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1. 发明授权

US07052368B2 Polishing pad for chemical mechanical polishing apparatus 失效
标题翻译：化学机械抛光设备抛光垫
公开(公告)号：US07052368B2
公开(公告)日：2006-05-30
申请号：US10861254
申请日：2004-06-03
申请人： Jin-Kook Kim , Jae-Phil Boo , Sang-Seon Lee , Jong-Bok Kim
发明人： Jin-Kook Kim , Jae-Phil Boo , Sang-Seon Lee , Jong-Bok Kim
IPC分类号： B24B49/00
CPC分类号： B24B37/205
摘要： Provided is a polishing pad for a chemical mechanical polishing (CMP) apparatus, having a sealing barrier which prevents fluid leakage and moisture accumulation on a window. The polishing pad comprises an upper pad having polishing surface in contact with a wafer, a bottom pad an upper face of which is attached to a lower face of the upper pad and a lower face of which is attached to an upper face of a platen of the CMP apparatus, an aperture through the bottom pad and the upper pad, a transparent window fitted in the aperture in the upper pad, and a sealing barrier, placed between the aperture and an external face of the bottom pad in contact with a fluid, to prevent fluid leakage and accumulation of moisture derived from fluid fed on the polishing surface through the bottom pad.
摘要翻译：本发明提供一种用于化学机械抛光（CMP）装置的抛光垫，其具有防止液体泄漏和水分积聚在窗户上的密封屏障。抛光垫包括具有与晶片接触的抛光表面的上焊盘，底垫，其上表面附接到上焊盘的下表面，其下表面附接到压板的上表面 CMP装置，通过底垫和上垫的孔，安装在上垫中的孔中的透明窗和密封屏障，放置在孔与底部垫的与流体接触的外表面之间，以防止流体通过底部衬垫泄漏和积聚来自在抛光表面上供给的流体的水分。

2. 发明授权

US06945861B2 Polishing head of chemical mechanical polishing apparatus and polishing method using the same 有权
公开(公告)号：US06945861B2
公开(公告)日：2005-09-20
申请号：US11075635
申请日：2005-03-08
申请人： Jae-Phil Boo , Jong-Soo Kim , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jong-Soo Kim , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B41/06 , B24B49/00
CPC分类号： B24B37/30 , B24B41/061
摘要： A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.

3. 发明申请

US20070232209A1 METHOD FOR POLISHING A SEMICONDUCTOR WAFER 审中-公开
标题翻译：抛光半导体波长的方法
公开(公告)号：US20070232209A1
公开(公告)日：2007-10-04
申请号：US11753893
申请日：2007-05-25
申请人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B19/00
CPC分类号： B24B37/30 , B24B37/32 , H01L21/304
摘要： An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber. The first chamber is in communication with the other one of the two fluid passages and the first holes are formed in the lower surface portion of the supporter to communicate with the first chamber. The lower surface portion of the supporter has a flat surface and a chamfered or rounded edge. The membrane disposed to enclose the lower surface portion of the supporter has a plurality of third holes formed at positions corresponding to the first holes to absorb and hold the wafer by vacuum.
摘要翻译：用于抛光晶片的装置包括具有设置在其上的研磨垫的支撑部分和设置在研磨垫上方的抛光头。抛光头包括具有至少两个流体通道的载体，设置在载体的下边缘上的保持环，形成用于接收晶片的空间，设置在载体中的支撑体和设置成与载体接触的柔性膜晶圆。支撑体具有上表面部分，下表面部分，多个第一孔，多个第二孔和第一室。支撑件的上表面部分与载体的内表面一起形成第二室。第二室与载体的两个流体通道中的一个连通，并且第二孔形成在支撑件的下表面部分中以与第二室连通。第一室与两个流体通道中的另一个连通，并且第一孔形成在支撑件的下表面部分中以与第一室连通。支撑体的下表面部分具有平坦表面和倒角或圆形边缘。设置成包围支撑体的下表面部分的膜具有形成在与第一孔对应的位置处的多个第三孔，以通过真空吸收和保持晶片。

4. 发明授权

US06921323B2 Apparatus for polishing a semiconductor wafer and method therefor 失效
标题翻译：用于研磨半导体晶片的装置及其方法
公开(公告)号：US06921323B2
公开(公告)日：2005-07-26
申请号：US10670855
申请日：2003-09-25
申请人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B37/005 , B24B37/30 , H01L21/304 , B24B49/00
CPC分类号： B24B37/30 , B24B37/32 , H01L21/304
摘要： An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber. The first chamber is in communication with the other one of the two fluid passages and the first holes are formed in the lower surface portion of the supporter to communicate with the first chamber. The lower surface portion of the supporter has a flat surface and a chamfered or rounded edge. The membrane disposed to enclose the lower surface portion of the supporter has a plurality of third holes formed at positions corresponding to the first holes to absorb and hold the wafer by vacuum.
摘要翻译：用于抛光晶片的装置包括具有设置在其上的研磨垫的支撑部分和设置在研磨垫上方的抛光头。抛光头包括具有至少两个流体通道的载体，设置在载体的下边缘上的保持环，形成用于接收晶片的空间，设置在载体中的支撑体和设置成与载体接触的柔性膜晶圆。支撑体具有上表面部分，下表面部分，多个第一孔，多个第二孔和第一室。支撑件的上表面部分与载体的内表面一起形成第二室。第二室与载体的两个流体通道中的一个连通，并且第二孔形成在支撑件的下表面部分中以与第二室连通。第一室与两个流体通道中的另一个连通，并且第一孔形成在支撑件的下表面部分中以与第一室连通。支撑体的下表面部分具有平坦表面和倒角或圆形边缘。设置成包围支撑体的下表面部分的膜具有形成在与第一孔对应的位置处的多个第三孔，以通过真空吸收和保持晶片。

5. 发明授权

US06881135B2 Polishing head of chemical mechanical polishing apparatus and polishing method using the same 有权
标题翻译：化学机械抛光装置的抛光头和使用其的抛光方法
公开(公告)号：US06881135B2
公开(公告)日：2005-04-19
申请号：US10881925
申请日：2004-06-30
申请人： Jae-Phil Boo , Jong-Soo Kim , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jong-Soo Kim , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B41/06 , B24B49/00
CPC分类号： B24B37/30 , B24B41/061
摘要： A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.
摘要翻译：化学机械抛光（CMP）装置包括由载体和膜构成的抛光头，并且位于支撑部件的抛光垫上。抛光头具有安装在载体的内部中心的支撑件，位于载体和支撑件之间的卡环，以及用于沿垂直方向上下移动夹紧环的装置。支撑件与膜一起形成密封空间，夹紧环将真空中的晶片夹紧。

6. 发明授权

US07223158B2 Method for polishing a semiconductor wafer 失效
标题翻译：抛光半导体晶片的方法
公开(公告)号：US07223158B2
公开(公告)日：2007-05-29
申请号：US11326555
申请日：2006-01-05
申请人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B49/00
CPC分类号： B24B37/30 , B24B37/32 , H01L21/304
摘要： An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber. The first chamber is in communication with the other one of the two fluid passages and the first holes are formed in the lower surface portion of the supporter to communicate with the first chamber. The lower surface portion of the supporter has a flat surface and a chamfered or rounded edge. The membrane disposed to enclose the lower surface portion of the supporter has a plurality of third holes formed at positions corresponding to the first holes to absorb and hold the wafer by vacuum.
摘要翻译：用于抛光晶片的装置包括具有设置在其上的研磨垫的支撑部分和设置在研磨垫上方的抛光头。抛光头包括具有至少两个流体通道的载体，设置在载体的下边缘上的保持环，形成用于接收晶片的空间，设置在载体中的支撑体和设置成与载体接触的柔性膜晶圆。支撑体具有上表面部分，下表面部分，多个第一孔，多个第二孔和第一室。支撑件的上表面部分与载体的内表面一起形成第二室。第二室与载体的两个流体通道中的一个连通，并且第二孔形成在支撑件的下表面部分中以与第二室连通。第一室与两个流体通道中的另一个连通，并且第一孔形成在支撑件的下表面部分中以与第一室连通。支撑体的下表面部分具有平坦表面和倒角或圆形边缘。设置成包围支撑体的下表面部分的膜具有形成在与第一孔对应的位置处的多个第三孔，以通过真空吸收和保持晶片。

7. 发明申请

US20060116056A1 Apparatus and methods for polishing a semiconductor wafer 失效
标题翻译：用于抛光半导体晶片的装置和方法
公开(公告)号：US20060116056A1
公开(公告)日：2006-06-01
申请号：US11326555
申请日：2006-01-05
申请人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B1/00 , B24B7/30 , B24B29/00
CPC分类号： B24B37/30 , B24B37/32 , H01L21/304
摘要： An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber. The first chamber is in communication with the other one of the two fluid passages and the first holes are formed in the lower surface portion of the supporter to communicate with the first chamber. The lower surface portion of the supporter has a flat surface and a chamfered or rounded edge. The membrane disposed to enclose the lower surface portion of the supporter has a plurality of third holes formed at positions corresponding to the first holes to absorb and hold the wafer by vacuum.
摘要翻译：用于抛光晶片的装置包括具有设置在其上的研磨垫的支撑部分和设置在研磨垫上方的抛光头。抛光头包括具有至少两个流体通道的载体，设置在载体的下边缘上的保持环，形成用于接收晶片的空间，设置在载体中的支撑体和设置成与载体接触的柔性膜晶圆。支撑体具有上表面部分，下表面部分，多个第一孔，多个第二孔和第一室。支撑件的上表面部分与载体的内表面一起形成第二室。第二室与载体的两个流体通道中的一个连通，并且第二孔形成在支撑件的下表面部分中以与第二室连通。第一室与两个流体通道中的另一个连通，并且第一孔形成在支撑件的下表面部分中以与第一室连通。支撑体的下表面部分具有平坦表面和倒角或圆形边缘。设置成包围支撑体的下表面部分的膜具有形成在与第一孔对应的位置处的多个第三孔，以通过真空吸收和保持晶片。

8. 发明授权

US07081045B2 Apparatus for polishing a semiconductor wafer 失效
标题翻译：用于抛光半导体晶片的装置
公开(公告)号：US07081045B2
公开(公告)日：2006-07-25
申请号：US11052275
申请日：2005-02-07
申请人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B49/00
CPC分类号： B24B37/30 , B24B37/32 , H01L21/304
摘要： An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber. The first chamber is in communication with the other one of the two fluid passages and the first holes are formed in the lower surface portion of the supporter to communicate with the first chamber. The lower surface portion of the supporter has a flat surface and a chamfered or rounded edge. The membrane disposed to enclose the lower surface portion of the supporter has a plurality of third holes formed at positions corresponding to the first holes to absorb and hold the wafer by vacuum.
摘要翻译：用于抛光晶片的装置包括具有设置在其上的研磨垫的支撑部分和设置在研磨垫上方的抛光头。抛光头包括具有至少两个流体通道的载体，设置在载体的下边缘上的保持环，形成用于接收晶片的空间，设置在载体中的支撑体和设置成与载体接触的柔性膜晶圆。支撑体具有上表面部分，下表面部分，多个第一孔，多个第二孔和第一室。支撑件的上表面部分与载体的内表面一起形成第二室。第二室与载体的两个流体通道中的一个连通，并且第二孔形成在支撑件的下表面部分中以与第二室连通。第一室与两个流体通道中的另一个连通，并且第一孔形成在支撑件的下表面部分中以与第一室连通。支撑体的下表面部分具有平坦表面和倒角或圆形边缘。设置成包围支撑体的下表面部分的膜具有形成在与第一孔对应的位置处的多个第三孔，以通过真空吸收和保持晶片。

9. 发明申请

US20050153635A1 POLISHING HEAD OF CHEMICAL MECHANICAL POLISHING APPARATUS AND POLISHING METHOD USING THE SAME 有权
标题翻译：化学机械抛光装置的抛光头和使用其的抛光方法
公开(公告)号：US20050153635A1
公开(公告)日：2005-07-14
申请号：US11075635
申请日：2005-03-08
申请人： Jae-Phil Boo , Jong-Soo Kim , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jong-Soo Kim , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B41/06 , B24B1/00
CPC分类号： B24B37/30 , B24B41/061
摘要： A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.
摘要翻译：化学机械抛光（CMP）装置包括由载体和膜构成的抛光头，并且位于支撑部件的抛光垫上。抛光头具有安装在载体的内部中心的支撑件，位于载体和支撑件之间的卡环，以及用于沿垂直方向上下移动夹紧环的装置。支撑件与膜一起形成密封空间，夹紧环将真空中的晶片夹紧。

10. 发明申请

US20050136806A1 Apparatus for polishing a semiconductor wafer and method therefor 失效
公开(公告)号：US20050136806A1
公开(公告)日：2005-06-23
申请号：US11052275
申请日：2005-02-07
申请人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B37/005 , B24B37/30 , H01L21/304 , B24B1/00
CPC分类号： B24B37/30 , B24B37/32 , H01L21/304
摘要： An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber. The first chamber is in communication with the other one of the two fluid passages and the first holes are formed in the lower surface portion of the supporter to communicate with the first chamber. The lower surface portion of the supporter has a flat surface and a chamfered or rounded edge. The membrane disposed to enclose the lower surface portion of the supporter has a plurality of third holes formed at positions corresponding to the first holes to absorb and hold the wafer by vacuum.

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