:将存储器阵列的温度升高到预定温度,测试阵列中的所有位,检测故障位和可操作位,用冗余的可操作位代替故障位,校正在 阵列原位,并将存储器阵列的温度降低到环境温度以完成老化过程。 提供了一种用于执行上述处理的装置,其包括用于生成测试图案并将测试图案应用于存储器阵列的测试电路,以便测试存储器阵列内的所有位。 耦合到测试电路并且适于耦合到存储器阵列的比较电路将存储器阵列的实际响应和预期响应与测试模式进行比较,并基于此检测故障和可操作的位。 耦合到比较电路和测试电路的故障地址缓冲寄存器存储具有错误位的每个可寻址存储位置的地址。 冗余控制逻辑耦合到故障地址缓冲寄存器并适于耦合到存储器阵列,读出由故障地址缓冲寄存器存储的每个地址,并用冗余可操作位替换每个故障位。
    • 8. 发明授权
    • Narrow data width DRAM with low latency page-hit operations
    • 狭窄的数据宽度DRAM,具有低延迟页命中操作
    • US5969997A
    • 1999-10-19
    • US942825
    • 1997-10-02
    • Michael P. ClintonMarc R. FaucherErik L. HedbergMark W. KelloggWilbur D. Pricer
    • Michael P. ClintonMarc R. FaucherErik L. HedbergMark W. KelloggWilbur D. Pricer
    • G11C11/41G11C11/401G11C11/407G11C11/409G11C15/00
    • G11C11/409G11C11/407
    • A high speed Random Access Memory (RAM) array device includes several logical banks, each of which can be uniquely addressed. Each of these logical banks contains a unique memory array segment and associated page register, the latter serving as a temporary storage location during high-speed page hit operations. To reduce latency during an initial page hit, further array optimization is realized by segmenting each logical bank into two segments with one, smaller segment, comprising a faster random access memory (FRAM) for storing initial data in a data stream. A high speed page register connects the FRAM directly to a multiplexer/demultiplexer connected to the device I/O ports bypassing an internal bus protocol such that the initial data can be transferred between the FRAM and the I/O ports faster thereby improving page-hit latency. Hence, segmenting the logical banks to include only a small high speed segment results in a performance gain approaching what could be achieved by implementing the entire memory device with a high speed FRAM, but at much lower cost.
    • 高速随机存取存储器(RAM)阵列器件包括几个逻辑存储体,每个逻辑存储体可以被唯一地寻址。 这些逻辑组中的每一个包含唯一的存储器阵列段和相关联的页寄存器,后者在高速页命中操作期间用作临时存储位置。 为了在初始页面命中期间减少延迟,通过将每个逻辑存储体分割成具有一个较小段的两个段来实现进一步的阵列优化,其包括用于在数据流中存储初始数据的更快的随机存取存储器(FRAM)。 高速页寄存器将FRAM直接连接到绕过内部总线协议的设备I / O端口连接的多路复用器/解复用器,从而可以更快地在FRAM和I / O端口之间传输初始数据,从而提高页命中率 潜伏。 因此,将逻辑存储体分割为仅包含小的高速段导致通过以高速FRAM实现整个存储器件而可以以低得多的成本实现可达到的性能增益。