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1. 发明申请

US20050035025A1 Method of and device for packaging electronic components thus packaged 失效
标题翻译：用于包装如此包装的电子部件的方法和装置
公开(公告)号：US20050035025A1
公开(公告)日：2005-02-17
申请号：US10497644
申请日：2002-11-25
申请人： Johannes Wilhelmus Bosch
发明人： Johannes Wilhelmus Bosch
IPC分类号： B65B15/04 , H05K13/00 , B65D85/00
CPC分类号： H05K13/003
摘要： The invention relates to a method of packaging an electronic component (1), preferably a semiconductor device (1), whereby the component (1) is positioned in a cavity (3) of a foil (4) by tweezers (2) and is supported or fixed by means of a further foil (5) which is attached to the foil (4) at one side thereof. According to the invention, the component (1) is first placed (2) into the cavity (3) of the foil (4) by the tweezers, and only after that is the further foil (5) positioned adjacent thereto and attached to the foil (4). In this way, the tweezers (2) can be moved through the foil (4) in order to pick up the component (1), hold it, and move it into the cavity (3). The method thus requires only little space and can be performed fast and reliably. Preferably, the component (1) is temporarily supported by supporting means (6) after being positioned in the cavity (3) and before being attached to the further foil (5), and the foil (4) with the component (1) is moved in a longitudinal direction (L) of the foil (4). The invention further relates to an apparatus (10) for performing the method according to the invention as well as a packaged component (12) obtained therewith.
摘要翻译：本发明涉及包装电子部件（1）的方法，优选半导体器件（1），由此通过镊子（2）将部件（1）定位在箔（4）的空腔（3）中，并且是通过在其一侧附接到箔（4）的另外的箔（5）来支撑或固定。根据本发明，组件（1）首先通过镊子（2）放置到箔（4）的空腔（3）中，并且之后是与其相邻定位的另外的箔片（5），并附接到箔（4）。以这种方式，镊子（2）可以移动通过箔片（4），以便拾取部件（1），将其保持并将其移动到空腔（3）中。因此，该方法仅需要很小的空间并且可以快速可靠地执行。优选地，组件（1）在定位在空腔（3）中之后并且在附接到另外的箔（5）之前由支撑装置（6）暂时支撑，并且具有部件（1）的箔（4）是沿着箔（4）的纵向方向（L）移动。本发明还涉及一种用于执行根据本发明的方法的装置（10）以及由其获得的包装部件（12）。

2. 发明申请

US20070137031A1 Chip transfer method and apparatus 有权
标题翻译：芯片传输方法和装置
公开(公告)号：US20070137031A1
公开(公告)日：2007-06-21
申请号：US10561397
申请日：2003-12-11
申请人： Johannes Wilhelmus Bosch , Wilhelmus Johannus Derks , Antonius Kamphuis , Thomas Kampschreur , Joep Stokkermans , Leon Wetzels
发明人： Johannes Wilhelmus Bosch , Wilhelmus Johannus Derks , Antonius Kamphuis , Thomas Kampschreur , Joep Stokkermans , Leon Wetzels
IPC分类号： B23Q7/00 , B29C63/00
CPC分类号： H01L21/67144 , Y10T29/49121 , Y10T29/4913 , Y10T29/49133 , Y10T29/53174 , Y10T29/53178 , Y10T156/1978
摘要： In a chip transferring apparatus a wafer (44) and a lead frame (50) are positioned. A first chip (42) is picked up from the wafer (44) by a transfer head (14; 40a-40d) in a chip pick-up position, while bonding a second chip to the lead frame (50) by another transfer head in a chip bonding position. The first chip (42) is then transferred by said one of the transfer heads from the chip pick-up position to the chip bonding position. Next, the first chip (42) is bonded on the lead frame (50) by said one of the transfer heads (14; 40a-40d) in the chip bonding position, while another one of the transfer heads picks up a third chip from the wafer (44) in the chip pick-up position. Each transfer head (14; 40a-40d) comprises a collet (66a-66d) which, through a mechanical coupling, is coupled to another collet for compensating radial forces exerted on the collet relative to said axis of rotation. Vacuum is transferred to the collet from a stationary pressure source by groove sections (106) in a transfer assembly stator (100) communicating through a gap (104) between the rotatable transfer assembly (32) and the transfer assembly stator (100) with gas ducts in the transfer head (14; 40a-40d) and the corresponding collet (66a-66d). A chip (42) is picked up from a wafer (44) by a needle mechanism (224).
摘要翻译：在芯片传送装置中，定位晶片（44）和引线框架（50）。第一芯片（42）通过转移头（14; 40a至40d）从芯片拾取位置从晶片（44）拾取，同时将第二芯片连接到引线框架（50）另一个转印头处于芯片粘合位置。然后，第一芯片（42）由所述一个转印头从芯片拾取位置转移到芯片粘合位置。接下来，第一芯片（42）通过芯片接合位置中的所述一个转印头（14; 40a至40d）接合在引线框架（50）上，而另一个转印头拾取第三个从芯片拾取位置的晶片（44）芯片。每个传送头（14; 40a至40d）包括夹头（66a-66d），其通过机械联接件联接到另一夹头，用于补偿相对于所述旋转轴线施加在夹头上的径向力。真空通过传送组件定子（100）中的凹槽部分（106）从固定压力源传送到夹头，该定子（100）通过气体与可转动传递组件（32）和传送组件定子（100）之间的间隙（104）连通，传送头（14; 40 a至40 d）中的管道和相应的夹头（66 a至66 d）。通过针机构（224）从晶片（44）拾取芯片（42）。

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