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    • 1. 发明授权
    • Flat panel display device and method of manufacturing the same
    • 平板显示装置及其制造方法
    • US08841669B2
    • 2014-09-23
    • US13114976
    • 2011-05-24
    • Jin-Goo JungDeok-Hoi KimSeung-Gyu TaeYu-Bong WonSung-Woo Jung
    • Jin-Goo JungDeok-Hoi KimSeung-Gyu TaeYu-Bong WonSung-Woo Jung
    • H01L31/00
    • H01L28/60G02F1/136213G02F1/136286G02F2201/40H01L27/1255H01L27/1288
    • A method of manufacturing a flat panel display device includes: forming a semiconductor layer of a thin film transistor (TFT) on a substrate; forming a gate electrode on the semiconductor layer with a gate insulating layer between the gate electrode and the semiconductor layer, and doping source and drain regions of the semiconductor layer with ion impurities; sequentially forming a first conductive layer, a first insulating layer, and a second conductive layer, and forming a capacitor at a distance away from the TFT by patterning the first conductive layer, the first insulating layer, and the second conductive layer; forming a second insulating layer, and forming contact holes passing through the second insulating layer, the contact holes exposing portions of the source and drain regions and the second conductive layer; and forming source and drain electrodes that respectively contact the source and drain regions and the second conductive layer through the contact holes.
    • 一种制造平板显示装置的方法包括:在衬底上形成薄膜晶体管(TFT)的半导体层; 在栅电极和半导体层之间的栅极绝缘层在半导体层上形成栅电极,并用离子杂质掺杂半导体层的源区和漏区; 顺序地形成第一导电层,第一绝缘层和第二导电层,并且通过对第一导电层,第一绝缘层和第二导电层进行构图而形成与TFT远离一定距离的电容器; 形成第二绝缘层,以及形成通过所述第二绝缘层的接触孔,所述接触孔暴露所述源极和漏极区域和所述第二导电层的部分; 以及通过所述接触孔形成分别接触所述源极和漏极区域以及所述第二导电层的源极和漏极。
    • 2. 发明申请
    • FLAT PANEL DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 平板显示装置及其制造方法
    • US20110297945A1
    • 2011-12-08
    • US13114976
    • 2011-05-24
    • Jin-Goo JungDeok-Hoi KimSeung-Gyu TaeYu-Bong WonSung-Woo Jung
    • Jin-Goo JungDeok-Hoi KimSeung-Gyu TaeYu-Bong WonSung-Woo Jung
    • H01L33/16
    • H01L28/60G02F1/136213G02F1/136286G02F2201/40H01L27/1255H01L27/1288
    • A method of manufacturing a flat panel display device includes: forming a semiconductor layer of a thin film transistor (TFT) on a substrate; forming a gate electrode on the semiconductor layer with a gate insulating layer between the gate electrode and the semiconductor layer, and doping source and drain regions of the semiconductor layer with ion impurities; sequentially forming a first conductive layer, a first insulating layer, and a second conductive layer, and forming a capacitor at a distance away from the TFT by patterning the first conductive layer, the first insulating layer, and the second conductive layer; forming a second insulating layer, and forming contact holes passing through the second insulating layer, the contact holes exposing portions of the source and drain regions and the second conductive layer; and forming source and drain electrodes that respectively contact the source and drain regions and the second conductive layer through the contact holes.
    • 一种制造平板显示装置的方法包括:在衬底上形成薄膜晶体管(TFT)的半导体层; 在栅电极和半导体层之间的栅极绝缘层在半导体层上形成栅电极,并用离子杂质掺杂半导体层的源区和漏区; 顺序地形成第一导电层,第一绝缘层和第二导电层,并且通过对第一导电层,第一绝缘层和第二导电层进行构图而形成与TFT远离一定距离的电容器; 形成第二绝缘层,以及形成通过所述第二绝缘层的接触孔,所述接触孔暴露所述源极和漏极区域和所述第二导电层的部分; 以及通过所述接触孔形成分别接触所述源极和漏极区域以及所述第二导电层的源极和漏极。
    • 5. 发明授权
    • T-gate forming method for high electron mobility transistor and gate structure thereof
    • 用于高电子迁移率晶体管的T型栅极形成方法及其栅极结构
    • US07932540B2
    • 2011-04-26
    • US11700946
    • 2007-02-01
    • Yoon-Ha JeongKang-Sung LeeYoung-Su KimYun-Ki HongSung-Woo Jung
    • Yoon-Ha JeongKang-Sung LeeYoung-Su KimYun-Ki HongSung-Woo Jung
    • H01L29/66
    • H01L29/7787H01L29/42316H01L29/66462
    • A T-gate forming method for a high electron mobility transistor includes the steps of: coating a first, a second and a third resist, each having an electron beam sensitivity different from each other, on a semiconductor substrate; performing a first exposure process by using an electron beam on the semiconductor substrate and then selectively developing the third resist; defining a gate head area by selectively developing the second resist to have a developed width wider than that of the third resist; performing a second exposure process by using an electron beam on the semiconductor substrate and then selectively developing the first resist in a bent shape at a temperature lower than in the development of the second and the third steps; and depositing metallic materials on the resists and then removing them to form a T-gate.
    • 一种用于高电子迁移率晶体管的T形栅形成方法包括以下步骤:在半导体衬底上涂覆各自具有彼此不同的电子束灵敏度的第一,第二和第三抗蚀剂; 通过在半导体衬底上使用电子束然后选择性地显影第三抗蚀剂来执行第一曝光处理; 通过选择性地显影所述第二抗蚀剂来限定栅极头区域,以具有比所述第三抗蚀剂宽的显影宽度; 通过在半导体衬底上使用电子束进行第二曝光处理,然后在低于第二和第三步骤的显影的温度下,以弯曲形状选择性地显影第一抗蚀剂; 并将金属材料沉积在抗蚀剂上,然后去除它们以形成T形栅极。
    • 6. 发明申请
    • T-gate forming method for high electron mobility transistor and gate structure thereof
    • 用于高电子迁移率晶体管的T型栅极形成方法及其栅极结构
    • US20080108188A1
    • 2008-05-08
    • US11700946
    • 2007-02-01
    • Yoon-Ha JeongKang-Sung LeeYoung-Su KimYun-Ki HongSung-Woo Jung
    • Yoon-Ha JeongKang-Sung LeeYoung-Su KimYun-Ki HongSung-Woo Jung
    • H01L21/338
    • H01L29/7787H01L29/42316H01L29/66462
    • A T-gate forming method for a high electron mobility transistor includes the steps of: coating a first, a second and a third resist, each having an electron beam sensitivity different from each other, on a semiconductor substrate; performing a first exposure process by using an electron beam on the semiconductor substrate and then selectively developing the third resist; defining a gate head area by selectively developing the second resist to have a developed width wider than that of the third resist; performing a second exposure process by using an electron beam on the semiconductor substrate and then selectively developing the first resist in a bent shape at a temperature lower than in the development of the second and the third steps; and depositing metallic materials on the resists and then removing them to form a T-gate.
    • 一种用于高电子迁移率晶体管的T形栅形成方法包括以下步骤:在半导体衬底上涂覆各自具有彼此不同的电子束灵敏度的第一,第二和第三抗蚀剂; 通过在半导体衬底上使用电子束然后选择性地显影第三抗蚀剂来执行第一曝光处理; 通过选择性地显影所述第二抗蚀剂来限定栅极头区域,以具有比所述第三抗蚀剂宽的显影宽度; 通过在半导体衬底上使用电子束进行第二曝光处理,然后在低于第二和第三步骤的显影的温度下,以弯曲形状选择性地显影第一抗蚀剂; 并将金属材料沉积在抗蚀剂上,然后去除它们以形成T形栅极。