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1. 发明授权

US4857383A Synthetic substrate with adhesive metal layer 失效
标题翻译：具有粘合金属层的合成基材
公开(公告)号：US4857383A
公开(公告)日：1989-08-15
申请号：US119272
申请日：1987-11-09
申请人： Johann Greschner , Friedrich W. Schwerdt , Hans J. Trumpp
发明人： Johann Greschner , Friedrich W. Schwerdt , Hans J. Trumpp
IPC分类号： H05K3/16 , B29C59/14 , G03F7/00 , G03F7/11 , H05K3/00 , H05K3/18 , H05K3/38
CPC分类号： B29C59/14 , G03F7/00 , G03F7/11 , H05K3/0041 , H05K3/381 , H05K2201/0166 , H05K2201/2072 , H05K3/388 , Y10S428/901 , Y10T428/24479 , Y10T428/24521 , Y10T428/24612 , Y10T428/24917 , Y10T428/24942 , Y10T428/31
摘要： A method of improving the adhesion between a synthetic substrate and metallized layers deposited thereon. A glass resin layer is spin-coated onto an epoxide substrate. The glass layer is covered by a photoresist layer which is roughened by reactive ion etching. The roughened contour of the photoresist layer is transferred via reactive ion etching to form a perforation pattern in the glass layer. The substrate is then etched vertically and horizontally to produce recesses in the substrate having overhanging walls. A thin copper layer is sputtered onto the substrate and copper conductors are sputtered onto the thin copper layer, the copper layers filling the recesses. The recesses and overhangs form mortices in the substrate, and the copper layers within the recess form tenons which fittingly engage with the mortices to produce adhesion between the substrate and the metallized layers in the order of 1000 n/m.
摘要翻译：一种改善合成基底和沉积在其上的金属化层之间的粘附性的方法。将玻璃树脂层旋涂在环氧树脂基材上。玻璃层被通过反应离子蚀刻而粗糙化的光致抗蚀剂层覆盖。通过反应离子蚀刻转移光致抗蚀剂层的粗糙轮廓，以在玻璃层中形成穿孔图案。然后垂直和水平地蚀刻衬底，以在具有悬垂壁的衬底中产生凹陷。将薄铜层溅射到基板上，并将铜导体溅射到薄铜层上，铜层填充凹槽。凹陷和突出部在基底中形成榫眼，并且凹槽内的铜层形成与榫眼嵌合的榫头，以在基板和金属化层之间产生约1000n / m的粘合力。

2. 发明授权

US4642163A Method of making adhesive metal layers on substrates of synthetic material and device produced thereby 失效
标题翻译：在合成材料的基材上制造粘合金属层的方法和由此制备的装置
公开(公告)号：US4642163A
公开(公告)日：1987-02-10
申请号：US547553
申请日：1983-10-31
申请人： Johann Greschner , Friedrich W. Schwerdt , Hans J. Trumpp
发明人： Johann Greschner , Friedrich W. Schwerdt , Hans J. Trumpp
IPC分类号： H05K3/16 , B29C59/14 , G03F7/00 , G03F7/11 , H05K3/00 , H05K3/18 , H05K3/38 , B44C1/22 , B05D3/00
CPC分类号： B29C59/14 , G03F7/00 , G03F7/11 , H05K3/0041 , H05K3/381 , H05K2201/0166 , H05K2201/2072 , H05K3/388 , Y10S428/901 , Y10T428/24479 , Y10T428/24521 , Y10T428/24612 , Y10T428/24917 , Y10T428/24942 , Y10T428/31
摘要： A method of improving the adhesion between a synthetic substrate and metallized layers deposited thereon. A glass resin layer is spin-coated onto an epoxide substrate. The glass layer is covered by a photoresist layer which is roughened by reactive ion etching. The roughened contour of the photoresist layer is transferred via reactive ion etching to form a perforation pattern in the glass layer. The substrate is then etched vertically and horizontally to produce recesses in the substrate having overhanging walls. A thin copper layer is sputtered onto the substrate and copper conductors are sputtered onto the thin copper layer, the copper layers filling the recesses. The recesses and overhangs form mortices in the substrate, and the copper layers within the recess form tenons which fittingly engage with the mortices to produce adhesion between the substrate and the metallized layers in the order of 1000 n/m.
摘要翻译：一种改善合成基底和沉积在其上的金属化层之间的粘附性的方法。将玻璃树脂层旋涂在环氧树脂基材上。玻璃层被通过反应离子蚀刻而粗糙化的光致抗蚀剂层覆盖。通过反应离子蚀刻转移光致抗蚀剂层的粗糙轮廓，以在玻璃层中形成穿孔图案。然后垂直和水平地蚀刻衬底，以在具有悬垂壁的衬底中产生凹陷。将薄铜层溅射到基板上，并将铜导体溅射到薄铜层上，铜层填充凹槽。凹陷和突出部在基底中形成榫眼，并且凹槽内的铜层形成与榫眼嵌合的榫头，以在基板和金属化层之间产生约1000n / m的粘合力。

3. 发明授权

US4556628A Process for producing printed circuit boards with metallic conductor structures embedded in the insulating substrate 失效
标题翻译：用于制造嵌入绝缘基板中的金属导体结构的印刷电路板的制造方法
公开(公告)号：US4556628A
公开(公告)日：1985-12-03
申请号：US600063
申请日：1984-04-13
申请人： Johann Greschner , Friedrich W. Schwerdt , Hans J. Trumpp
发明人： Johann Greschner , Friedrich W. Schwerdt , Hans J. Trumpp
IPC分类号： H05K3/42 , H05K3/00 , H05K3/02 , H05K3/04 , H05K3/10 , H05K3/16 , H05K3/24 , H05K3/40 , G03C5/00
CPC分类号： H05K3/0041 , H05K3/048 , H05K3/107 , H05K2201/0347 , H05K2201/0376 , H05K2201/09036 , H05K2203/0554 , H05K2203/0585 , H05K2203/072 , H05K2203/095 , H05K3/108 , H05K3/16 , H05K3/244 , H05K3/426
摘要： A process for producing printed circuit boards having metallic conductor structures embedded in the insulating substrate and whose front and back sides are conductively connected by means of plated through holes. The first steps of the process comprise producing a matrix on an epoxy resin substrate consisting of a lift-off layer, an aluminum barrier layer and a positive photoresist layer. A negative image of the desired conductor pattern is then generated in the photoresist layer using conventional photolithographic techniques. The negative image is etched into the barrier layer and the lift-off layer such that an undercut occurs under the barrier layer. Subsequently, vertical trenches are etched into the epoxy resin substrate. After drilling of the through holes, an activating layer of copper is deposited by means of magnetic field enhanced cathode sputtering on the surfaces of the trenches, the through holes and the barrier layer. The lift-off layer, together with the barrier layer covering it, is removed by immersion in a suitable solvent, and copper conductors are subsequently grown in the etched conductor trenches.
摘要翻译：一种用于制造印刷电路板的方法，该印刷电路板具有嵌入绝缘基板中的金属导体结构，其前侧和后侧通过电镀通孔导电连接。该方法的第一步包括在由剥离层，铝阻挡层和正性光致抗蚀剂层组成的环氧树脂基材上制备基质。然后使用常规光刻技术在光致抗蚀剂层中产生所需导体图案的负像。负像被蚀刻到阻挡层和剥离层中，使得在阻挡层下方发生底切。随后，将垂直沟槽蚀刻到环氧树脂基板中。在通孔钻孔之后，通过磁场强化阴极溅射在沟槽，通孔和阻挡层的表面上沉积铜的激活层。剥离层与覆盖它的阻挡层一起通过浸入合适的溶剂中除去，然后在蚀刻的导体沟槽中生长铜导体。

4. 发明授权

US4521280A Method of making printed circuits with one conductor plane 失效
标题翻译：用一根导体平面制作印刷电路的方法
公开(公告)号：US4521280A
公开(公告)日：1985-06-04
申请号：US616342
申请日：1984-06-01
申请人： Dieter K. Bahrle , Friedrich W. Schwerdt
发明人： Dieter K. Bahrle , Friedrich W. Schwerdt
IPC分类号： B32B5/18 , B32B15/08 , H05K3/04 , H05K3/38 , H05K3/40 , H05K3/42 , H05K3/46 , C25D5/02 , C25D7/00
CPC分类号： H05K3/4076 , H05K3/048 , H05K3/426 , H05K2203/1152 , H05K3/381 , Y10T29/49124
摘要： A method of making printed circuits, where on both sides sacrificial foils are laminated onto a synthetic resin prepreg. Through-holes are drilled. The copper foil is subsequently etched off. A negative photoresist foil is laminated on the prepreg surface roughened by etched-off copper dendrites. The foil is exposed and developed in accordance with the respective conductive pattern. Subsequently, copper is sputtered onto the surface of the photoresist, the surface and the bottom of the photoresist channels defining the conductors, and onto the surface of the drilled holes by means of magnetron-enhanced cathode sputtering. The copper sputtered onto the surface of the photoresist is removed by means of a scrubbing roller. Then, copper is deposited in accordance with the additive process on the copper sputtered in the photoresist channels and the drilled holes. After the stripping of the photoresist, the printed circuit is completed.
摘要翻译：一种制造印刷电路的方法，其中在两侧将牺牲箔层压在合成树脂预浸料上。穿孔穿孔。随后蚀刻铜箔。通过蚀刻的铜枝晶，在预浸渍体表面上层压负性光致抗蚀剂层。根据相应的导电图案将箔曝光和显影。随后，将铜溅射到光致抗蚀剂的表面上，光刻胶通道的表面和底部限定导体，并通过磁控管增强的阴极溅射溅射到钻孔的表面上。溅射到光致抗蚀剂表面上的铜通过洗涤辊除去。然后，根据在光致抗蚀剂通道和钻孔中溅射的铜上的添加方法沉积铜。剥离光刻胶后，完成印刷电路。

5. 发明授权

UST954010I4 Method of coating oxidized inorganic substrates with polyimide 失效
标题翻译：用聚酰亚胺涂覆氧化无机基材的方法
公开(公告)号：UST954010I4
公开(公告)日：1977-01-04
申请号：US687965
申请日：1976-05-19
申请人： Friedrich C. Brunner , Peter U. Frasch , Friedrich W. Schwerdt , Theodor P. Vogtmann
发明人： Friedrich C. Brunner , Peter U. Frasch , Friedrich W. Schwerdt , Theodor P. Vogtmann
IPC分类号： B05D5/12 , B05D7/26 , C03C17/30 , C03C17/32 , H01B3/30 , H01L23/29 , H05K1/03 , H05K3/38 , H05K3/46
CPC分类号： B05D5/12 , B05D7/26 , C03C17/30 , C03C17/32 , C03C2218/31 , H01B3/306 , H01L23/293 , H01L2924/0002 , H05K1/0346 , H05K3/389 , H05K3/4644 , Y10T428/31663 , Y10T428/31681 , H01L2924/00
摘要： substrates with oxidized surfaces, as e.g. SiO.sub.2 layers on silicon semiconductors and aluminum surfaces, are wetted with an organic silicon compound, for example, .gamma.-aminopropyltriethoxysilane dissolved in an organic solvent such as trichlorotrifluoro ethane. The solvent is then removed in a dry atmosphere. The evaporation step can be carried out by suspending the substrate in volvent vapor over a supply of refluxing solvent while cooling the solvent vapor such that fresh, dry solvent vapor continuously passes along the substrate and absorbs traces of moisture. Subsequently, a coating is applied from a solution of a polyamido carbon acid formed of pyromellitic acid anhydride and an aromatic amino component and the polyamido carbon acid is heated to form an adherent layer of polyimide.

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