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    • 4. 发明授权
    • Sensor package
    • 传感器包装
    • US06907789B2
    • 2005-06-21
    • US10140267
    • 2002-05-06
    • Joel J. Bodin
    • Joel J. Bodin
    • G01L9/00G01L19/06
    • G01L19/0084
    • A sensor package is disclosed. The sensor package includes a housing that has a recess and a sealing member epoxied within the recess of the housing. The housing also has small EDM holes to allow conductive output wires to feed through the housing. The sealing member provides a seal for the holes of the conductive outputs of the sensor package. The sensor package further includes a sensing die, which detects a pressure, and outputs an electrical signal through the output wires.
    • 公开了一种传感器封装。 传感器封装包括壳体,其具有在壳体的凹部内环氧化的凹部和密封构件。 壳体还具有小的EDM孔,以允许导电输出线馈送通过壳体。 密封构件为传感器封装的导电输出的孔提供密封。 传感器封装还包括检测压力的感测管芯,并通过输出导线输出电信号。