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1. 发明授权

US09103658B2 Optical navigation module with capacitive sensor 有权
标题翻译：具有电容式传感器的光学导航模块
公开(公告)号：US09103658B2
公开(公告)日：2015-08-11
申请号：US13248355
申请日：2011-09-29
申请人： Jinghui Mu , Brett Alan Spurlock , Yansun Xu , John Frame , KeCai Zeng , Brian Todoroff
发明人： Jinghui Mu , Brett Alan Spurlock , Yansun Xu , John Frame , KeCai Zeng , Brian Todoroff
IPC分类号： G06F3/042 , G01B11/00 , G01B11/22 , G06F3/0354
CPC分类号： G01B11/002 , G01B11/22 , G06F3/03547 , G06F3/0421
摘要： Optical navigation modules and methods of operating the same to sense relative movement between the optical navigation module and a tracking surface are provided. In one embodiment, the optical navigation module comprises: (i) a light source to illuminate at least a portion of a surface relative to which the optical navigation module is moved; (ii) an integrated circuit (IC) including a photo-detector array (PDA) to detect a light pattern propagated onto the PDA from the surface, and a signal processor to translate changes in the light pattern propagated onto the PDA into data representing motion of the optical navigation module relative to the surface; and (iii) a substrate to which the light source and IC are mounted, the substrate including an aperture in a light path between the surface and the PDA. Other embodiments are also disclosed.
摘要翻译：提供了光学导航模块及其操作方法以检测光学导航模块和跟踪表面之间的相对运动。在一个实施例中，光学导航模块包括：（i）照亮光导管模块移动的表面的至少一部分的光源; （ii）包括用于检测从表面传播到PDA上的光图案的光电检测器阵列（PDA）的集成电路（IC）以及将传播到PDA上的光图案的变化转换成表示运动的数据的信号处理器的光学导航模块相对于表面; 和（iii）安装有光源和IC的基板，所述基板在所述表面和所述PDA之间的光路中包括孔。还公开了其他实施例。

2. 发明授权

US08896553B1 Hybrid sensor module 有权
标题翻译：混合传感器模块
公开(公告)号：US08896553B1
公开(公告)日：2014-11-25
申请号：US13307350
申请日：2011-11-30
申请人： Yansun Xu , Jinghui Mu
发明人： Yansun Xu , Jinghui Mu
IPC分类号： G06F3/041
CPC分类号： G06F3/042 , G06F3/0317 , G06F2203/0381 , G06F2203/04106
摘要： A hybrid sensor module and methods of operating the same are provided. In one embodiment, the hybrid sensor module includes: (i) a touch sensor configured to sense motion of an object in proximity to a surface of the touch sensor; (ii) an optical navigation sensor (ONS) configured to illuminate the object through the surface of the touch sensor and to sense motion of the object based on light returned from the object; and (iii) a controller electrically coupled to the touch sensor and the ONS to process the sensed motion of the object and to generate an output signal in response to the sensed motion, wherein the controller is configured to dynamically adjust a tracking resolution of the hybrid sensor module based on a characteristic of the sensed motion. Other embodiments are disclosed.
摘要翻译：提供了一种混合传感器模块及其操作方法。在一个实施例中，混合传感器模块包括：（i）触摸传感器，被配置为感测物体在触摸传感器的表面附近的运动; （ii）光学导航传感器（ONS），其被配置为通过所述触摸传感器的表面照亮所述物体，并且基于从所述物体返回的光来感测所述物体的运动; 以及（iii）控制器，其电耦合到所述触摸传感器和所述ONS以处理所感测到的对象的运动并且响应于所感测到的运动而产生输出信号，其中所述控制器被配置为动态地调整所述混合器的跟踪分辨率传感器模块基于感测到的运动的特性。公开了其他实施例。

3. 发明申请

US20060202335A1 Tape ball grid array package with electromagnetic interference protection and method for fabricating the package 审中-公开
公开(公告)号：US20060202335A1
公开(公告)日：2006-09-14
申请号：US11436961
申请日：2006-05-16
申请人： Jinghui Mu
发明人： Jinghui Mu
IPC分类号： H01L23/48
CPC分类号： H01L21/4871 , H01L23/047 , H01L23/13 , H01L23/49816 , H01L23/49833 , H01L23/552 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/4911 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01057 , H01L2924/01065 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A tape ball grid array (TBGA) package and method for fabricating the package utilizes at least one electrical connection between a conductive stiffener and a patterned metal layer of a tape substrate, which is connected to a solder ball that is designated to be connected to AC ground, so that the conductive stiffener can be AC grounded. The electrical connection between the conductive stiffener and the AC ground-designated solder ball may be achieved by wirebonding the conductive stiffener to the patterned metal layer of the tape substrate. Since the conductive stiffener can be AC grounded, the conductive stiffener can be used as an electromagnetic interference (EMI) shield.

4. 发明申请

US20060055038A1 Tape ball grid array package with electromagnetic interference protection and method for fabricating the package 有权
公开(公告)号：US20060055038A1
公开(公告)日：2006-03-16
申请号：US10938836
申请日：2004-09-10
申请人： Jinghui Mu
发明人： Jinghui Mu
IPC分类号： H01L23/48
CPC分类号： H01L21/4871 , H01L23/047 , H01L23/13 , H01L23/49816 , H01L23/49833 , H01L23/552 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/4911 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01057 , H01L2924/01065 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A tape ball grid array (TBGA) package and method for fabricating the package utilizes at least one electrical connection between a conductive stiffener and a patterned metal layer of a tape substrate, which is connected to a solder ball that is designated to be connected to AC ground, so that the conductive stiffener can be AC grounded. The electrical connection between the conductive stiffener and the AC ground-designated solder ball may be achieved by wirebonding the conductive stiffener to the patterned metal layer of the tape substrate. Since the conductive stiffener can be AC grounded, the conductive stiffener can be used as an electromagnetic interference (EMI) shield.

5. 发明授权

US07071556B2 Tape ball grid array package with electromagnetic interference protection and method for fabricating the package 有权
标题翻译：带电磁干扰保护的磁带球栅阵列封装和制造封装的方法
公开(公告)号：US07071556B2
公开(公告)日：2006-07-04
申请号：US10938836
申请日：2004-09-10
申请人： Jinghui Mu
发明人： Jinghui Mu
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/4871 , H01L23/047 , H01L23/13 , H01L23/49816 , H01L23/49833 , H01L23/552 , H01L24/48 , H01L24/49 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/4911 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01057 , H01L2924/01065 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A tape ball grid array (TBGA) package and method for fabricating the package utilizes at least one electrical connection between a conductive stiffener and a patterned metal layer of a tape substrate, which is connected to a solder ball that is designated to be connected to AC ground, so that the conductive stiffener can be AC grounded. The electrical connection between the conductive stiffener and the AC ground-designated solder ball may be achieved by wirebonding the conductive stiffener to the patterned metal layer of the tape substrate. Since the conductive stiffener can be AC grounded, the conductive stiffener can be used as an electromagnetic interference (EMI) shield.
摘要翻译：用于制造封装的带状球栅阵列（TBGA）封装和方法利用导电加强件与带基片的图案化金属层之间的至少一个电连接，其连接到指定为连接到AC的焊球接地，使导电加强筋可以交流接地。导电加强件和AC地面指定焊球之间的电连接可以通过将导电加强筋引导到带基板的图案化金属层来实现。由于导电加强件可以交流接地，所以导电加强件可用作电磁干扰（EMI）屏蔽。

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