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1. 发明申请

US20050022593A1 Fluid flow sensor 审中-公开
标题翻译：流体流量传感器
公开(公告)号：US20050022593A1
公开(公告)日：2005-02-03
申请号：US10900695
申请日：2004-07-27
申请人： Jochen Franz , Matthias Fuertsch , Stefan Finkbeiner , Stefan Weiss , Axel Kaschner
发明人： Jochen Franz , Matthias Fuertsch , Stefan Finkbeiner , Stefan Weiss , Axel Kaschner
IPC分类号： G01F1/684 , G01F1/68
CPC分类号： G01F1/6845
摘要： In a micromechanical sensor and/or a method for manufacturing a micromechanical sensor for detecting a state variable of a substance, the sensor includes at least one heating element, one temperature measuring element and optionally an inlet opening into and/or an outlet opening out of the cavity for this purpose. The sensor includes a cavity configured to at least partially receive the substance through one of the inlet openings and discharge it again at least partially through one of the outlets or outlet openings. The at least one state variable of the substance is detected here as a function of at least one variable representing the operation of the at least one heating element and/or the operation of the at least one temperature element.
摘要翻译：在微机械传感器和/或用于制造用于检测物质的状态变量的微机械传感器的方法中，传感器包括至少一个加热元件，一个温度测量元件和可选地入口和/或出口开口为此目的的腔。该传感器包括被配置成至少部分地通过其中一个入口开口接收物质的空腔，并再次至少部分地通过其中一个出口或出口排出。物质的至少一个状态变量在此被视为表示至少一个加热元件的操作和/或至少一个温度元件的操作的至少一个变量的函数。

2. 发明申请

US20080041151A1 Microfluidic device, in particular for metering a fluid or for the metered dispensing of a fluid, and method for producing a microfluidic device 审中-公开
标题翻译：微流体装置，特别是用于计量流体或用于流体的计量分配，以及用于产生微流体装置的方法
公开(公告)号：US20080041151A1
公开(公告)日：2008-02-21
申请号：US11800009
申请日：2007-04-30
申请人： Matthias Fuertsch , Stefan Finkbeiner , Christoph Schelling , Stefan Weiss , Thomas Wagner , Christian Maeurer , Ines Breibach
发明人： Matthias Fuertsch , Stefan Finkbeiner , Christoph Schelling , Stefan Weiss , Thomas Wagner , Christian Maeurer , Ines Breibach
IPC分类号： G01F1/68 , B44C1/22
CPC分类号： B01L3/0268 , B01L3/0248 , B01L2300/0819 , B01L2300/1827 , B01L2400/0442 , Y10T137/87153
摘要： A microfluidic device for metering a fluid or for the metered dispensing of a fluid is provided, the device having a substrate, a pipette element having a dispensing side, which pipette element has a sealed side, and the device also having a heating device in the region of the sealed side. Alternatively, the microfluidic device is provided with the pipette element having a side that is connected to a reservoir, and a heating device in the region of the side connected to the reservoir.
摘要翻译：提供了一种用于计量流体或用于流体计量分配的微流体装置，所述装置具有基底，具有分配侧的移液管元件，所述移液管元件具有密封侧，并且所述装置还具有加热装置密封面的区域。或者，微流体装置设置有具有连接到储存器的侧面的移液管元件，以及连接到储存器的侧面区域中的加热装置。

3. 发明申请

US20070128755A1 Micronozzle plate and manufacturing method 审中-公开
标题翻译：微喷盘及制造方法
公开(公告)号：US20070128755A1
公开(公告)日：2007-06-07
申请号：US11585769
申请日：2006-10-23
申请人： Matthias Fuertsch , Stefan Finkbeiner , Christoph Schelling , Stefan Weiss , Thomas Wagner , Christian Maeurer , Ines Breibach
发明人： Matthias Fuertsch , Stefan Finkbeiner , Christoph Schelling , Stefan Weiss , Thomas Wagner , Christian Maeurer , Ines Breibach
IPC分类号： H01L21/00
CPC分类号： B81C1/00087 , B81B2201/057
摘要： In the manufacture of at least one passage in a silicon wafer, in a first method step, starting from a first side of the wafer, a first recess is produced in the wafer, and in a second method step, starting from a second side of the wafer, a second recess is produced in the wafer. The first recess and the second recess are produced such that together they form a passage between the first and second sides of the silicon wafer.
摘要翻译：在制造硅晶片中的至少一个通道的过程中，在第一方法步骤中，从晶片的第一侧开始，在晶片中产生第一凹槽，并且在第二方法步骤中，从第二方面开始，在晶片中产生第二凹槽。制造第一凹部和第二凹部，使得它们一起形成硅晶片的第一和第二面之间的通道。

4. 发明授权

US07740459B2 Micropump having a pump diaphragm and a polysilicon layer 失效
标题翻译：微泵具有泵膜和多晶硅层
公开(公告)号：US07740459B2
公开(公告)日：2010-06-22
申请号：US10564370
申请日：2004-07-07
申请人： Matthias Fuertsch , Hubert Benzel , Stefan Finkbeiner , Stefan Pinter , Frank Fischer , Heiko Stahl , Tjalf Pirk
发明人： Matthias Fuertsch , Hubert Benzel , Stefan Finkbeiner , Stefan Pinter , Frank Fischer , Heiko Stahl , Tjalf Pirk
IPC分类号： F04B17/03
CPC分类号： F04B43/043
摘要： A method for producing a micromechanical component, preferably for fluidic applications having cavities. The component is constructed from two functional layers, the two functional layers being patterned differently using micromechanical methods. A first etch stop layer having a first pattern is applied to a base plate. A first functional layer is applied to the first etch stop layer and to the first contact surfaces of the base plate. A second etch stop layer, having a second pattern, is applied to first functional layer. A second functional layer is applied to the second etch stop layer and to the second contact surfaces of the first functional layer. An etching mask is applied to the second functional layer. The second and the first functional layer are patterned as sacrificial layers by the use of the first and the second etch stop layer by etching methods and/or by using the first and the second etch stop layer. By supplementing patterning of the base plate, additional movable fluidic elements may be implemented, using the method. The method is preferably used for producing a micropump having an epitactic polysilicon layer as the pump diaphragm.
摘要翻译：用于制造微机械部件的方法，优选用于具有空腔的流体应用。该组件由两个功能层构成，两个功能层使用微机械方法被不同地图案化。将具有第一图案的第一蚀刻停止层施加到基板。第一功能层被施加到第一蚀刻停止层和基板的第一接触表面。具有第二图案的第二蚀刻停止层被施加到第一功能层。第二功能层被施加到第二蚀刻停止层和第一功能层的第二接触表面。将蚀刻掩模施加到第二功能层。通过使用第一和第二蚀刻停止层通过蚀刻方法和/或通过使用第一和第二蚀刻停止层将第二功能层和第一功能层图案化为牺牲层。通过补充基板的图案化，可以使用该方法来实现附加的可移动流体元件。该方法优选用于制造具有外延多晶硅层作为泵膜的微型泵。

5. 发明申请

US20060186085A1 Method for the production of a micromechanical part preferably used for fluidic applications, and micropump comprising a pump membrane made of a polysilicon layer 失效
标题翻译：用于生产优选用于流体应用的微机械部件的方法以及包括由多晶硅层制成的泵膜的微型泵
公开(公告)号：US20060186085A1
公开(公告)日：2006-08-24
申请号：US10564370
申请日：2004-07-07
申请人： Matthias Fuertsch , Hubert Benzel , Stefan Finkbeiner , Stefan Pinter , Frank Fischer , Heiko Stahl , Tjalf Pirk
发明人： Matthias Fuertsch , Hubert Benzel , Stefan Finkbeiner , Stefan Pinter , Frank Fischer , Heiko Stahl , Tjalf Pirk
IPC分类号： C23F1/00 , F04B17/00
CPC分类号： F04B43/043
摘要： A method for producing a micromechanical component, preferably for fluidic applications having cavities. The component is constructed from two functional layers, the two functional layers being patterned differently using micromechanical methods. A first etch stop layer having a first pattern is applied to a base plate. A first functional layer is applied to the first etch stop layer and to the first contact surfaces of the base plate. A second etch stop layer, having a second pattern, is applied to first functional layer. A second functional layer is applied to the second etch stop layer and to the second contact surfaces of the first functional layer. An etching mask is applied to the second functional layer. The second and the first functional layer are patterned as sacrificial layers by the use of the first and the second etch stop layer by etching methods and/or by using the first and the second etch stop layer. By supplementing patterning of the base plate, additional movable fluidic elements may be implemented, using the method. The method is preferably used for producing a micropump having an epitactic polysilicon layer as the pump diaphragm.
摘要翻译：用于制造微机械部件的方法，优选用于具有空腔的流体应用。该组件由两个功能层构成，两个功能层使用微机械方法被不同地图案化。将具有第一图案的第一蚀刻停止层施加到基板。第一功能层被施加到第一蚀刻停止层和基板的第一接触表面。具有第二图案的第二蚀刻停止层被施加到第一功能层。第二功能层被施加到第二蚀刻停止层和第一功能层的第二接触表面。将蚀刻掩模施加到第二功能层。通过使用第一和第二蚀刻停止层通过蚀刻方法和/或通过使用第一和第二蚀刻停止层将第二功能层和第一功能层图案化为牺牲层。通过补充基板的图案化，可以使用该方法来实现附加的可移动流体元件。该方法优选用于制造具有外延多晶硅层作为泵膜的微型泵。

6. 发明申请

US20110108932A1 Micromechanical Capacitive Sensor Element 审中-公开
标题翻译：微机电容传感器元件
公开(公告)号：US20110108932A1
公开(公告)日：2011-05-12
申请号：US11793853
申请日：2005-11-04
申请人： Hubert Benzel , Stefan Finkbeiner , Frank Fischer , Helmut Baumann , Lars Metzger , Roland Scheuerer , Peter Brauchle , Andreas Feustel , Matthias Neubauer
发明人： Hubert Benzel , Stefan Finkbeiner , Frank Fischer , Helmut Baumann , Lars Metzger , Roland Scheuerer , Peter Brauchle , Andreas Feustel , Matthias Neubauer
IPC分类号： H01L29/84 , H01L21/02
CPC分类号： G01L9/0073
摘要： A manufacturing method for producing a micromechanical sensor element which may be produced in a monolithically integrable design and has capacitive detection of a physical quantity is described. In addition to the manufacturing method, a micromechanical device containing such. a sensor element, e.g., a pressure sensor or an acceleration sensor, is described.
摘要翻译：描述了可以以单片可集成设计制造并具有物理量的电容检测的微机械传感器元件的制造方法。除了制造方法之外，还含有这样的微机械装置。描述了传感器元件，例如压力传感器或加速度传感器。

7. 发明授权

US07572660B2 Electrical through-plating of semiconductor chips 失效
标题翻译：半导体芯片的电穿膜
公开(公告)号：US07572660B2
公开(公告)日：2009-08-11
申请号：US11016617
申请日：2004-12-17
申请人： Hubert Benzel , Stefan Finkbeiner , Christoph Schelling , Julian Gonska
发明人： Hubert Benzel , Stefan Finkbeiner , Christoph Schelling , Julian Gonska
IPC分类号： H01L21/00
CPC分类号： B81B7/0006 , G02B26/0833
摘要： A method for manufacturing a micromechanical component and a micromechanical component manufactured using this method are described, the micromechanical component having a first substrate, which in turn has at least one cavity and one printed conductor. At least a part of the printed conductor is applied to at least a part of the walls of the cavity. In particular, the floor of the cavity is considered part of the cavity walls.
摘要翻译：描述了使用该方法制造微机械部件和微机械部件的方法，该微机械部件具有第一基板，该第一基板又具有至少一个空腔和一个印刷导体。印刷导体的至少一部分被施加到空腔的至少一部分壁。特别地，空腔的地板被认为是腔壁的一部分。

8. 发明授权

US06511913B1 Method for manufacturing a membrane 有权
标题翻译：膜的制造方法
公开(公告)号：US06511913B1
公开(公告)日：2003-01-28
申请号：US09615142
申请日：2000-07-13
申请人： Hubert Benzel , Stefan Finkbeiner
发明人： Hubert Benzel , Stefan Finkbeiner
IPC分类号： H01L2162
CPC分类号： B81C1/00158 , B81C2201/0136
摘要： A method for manufacturing a membrane in which an n-doped epitaxy layer is applied on a p-doped silicon substrate. Disposed between the silicon substrate and the epitaxy layer is a p-doping which leads to a reduction of the membrane thickness during a subsequent etching process.
摘要翻译：一种制造膜的方法，其中在p掺杂硅衬底上施加n掺杂外延层。在硅衬底和外延层之间设置p掺杂，这导致随后的蚀刻工艺期间膜厚度的降低。

9. 发明申请

US20110279919A1 METHOD FOR MANUFACTURING A MICROMECHANICAL COMPONENT, AND MICROMECHANICAL COMPONENT 有权
标题翻译：制造微电子元件和微机电元件的方法
公开(公告)号：US20110279919A1
公开(公告)日：2011-11-17
申请号：US13057411
申请日：2009-07-06
申请人： Stefan Finkbeiner , Tjalf Pirk , Christoph Friese
发明人： Stefan Finkbeiner , Tjalf Pirk , Christoph Friese
IPC分类号： G02B7/182 , B05D3/10
CPC分类号： B81C1/00166 , B81B2201/033 , B81C2201/014
摘要： A method for manufacturing a micromechanical component is described, including the steps of: forming a first etch stop layer on a base substrate, the first etch stop layer being formed in such a way that it has a first pattern of through-cutouts; forming a first electrode-material layer on the first etch stop layer; forming a second etch stop layer on the first electrode-material layer, the second etch stop layer being formed in such a way that it has a second pattern of through-cutouts differing from the first pattern; forming a second electrode-material layer on the second etch stop layer; forming a patterned mask on the second electrode-material layer; and carrying out a first etching step in a first direction and a second etching step in a second direction counter to the first direction in order to etch at least one first electrode unit out of the first electrode-material layer and to etch at least one second electrode unit out of the second electrode-material layer. Also described are micromechanical components.
摘要翻译：描述了一种用于制造微机械部件的方法，包括以下步骤：在基底基板上形成第一蚀刻停止层，第一蚀刻停止层以这样的方式形成：其具有第一图形的通孔; 在所述第一蚀刻停止层上形成第一电极材料层; 在所述第一电极材料层上形成第二蚀刻停止层，所述第二蚀刻停止层以这样的方式形成：其具有不同于所述第一图案的通孔的第二图案; 在所述第二蚀刻停止层上形成第二电极材料层; 在所述第二电极材料层上形成图案化掩模; 并且在与第一方向相反的第二方向上沿第一方向和第二蚀刻步骤进行第一蚀刻步骤，以便从第一电极材料层中蚀刻至少一个第一电极单元并蚀刻至少一个第二电极单元排出第二电极材料层。还描述了微机械部件。

10. 发明申请

US20060016995A1 Microstructured infrared sensor and method for its manufacture 审中-公开
标题翻译：微结构红外传感器及其制造方法
公开(公告)号：US20060016995A1
公开(公告)日：2006-01-26
申请号：US11150762
申请日：2005-06-10
申请人： Nils Kummer , Roland Mueller-Fiedler , Stefan Finkbeiner , Andre Mueller , Horst Muenzel , Dieter Maurer , Stefan Hiemer , Jurgen Perthold
发明人： Nils Kummer , Roland Mueller-Fiedler , Stefan Finkbeiner , Andre Mueller , Horst Muenzel , Dieter Maurer , Stefan Hiemer , Jurgen Perthold
IPC分类号： G01J5/00
CPC分类号： G01J1/04 , G01J1/0411 , G01J5/02 , G01J5/0215 , G01J5/024 , G01J5/04 , G01J5/045 , G01J5/046 , G01J5/08 , G01J5/0806 , G01J5/0853 , G01J5/0881 , G01J5/12 , G01N21/3504 , H01L27/14618 , H01L27/14625 , H01L31/0203 , H01L31/0232 , H01L2924/0002 , H01L2924/00
摘要： A microstructured infrared sensor includes: a sensor chip having a diaphragm; a cavity formed underneath the diaphragm; a thermopile structure formed on the diaphragm and having bonded printed conductors; an absorber layer formed on the thermopile structure for absorbing infrared radiation; and a cap chip attached to the sensor chip. A sensor space is formed between the cap chip and the sensor chip, and the sensor space accommodates the thermopile structure. The infrared sensor also includes a convex lens area for focusing incident infrared radiation onto the absorber layer. The lens area may be formed on the top of the cap chip or on a lens chip attached to the cap chip. The lens area may be formed by drying a dispensed lacquer droplet, or by a softened, structured lacquer cylinder, or by subsequent etching of the dried lacquer droplet and the surrounding substrate material.
摘要翻译：微结构红外传感器包括：具有隔膜的传感器芯片; 形成在隔膜下方的空腔; 形成在隔膜上并具有粘合的印刷导体的热电堆结构; 形成在热电堆结构上用于吸收红外辐射的吸收层; 以及附接到传感器芯片的盖芯片。在盖芯片和传感器芯片之间形成传感器空间，传感器空间容纳热电堆结构。红外传感器还包括用于将入射的红外辐射聚焦到吸收层上的凸透镜区域。透镜区域可以形成在盖芯片的顶部上或附接到盖芯片的透镜芯片上。透镜区域可以通过干燥分配的漆液滴，或通过软化的结构化漆筒，或者通过随后蚀刻干燥的漆液滴和周围的基底材料来形成。

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