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    • 4. 发明授权
    • Lithography using self-assembled polymers
    • 使用自组装聚合物进行平版印刷
    • US08828253B2
    • 2014-09-09
    • US13816720
    • 2011-07-21
    • Roelof KooleJohan Frederik DijksmanSander Frederik WuisterEmiel Peeters
    • Roelof KooleJohan Frederik DijksmanSander Frederik WuisterEmiel Peeters
    • B44C1/22B81C1/00H01L21/033
    • B44C1/227B81C1/00031B81C2201/0149B81C2201/0198G03F7/0002H01L21/0337
    • A method of lithography on a substrate uses a self-assembled polymer (SAP) layer deposited on the substrate, with first and second domains arranged in a pattern across the layer. A planarization layer is formed over the SAP and a development etch applied to substantially remove a portion of the planarization layer over the second domain leaving a cap of the planarization layer substantially covering the first domain. The uncapped second domain is then removed from the surface by a breakthrough etch leaving the capped first domain as a pattern feature on the surface. A transfer etch may then be used to transfer the pattern feature to the substrate using the capped first domain. The capping allows the second domain to be removed, e.g., without excessive loss of lateral feature width for the remaining first domain, even when the difference in etch resistance between the first and second domains is small.
    • 衬底上的光刻方法使用沉积在衬底上的自组装聚合物(SAP)层,其中第一和第二畴以整个层的图案排列。 平坦化层形成在SAP之上,并且显影蚀刻被施加以在第二域上基本上去除平坦化层的一部分,留下平坦化层的盖基本覆盖第一域。 然后通过穿透蚀刻从表面除去未封端的第二结构域,留下封盖的第一结构域作为表面上的图案特征。 然后可以使用转移蚀刻来使用封盖的第一结构域将图案特征转移到衬底。 封盖允许除去第二结构域,例如即使当第一和第二畴之间的耐蚀刻性差异小时,也不会对剩余的第一区域的横向特征宽度过度损失。
    • 5. 发明申请
    • LITHOGRAPHY USING SELF-ASSEMBLED POLYMERS
    • 使用自组装聚合物的光刻
    • US20130140272A1
    • 2013-06-06
    • US13816720
    • 2011-07-21
    • Roelof KooleJohan Frederik DijksmanSander Frederik WuisterEmiel Peeters
    • Roelof KooleJohan Frederik DijksmanSander Frederik WuisterEmiel Peeters
    • B44C1/22
    • B44C1/227B81C1/00031B81C2201/0149B81C2201/0198G03F7/0002H01L21/0337
    • A method of lithography on a substrate uses a self-assembled polymer (SAP) layer deposited on the substrate, with first and second domains arranged in a pattern across the layer. A planarization layer is formed over the SAP and a development etch applied to substantially remove a portion of the planarization layer over the second domain leaving a cap of the planarization layer substantially covering the first domain. The uncapped second domain is then removed from the surface by a breakthrough etch leaving the capped first domain as a pattern feature on the surface. A transfer etch may then be used to transfer the pattern feature to the substrate using the capped first domain. The capping allows the second domain to be removed, e.g., without excessive loss of lateral feature width for the remaining first domain, even when the difference in etch resistance between the first and second domains is small.
    • 衬底上的光刻方法使用沉积在衬底上的自组装聚合物(SAP)层,其中第一和第二畴以整个层的图案排列。 平坦化层形成在SAP之上,并且显影蚀刻被施加以在第二域上基本上去除平坦化层的一部分,留下平坦化层的盖基本覆盖第一域。 然后通过穿透蚀刻从表面除去未封端的第二结构域,留下封盖的第一结构域作为表面上的图案特征。 然后可以使用转移蚀刻来使用封盖的第一结构域将图案特征转移到衬底。 封盖允许除去第二结构域,例如,即使当第一和第二畴之间的耐蚀刻性差异小时,也不会对剩余的第一区域的横向特征宽度过度损失。