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1. 发明授权

US08231795B2 Micromachined horn 有权
标题翻译：微加工喇叭
公开(公告)号：US08231795B2
公开(公告)日：2012-07-31
申请号：US12434092
申请日：2009-05-01
申请人： David Martin , Joel Philliber , John Choy
发明人： David Martin , Joel Philliber , John Choy
IPC分类号： B81C1/00
CPC分类号： H04R1/30 , H01L27/20 , H04R17/005 , H04R2201/003 , Y10T29/42
摘要： An acoustic device includes a transducer formed on a first surface of a substrate and an acoustic horn formed in the substrate by a dry-etching process through an opposing second surface of the substrate. The acoustic horn is positioned to amplify sound waves from the transducer and defines a non-linear cross-sectional profile.
摘要翻译：声学装置包括通过基板的相对的第二表面的干蚀刻工艺形成在基板的第一表面上的换能器和形成在基板中的声喇叭。声喇叭被定位成放大来自换能器的声波并且限定非线性横截面轮廓。

2. 发明授权

US07888844B2 Temperature control of micromachined transducers 有权
标题翻译：微加工传感器的温度控制
公开(公告)号：US07888844B2
公开(公告)日：2011-02-15
申请号：US12570298
申请日：2009-09-30
申请人： David Martin , Donald Lee , John Choy , Joel Philliber , Osvaldo Buccafusca
发明人： David Martin , Donald Lee , John Choy , Joel Philliber , Osvaldo Buccafusca
IPC分类号： H01L41/08
CPC分类号： B81B3/0072 , B06B1/0625 , B06B1/0666 , B81B2201/0257 , B81B2201/0271 , G10K9/125 , G10K9/18 , H01L41/0973 , H01L41/31 , H04R17/02 , H04R31/00 , Y10T29/42
摘要： A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.
摘要翻译：微加工结构包括衬底和衬底中的空腔。微加工结构包括设置在衬底上并跨越空腔的膜层。

3. 发明授权

US09088850B2 Micromachined horn 有权
标题翻译：微加工喇叭
公开(公告)号：US09088850B2
公开(公告)日：2015-07-21
申请号：US13536917
申请日：2012-06-28
申请人： David Martin , Joel Philliber , John Choy
发明人： David Martin , Joel Philliber , John Choy
IPC分类号： H04R1/30 , H01L27/20 , H04R17/00
CPC分类号： H04R1/30 , H01L27/20 , H04R17/005 , H04R2201/003 , Y10T29/42
摘要： An acoustic device includes a transducer formed on a first surface of a substrate and an acoustic horn formed in the substrate by a dry-etching process through an opposing second surface of the substrate. The acoustic horn is positioned to amplify sound waves from the transducer and defines a non-linear cross-sectional profile.
摘要翻译：声学装置包括通过基板的相对的第二表面的干蚀刻工艺形成在基板的第一表面上的换能器和形成在基板中的声喇叭。声喇叭被定位成放大来自换能器的声波并且限定非线性横截面轮廓。

4. 发明授权

US08981624B2 Temperature control of micromachined transducers 有权
标题翻译：微加工传感器的温度控制
公开(公告)号：US08981624B2
公开(公告)日：2015-03-17
申请号：US12978762
申请日：2010-12-27
申请人： David Martin , Donald Lee , John Choy , Joel Philliber , Osvaldo Buccafusca
发明人： David Martin , Donald Lee , John Choy , Joel Philliber , Osvaldo Buccafusca
IPC分类号： H01L41/09 , B81B3/00 , G10K9/125 , G10K9/18 , H04R17/02 , H04R31/00 , H01L41/31
CPC分类号： B81B3/0072 , B06B1/0625 , B06B1/0666 , B81B2201/0257 , B81B2201/0271 , G10K9/125 , G10K9/18 , H01L41/0973 , H01L41/31 , H04R17/02 , H04R31/00 , Y10T29/42
摘要： A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.
摘要翻译：微加工结构包括衬底和衬底中的空腔。微加工结构包括设置在衬底上并跨越空腔的膜层。

5. 发明申请

US20100327702A1 TEMPERATURE CONTROL OF MICROMACHINED TRANSDUCERS 有权
标题翻译：微型传感器的温度控制
公开(公告)号：US20100327702A1
公开(公告)日：2010-12-30
申请号：US12570298
申请日：2009-09-30
申请人： David Martin , Donald Lee , John Choy , Joel Philliber , Osvaldo Buccafusca
发明人： David Martin , Donald Lee , John Choy , Joel Philliber , Osvaldo Buccafusca
IPC分类号： H01L41/04 , H01L41/22
CPC分类号： B81B3/0072 , B06B1/0625 , B06B1/0666 , B81B2201/0257 , B81B2201/0271 , G10K9/125 , G10K9/18 , H01L41/0973 , H01L41/31 , H04R17/02 , H04R31/00 , Y10T29/42
摘要： A micromachined structure, comprises a substrate and a cavity in the substrate. The micromachined structure comprises a membrane layer disposed over the substrate and spanning the cavity.
摘要翻译：微加工结构包括衬底和衬底中的空腔。微加工结构包括设置在衬底上并跨越空腔的膜层。

6. 发明授权

US08280080B2 Microcap acoustic transducer device 有权
标题翻译：微型声学传感器装置
公开(公告)号：US08280080B2
公开(公告)日：2012-10-02
申请号：US12430966
申请日：2009-04-28
申请人： Joel Philliber , John Choy , David Martin
发明人： Joel Philliber , John Choy , David Martin
IPC分类号： H04R25/00 , H04R9/08 , H04R11/04 , H04R17/02 , H04R19/04 , H04R21/02 , H04R1/02
CPC分类号： H04R31/00
摘要： A device includes a first wafer, a second wafer, a gasket bonding the first wafer to the second wafer to define a cavity between the first wafer and the second wafer, and an acoustic transducer disposed on the first wafer and disposed within the cavity between the first wafer and the second wafer. One or more apertures are provided for communicating an acoustic signal between the acoustic transducer and an exterior of the device. An aperture may be formed in the cavity itself, or the cavity may be hermetically sealed. An aperture may be formed completely through the first wafer and located directly beneath at least a portion of the acoustic transducer.
摘要翻译：一种器件包括第一晶片，第二晶片，将第一晶片连接到第二晶片以在第一晶片和第二晶片之间限定空腔的垫圈，以及设置在第一晶片上并设置在第一晶片之间的空腔内的声换能器第一晶片和第二晶片。提供一个或多个孔，用于在声换能器和装置的外部之间传递声信号。可以在空腔本身中形成孔，或者可以将空腔气密地密封。孔可以完全穿过第一晶片形成，并且直接位于声换能器的至少一部分下方。

7. 发明授权

US08357981B2 Transducer devices having different frequencies based on layer thicknesses and method of fabricating the same 有权
标题翻译：基于层厚的具有不同频率的传感器装置及其制造方法
公开(公告)号：US08357981B2
公开(公告)日：2013-01-22
申请号：US12789685
申请日：2010-05-28
申请人： David Martin , John Choy
发明人： David Martin , John Choy
IPC分类号： H01L29/84 , H01L41/22
CPC分类号： H01L41/253 , G10K9/125 , H01L27/20 , Y10T29/42
摘要： A transducer array on a common substrate includes a membrane and first and second transducer devices. The membrane is formed on the common substrate, and includes a lower layer and an upper layer. The first transducer device includes a first resonator stack formed on at least the lower layer in a first portion of the membrane, the upper layer having a first thickness in the first portion of the membrane. The second transducer device includes a second resonator stack formed on at least the lower layer in a second portion of the membrane, the upper layer having a second thickness in the second portion of the membrane, where the second thickness is different from the first thickness, such that a first resonant frequency of the first transducer device is different from a second resonant frequency of the second transducer device.
摘要翻译：公共衬底上的换能器阵列包括膜和第一和第二换能器装置。膜形成在公共基板上，并且包括下层和上层。第一换能器装置包括形成在膜的第一部分中的至少下层上的第一谐振器叠层，上层在膜的第一部分具有第一厚度。第二换能器装置包括形成在膜的第二部分中的至少下层上的第二谐振器叠层，上层在膜的第二部分具有第二厚度，其中第二厚度不同于第一厚度，使得第一换能器装置的第一谐振频率与第二换能器装置的第二共振频率不同。

8. 发明授权

US08384269B2 Electrostatic bonding of a die substrate to a package substrate 有权
标题翻译：模具基板与封装基板的静电接合
公开(公告)号：US08384269B2
公开(公告)日：2013-02-26
申请号：US12908047
申请日：2010-10-20
申请人： David Martin , John Choy
发明人： David Martin , John Choy
IPC分类号： H03H9/15
CPC分类号： H03H9/02102 , H03H9/02133 , H03H9/1014
摘要： A transducer apparatus comprises a package substrate and a transducer disposed over a die substrate. The die substrate is disposed over the package substrate. The transducer apparatus also comprises a voltage source connected between the die substrate and the package substrate, and configured to selectively apply an electrostatic attractive force between the die substrate and the package substrate.
摘要翻译：传感器装置包括封装基板和设置在管芯基板上的换能器。芯片基板设置在封装基板上。换能器装置还包括连接在管芯衬底和封装衬底之间的电压源，并被配置为在管芯衬底和封装衬底之间选择性施加静电引力。

9. 发明申请

US20120098625A1 ELECTROSTATIC BONDING OF A DIE SUBSTRATE TO A PACKAGE SUBSTRATE 有权
标题翻译：将基片的静电结合到封装衬底上
公开(公告)号：US20120098625A1
公开(公告)日：2012-04-26
申请号：US12908047
申请日：2010-10-20
申请人： David Martin , John Choy
发明人： David Martin , John Choy
IPC分类号： H03H9/15
CPC分类号： H03H9/02102 , H03H9/02133 , H03H9/1014
摘要： A transducer apparatus comprises a package substrate and a transducer disposed over a die substrate. The die substrate is disposed over the package substrate. The transducer apparatus also comprises a voltage source connected between the die substrate and the package substrate, and configured to selectively apply an electrostatic attractive force between the die substrate and the package substrate.
摘要翻译：传感器装置包括封装基板和设置在管芯基板上的换能器。芯片基板设置在封装基板上。换能器装置还包括连接在管芯衬底和封装衬底之间的电压源，并被配置为在管芯衬底和封装衬底之间选择性施加静电引力。

10. 发明授权

US09673778B2 Solid mount bulk acoustic wave resonator structure comprising a bridge 有权
公开(公告)号：US09673778B2
公开(公告)日：2017-06-06
申请号：US13337458
申请日：2011-12-27
申请人： Chris Feng , John Choy , Phil Nikkel
发明人： Chris Feng , John Choy , Phil Nikkel
IPC分类号： H03H9/15 , H03H9/13 , H03H9/02 , H03H9/17
CPC分类号： H03H9/132 , H03H9/02118 , H03H9/02149 , H03H9/175
摘要： A solid mount bulk acoustic wave resonator, comprises a first electrode; a second electrode; a piezoelectric layer disposed between the first and second electrodes; and an acoustic reflector comprising a plurality of layers and disposed beneath the first electrode, the second electrode and the piezoelectric layer. An overlap of the acoustic reflector, the first electrode, the second electrode and the piezoelectric layer defines an active area of the acoustic resonator, and the piezoelectric layer extends over an edge of the first electrode. The acoustic resonator also comprises a bridge adjacent to a termination of the active area of the acoustic resonator. The bridge overlaps a portion of the first electrode.

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