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1. 发明授权

US09052613B2 Displacement device, lithographic apparatus and positioning method 有权
标题翻译：位移装置，光刻设备和定位方法
公开(公告)号：US09052613B2
公开(公告)日：2015-06-09
申请号：US13105748
申请日：2011-05-11
申请人： Johannes Hubertus Antonius Van de Rijdt , Joost Jeroen Ottens , Marcus Martinus Petrus Adrianus Vermeulen , Erik Johannes Antonius Manders
发明人： Johannes Hubertus Antonius Van de Rijdt , Joost Jeroen Ottens , Marcus Martinus Petrus Adrianus Vermeulen , Erik Johannes Antonius Manders
IPC分类号： G03B27/58 , G03F7/20 , H02K41/03
CPC分类号： G03F7/70758 , H02K41/03
摘要： A displacement device with a first and second part which are displaceable relative to one another, the first part being provided with a system of magnets, the second part being provided with a set of coil block units including: at least three first coil block units having current conductors oriented parallel to a second direction, at least two second coil block units having current conductors oriented parallel to a first direction, wherein the displacement device includes a controller configured to control the position of the second part relative to the first part, and wherein when the second part mainly moves in the second direction the controller is configured to levitate the second part from the first part in the third direction by using first coil block units only.
摘要翻译：一种具有第一和第二部分的位移装置，其相对于彼此可移动，所述第一部分设置有磁体系统，所述第二部分设置有一组线圈块单元，所述一组线圈块单元包括：至少三个第一线圈块单元，电流导体平行于第二方向定向，至少两个第二线圈块单元，其具有平行于第一方向定向的电流导体，其中所述位移装置包括被配置为控制所述第二部分相对于所述第一部分的位置的控制器，并且其中当第二部分主要在第二方向上移动时，控制器被配置为仅通过使用第一线圈块单元从第一部分沿第三方向悬浮第二部分。

2. 发明申请

US20130097835A1 METHOD FOR PLACING A COMPONENT ON A SUBSTRATE 有权
标题翻译：在基板上放置元件的方法
公开(公告)号：US20130097835A1
公开(公告)日：2013-04-25
申请号：US13713539
申请日：2012-12-13
申请人： Johannes Hubertus Antonius Van de Rijdt
发明人： Johannes Hubertus Antonius Van de Rijdt
IPC分类号： B23P19/04
CPC分类号： B23P19/04 , H05K13/0413 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49139 , Y10T29/4978 , Y10T29/53022 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： A method is provided for placing a component on a substrate. The method uses a component feeding device and a component pick-and-place device to place a component on a substrate.
摘要翻译：提供了一种将组分放置在基底上的方法。该方法使用部件供给装置和部件拾取和放置装置将部件放置在基板上。

3. 发明授权

US08341827B2 Device for placing a component on a substrate 有权
标题翻译：用于将部件放置在基板上的装置
公开(公告)号：US08341827B2
公开(公告)日：2013-01-01
申请号：US12759478
申请日：2010-04-13
申请人： Johannes Hubertus Antonius Van de Rijdt
发明人： Johannes Hubertus Antonius Van de Rijdt
IPC分类号： B23P19/00
CPC分类号： B23P19/04 , H05K13/0413 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49139 , Y10T29/4978 , Y10T29/53022 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： A device suitable for placing a component on a substrate is provided with a component feeding device, a component pick-and-place device comprising a nozzle, a substrate carrier, means for moving the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. A global measuring system is provided for determining the position of the component pick-and-place device during movement of the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. The device is further provided with a local measuring system, remote from the global measuring system, for almost continually determining, in the proximity of a desired position of the component on the substrate, the position of the component pick-and-place device with respect to the substrate. The local measuring system is located closer to the substrate carrier than the global measuring system.
摘要翻译：一种适用于将元件放置在基板上的装置设置有元件供给装置，包括喷嘴的元件拾取和放置装置，基板载体，用于将元件拾取和放置装置从元件供给装置到基板载体，反之亦然。提供了一种全局测量系统，用于在部件拾取和放置装置从部件供给装置移动到基板载体的过程中确定部件拾取和放置装置的位置，反之亦然。该装置还设置有远离全局测量系统的本地测量系统，用于几乎连续地确定在基板上的部件的期望位置附近，部件拾取和放置装置的位置相对于到基底。本地测量系统比全球测量系统更靠近基板载体。

4. 发明授权

US09009957B2 Method for placing a component on a substrate 有权
标题翻译：将部件放置在基板上的方法
公开(公告)号：US09009957B2
公开(公告)日：2015-04-21
申请号：US13713539
申请日：2012-12-13
申请人： Johannes Hubertus Antonius Van de Rijdt
发明人： Johannes Hubertus Antonius Van de Rijdt
IPC分类号： H05K3/30 , B23P19/04 , H05K13/04
CPC分类号： B23P19/04 , H05K13/0413 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49139 , Y10T29/4978 , Y10T29/53022 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： A method is provided for placing a component on a substrate. The method uses a component feeding device and a component pick-and-place device to place a component on a substrate.
摘要翻译：提供了一种将组分放置在基底上的方法。该方法使用部件供给装置和部件拾取和放置装置将部件放置在基板上。

5. 发明申请

US20100257731A1 Device Suitable for Placing a Component on a Substrate, as well as Such a Method 有权
标题翻译：适用于将元件放置在基板上的装置，以及这种方法
公开(公告)号：US20100257731A1
公开(公告)日：2010-10-14
申请号：US12759478
申请日：2010-04-13
申请人： Johannes Hubertus Antonius Van de Rijdt
发明人： Johannes Hubertus Antonius Van de Rijdt
IPC分类号： H05K13/04 , H05K3/30
CPC分类号： B23P19/04 , H05K13/0413 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49139 , Y10T29/4978 , Y10T29/53022 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： A device suitable for placing a component on a substrate is provided with a component feeding device, a component pick-and-place device comprising a nozzle, a substrate carrier, means for moving the component pick-and-place device from the component feeding device to the substrate carrier and vice versa, as well as a global measuring system for determining the position of the component pick-and-place device during movement of the component pick-and-place device from the component feeding device to the substrate carrier and vice versa. The device is further provided with a local measuring system, remote from the global measuring system, for almost continually determining, in the proximity of a desired position of the component on the substrate, the position of the component pick-and-place device with respect to the substrate, which local measuring system is located closer to the substrate carrier than the global measuring system.
摘要翻译：一种适用于将元件放置在基板上的装置设置有元件供给装置，包括喷嘴的元件拾取和放置装置，基板载体，用于将元件拾取和放置装置从元件供给装置到基板载体，反之亦然，以及一个全局测量系统，用于确定部件拾取和放置装置在部件拾取和放置装置从元件供给装置移动到基板载体和副部件移动期间的位置反之亦然。该装置还设置有远离全局测量系统的本地测量系统，用于几乎连续地确定在基板上的部件的期望位置附近，部件拾取和放置装置的位置相对于到本地测量系统位于比全球测量系统更靠近衬底载体的衬底上。

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