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1. 发明授权

US11004718B2 Sectional porous carrier forming a temporary impervious support 有权
公开(公告)号：US11004718B2
公开(公告)日：2021-05-11
申请号：US16177251
申请日：2018-10-31
申请人： John Cleaon Moore , Alexander Joseph Brewer , Jared Michael Pettit , Alman XiMin Law
发明人： John Cleaon Moore , Alexander Joseph Brewer , Jared Michael Pettit , Alman XiMin Law
IPC分类号： H01L21/683 , B32B17/06 , B32B7/12 , B32B37/12 , B32B37/18 , H01L21/56 , B32B15/02 , B32B37/14 , B32B38/18 , B32B37/00
摘要： Compositions and designs are described for a sectional porous carrier used in processing microelectronics where thin device substrates are affixed by adhesive to the carrier and form an impervious bonded stack that is resistant to thermal and chemical products during processing and is easily handled by a substrate handling vacuum robot, and subsequently allows rapid removal (debonding) in batch operations by directional penetration into sectional porous regions by selective liquids which release the carrier from the device wafer without harm. The invention carrier with porous regions is used for temporary support of thin and fragile device substrates having capabilities of selective penetration of chemical liquids to pass through the porous regions, access and breakdown the bonding adhesive, and allow it to release without damage to the device substrate. The sectional porous nature of the carrier allows passive diffusion of chemical liquids, the manner which in contrast to mechanical, thermal, or radiative methods, is considered to be a higher yield practice and one which enables batch processing in a manufacturing environment utilizing practices of high throughput and low cost. Preferred designs include the use of porous metal forms, including laminates, as well as surface treatment of the porous regions to facilitate exclusion principles and achieve an inert support mechanism during the stages of device manufacture. These benefits allow design flexibility and low-cost batch processing when choosing practices to handle thinned device substrates in the manufacture of semiconductors and other microelectronic devices.

2. 发明申请

US20190074207A1 Sectional Porous Carrier Forming a Temporary Impervious Support 审中-公开
公开(公告)号：US20190074207A1
公开(公告)日：2019-03-07
申请号：US16177251
申请日：2018-10-31
申请人： John Cleaon Moore , Alexander Joseph Brewer , Jared Michael Pettit , Alman XiMin Law
发明人： John Cleaon Moore , Alexander Joseph Brewer , Jared Michael Pettit , Alman XiMin Law
IPC分类号： H01L21/683 , B32B15/02 , B32B17/06 , B32B7/12 , B32B37/12 , B32B37/14 , B32B37/18 , H01L21/56 , B32B37/00 , B32B38/18
摘要： Compositions and designs are described for a sectional porous carrier used in processing microelectronics where thin device substrates are affixed by adhesive to the carrier and form an impervious bonded stack that is resistant to thermal and chemical products during processing and is easily handled by a substrate handling vacuum robot, and subsequently allows rapid removal (debonding) in batch operations by directional penetration into sectional porous regions by selective liquids which release the carrier from the device wafer without harm. The invention carrier with porous regions is used for temporary support of thin and fragile device substrates having capabilities of selective penetration of chemical liquids to pass through the porous regions, access and breakdown the bonding adhesive, and allow it to release without damage to the device substrate. The sectional porous nature of the carrier allows passive diffusion of chemical liquids, the manner which in contrast to mechanical, thermal, or radiative methods, is considered to be a higher yield practice and one which enables batch processing in a manufacturing environment utilizing practices of high throughput and low cost. Preferred designs include the use of porous metal forms, including laminates, as well as surface treatment of the porous regions to facilitate exclusion principles and achieve an inert support mechanism during the stages of device manufacture. These benefits allow design flexibility and low-cost batch processing when choosing practices to handle thinned device substrates in the manufacture of semiconductors and other microelectronic devices.

3. 发明授权

US10147630B2 Sectional porous carrier forming a temporary impervious support 有权
公开(公告)号：US10147630B2
公开(公告)日：2018-12-04
申请号：US14737184
申请日：2015-06-11
申请人： John Cleaon Moore , Alexander Joseph Brewer , Jared Michael Pettit , Alman XiMin Law
发明人： John Cleaon Moore , Alexander Joseph Brewer , Jared Michael Pettit , Alman XiMin Law
IPC分类号： H01L21/683 , B32B17/06 , B32B7/12 , B32B37/12 , B32B37/18 , H01L21/56 , B32B15/02 , B32B37/14 , B32B38/18 , B32B37/00
摘要： Compositions and designs are described for a sectional porous carrier used in processing microelectronics where thin device substrates are affixed by adhesive to the carrier and form an impervious bonded stack that is resistant to thermal and chemical products during processing and is easily handled by a substrate handling vacuum robot, and subsequently allows rapid removal (debonding) in batch operations by directional penetration into sectional porous regions by selective liquids which release the carrier from the device wafer without harm. The invention carrier with porous regions is used for temporary support of thin and fragile device substrates having capabilities of selective penetration of chemical liquids to pass through the porous regions, access and breakdown the bonding adhesive, and allow it to release without damage to the device substrate. The sectional porous nature of the carrier allows passive diffusion of chemical liquids, the manner which in contrast to mechanical, thermal, or radiative methods, is considered to be a higher yield practice and one which enables batch processing in a manufacturing environment utilizing practices of high throughput and low cost. Preferred designs include the use of porous metal forms, including laminates, as well as surface treatment of the porous regions to facilitate exclusion principles and achieve an inert support mechanism during the stages of device manufacture. These benefits allow design flexibility and low-cost batch processing when choosing practices to handle thinned device substrates in the manufacture of semiconductors and other microelectronic devices.

4. 发明申请

US20150364356A1 SECTIONAL POROUS CARRIER FORMING A TEMPORARY IMPERVIOUS SUPPORT 审中-公开
标题翻译：部分多孔载体形成暂时的不利支持
公开(公告)号：US20150364356A1
公开(公告)日：2015-12-17
申请号：US14737184
申请日：2015-06-11
申请人： John Cleaon Moore , Alexander Joseph Brewer , Jared Michael Pettit , Alman XiMin Law
发明人： John Cleaon Moore , Alexander Joseph Brewer , Jared Michael Pettit , Alman XiMin Law
IPC分类号： H01L21/683 , B32B17/06 , B32B15/04 , B32B7/12 , B32B5/02 , B32B37/18 , B32B38/08 , B32B38/18 , B32B43/00 , C09J5/00 , B32B37/12
CPC分类号： H01L21/6835 , B32B7/12 , B32B15/02 , B32B17/061 , B32B17/067 , B32B37/025 , B32B37/12 , B32B37/144 , B32B37/18 , B32B37/187 , B32B2038/1891 , B32B2305/026 , B32B2307/202 , B32B2457/14 , B32B2457/20 , H01L21/568 , H01L2221/68318 , H01L2221/68322 , H01L2221/68327 , H01L2221/68381
摘要： Compositions and designs are described for a sectional porous carrier used in processing microelectronics where thin device substrates are affixed by adhesive to the carrier and form an impervious bonded stack that is resistant to thermal and chemical products during processing and is easily handled by a substrate handling vacuum robot, and subsequently allows rapid removal (debonding) in batch operations by directional penetration into sectional porous regions by selective liquids which release the carrier from the device wafer without harm. The invention carrier with porous regions is used for temporary support of thin and fragile device substrates having capabilities of selective penetration of chemical liquids to pass through the porous regions, access and breakdown the bonding adhesive, and allow it to release without damage to the device substrate. The sectional porous nature of the carrier allows passive diffusion of chemical liquids, the manner which in contrast to mechanical, thermal, or radiative methods, is considered to be a higher yield practice and one which enables batch processing in a manufacturing environment utilizing practices of high throughput and low cost. Preferred designs include the use of porous metal forms, including laminates, as well as surface treatment of the porous regions to facilitate exclusion principles and achieve an inert support mechanism during the stages of device manufacture. These benefits allow design flexibility and low-cost batch processing when choosing practices to handle thinned device substrates in the manufacture of semiconductors and other microelectronic devices.
摘要翻译：描述了用于处理微电子学的部分多孔载体的组成和设计，其中薄的器件衬底通过粘合剂固定到载体上并形成在加工过程中耐受热和化学产物的不可渗透的结合叠层，并且易于由衬底处理真空处理机器人，并且随后允许通过选择性液体方向穿透到截面多孔区域中的批量操作中的快速去除（脱粘），其将载体从装置晶片释放而不受损害。具有多孔区域的本发明载体用于临时支撑具有选择性穿透化学液体以通过多孔区域，进入和击穿粘合粘合剂并且允许其释放而不损坏器件基板的薄且易碎的器件基板。载体的截面多孔性质允许化学液体的被动扩散，与机械，热或辐射方法相反的方式被认为是更高的产量实践，并且使得能够在制造环境中使用高的实践进行批处理吞吐量低廉。优选的设计包括使用多孔金属形式，包括层压材料，以及多孔区域的表面处理以促进排除原理并在器件制造阶段期间实现惰性支撑机构。这些优点允许设计灵活性和低成本批量处理，当选择在半导体和其他微电子器件的制造中处理薄化器件衬底的实践时。

5. 发明授权

US10696874B2 Adhesive with tunable porosity and methods to support temporary bonding applications 有权
公开(公告)号：US10696874B2
公开(公告)日：2020-06-30
申请号：US16256471
申请日：2019-01-24
申请人： John Cleaon Moore , Jared Michael Pettit
发明人： John Cleaon Moore , Jared Michael Pettit
IPC分类号： C09J9/00 , C09J11/08 , C09J11/04 , H01L23/00 , H01L21/683 , B32B7/06 , B32B38/10 , B32B38/00 , C09J5/00 , C08K3/013
摘要： Methods and compositions are described for a temporary adhesive used to affix a work unit onto a carrier substrate whereby its porosity is tuned by choosing and adjusting the polymeric resin and filler components to provide sufficient adhesion to support a manufacturing process, and upon completion, there is advanced penetration of a liquid into the interfacial bond causing release of the work unit without harm. The temporary adhesive provides a tunable porosity that is dependent upon the mathematical calculation of the weight basis ratio of filler to binder, that is preferably greater than 1.0, more preferably greater than 2.0, and most preferably greater than 3.0. The temporary adhesive may be applied and cured in a variety of ways that meet the needs of the form of the work unit and objectives of the manufacturing process. The invention provides benefits of flexibility and reduced cost when establishing practices to handle difficult work units in the manufacture of semiconductors and flat panel displays.

6. 发明申请

US20190169471A1 Adhesive with Tunable Porosity and Methods to Support Temporary Bonding Applications 审中-公开
公开(公告)号：US20190169471A1
公开(公告)日：2019-06-06
申请号：US16256471
申请日：2019-01-24
申请人： John Cleaon Moore , Jared Michael Pettit
发明人： John Cleaon Moore , Jared Michael Pettit
IPC分类号： C09J9/00 , C09J11/08 , C09J11/04 , H01L21/683 , H01L23/00
摘要： Methods and compositions are described for a temporary adhesive used to affix a work unit onto a carrier substrate whereby its porosity is tuned by choosing and adjusting the polymeric resin and filler components to provide sufficient adhesion to support a manufacturing process, and upon completion, there is advanced penetration of a liquid into the interfacial bond causing release of the work unit without harm. The temporary adhesive provides a tunable porosity that is dependent upon the mathematical calculation of the weight basis ratio of filler to binder, that is preferably greater than 1.0, more preferably greater than 2.0, and most preferably greater than 3.0. The temporary adhesive may be applied and cured in a variety of ways that meet the needs of the form of the work unit and objectives of the manufacturing process. The invention provides benefits of flexibility and reduced cost when establishing practices to handle difficult work units in the manufacture of semiconductors and flat panel displays.

7. 发明申请

US20120077132A1 PROCESSESS AND COMPOSITIONS FOR REMOVING SUBSTANCES FROM SUBSTRATES 有权
标题翻译：从基材中除去物质的方法和组合物
公开(公告)号：US20120077132A1
公开(公告)日：2012-03-29
申请号：US12891745
申请日：2010-09-27
申请人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Spencer Erich Hochstetler , Richard Dalton Peters , Rodney Scott Armentrout , Darryl W. Muck
发明人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Spencer Erich Hochstetler , Richard Dalton Peters , Rodney Scott Armentrout , Darryl W. Muck
IPC分类号： G03F7/30
CPC分类号： G03F7/422 , G03F7/425 , G03F7/426 , H01L21/02057 , H01L21/31133
摘要： Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要翻译：提供了可用于从基底去除有机物质的相关设备和组合物的方法，例如电子器件衬底，例如微电子晶片或平板显示器。给出了将最小体积的组合物作为涂层施加到无机基底上的方法，由此加入足够的热量并通过漂洗完全除去有机物质。组合物和方法可适用于去除和在一些情况下完全溶解阳性和阴性品种的光致抗蚀剂以及来自电子设备的热固性聚合物。

8. 发明申请

US20120073607A1 POLYMERIC OR MONOMERIC COMPOSITIONS COMPRISING AT LEAST ONE MONO-AMIDE AND/OR AT LEAST ONE DIAMIDE FOR REMOVING SUBSTANCES FROM SUBSTRATES AND METHODS FOR USING THE SAME 审中-公开
标题翻译：包含至少一个单酰胺和/或至少一个二胺的聚合物或单体组合物用于从基底去除物质及其使用方法
公开(公告)号：US20120073607A1
公开(公告)日：2012-03-29
申请号：US12891698
申请日：2010-09-27
申请人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire , Spencer Erich Hochstetler
发明人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire , Spencer Erich Hochstetler
IPC分类号： B08B3/00 , G03F7/42
CPC分类号： C09D4/06 , C09D9/005 , C11D3/378 , C11D7/263 , C11D7/3218 , C11D11/0047 , C11D11/0058
摘要： Compositions and methods useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Methods are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. The compositions and methods may be suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要翻译：提供了可用于从基板去除有机物质的组合物和方法，例如电子器件基底如微电子晶片或平板显示器。给出了将最小体积的组合物作为涂层施加到无机基底上的方法，由此加入足够的热量并立即用水冲洗以实现完全去除。组合物和方法可适用于除去和完全溶解正极和负极品种的光致抗蚀剂以及来自电子器件的热固性聚合物。

9. 发明申请

US20100242998A1 COMPOSITIONS AND METHODS FOR REMOVING ORGANIC SUBSTANCES 失效
标题翻译：用于去除有机物质的组合物和方法
公开(公告)号：US20100242998A1
公开(公告)日：2010-09-30
申请号：US12413085
申请日：2009-03-27
申请人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore
发明人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore
IPC分类号： B08B3/08 , G03F7/42
CPC分类号： C08L81/00 , C11D7/34 , C11D7/5022 , C11D11/0047 , G03F7/423 , G03F7/425 , G03F7/426
摘要： Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要翻译：提供了可用于从基底去除有机物质的组合物和方法，例如电子器件基底如微电子晶片或平板显示器。提出了一种方法，其将组合物的最小体积作为涂层施加到无机基底上，由此添加足够的热量并立即用水冲洗以实现完全去除。这些组合物和方法特别适用于从电子装置中除去和完全溶解正极和负极品种的光致抗蚀剂以及热固性聚合物。

10. 发明申请

US20100151118A1 CARRIER SOLVENT COMPOSITIONS, COATINGS COMPOSITIONS, AND METHODS TO PRODUCE THICK POLYMER COATINGS 审中-公开
标题翻译：载体溶剂组合物，涂料组合物和生产厚聚合物涂料的方法
公开(公告)号：US20100151118A1
公开(公告)日：2010-06-17
申请号：US12336593
申请日：2008-12-17
申请人： Michael Wayne Quillen , Loady Palmer Holbrook, JR. , Stephanie Ann Roane , Dale Edward O'Dell , John Cleaon Moore
发明人： Michael Wayne Quillen , Loady Palmer Holbrook, JR. , Stephanie Ann Roane , Dale Edward O'Dell , John Cleaon Moore
IPC分类号： B05D5/12 , C09K3/00 , C08K5/101 , C08K5/07
CPC分类号： G03F7/0048
摘要： Compositions and methods useful for the coating of polymeric materials onto substrates, for example, electronic device substrates such as semiconductor wafers, are provided. These compositions and methods are particularly suitable manipulating thickness of a polymeric coating in a single coating event. Such methods to control photoresist thickness are used to facilitate the layering of electronic circuitry in a three-dimensional fashion. Furthermore, the compositions of the present invention may be effectively used to deposit thick films of polymeric material in a uniform manner onto inorganic substrates which provides a significant benefit over conventional systems.
摘要翻译：提供了可用于将聚合物材料涂覆到基底上的组合物和方法，例如电子器件基底如半导体晶片。这些组合物和方法特别适合于在单一涂层事件中操纵聚合物涂层的厚度。用于控制光致抗蚀剂厚度的这种方法用于促进以三维方式分层电子电路。此外，本发明的组合物可以有效地用于以均匀的方式将聚合物材料的厚膜沉积到无机基底上，这提供了比传统系统显着的益处。

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