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    • 1. 发明申请
    • Packaging structure of LED-multiplexer/driver hybridzation for LED printer head
    • LED打印头LED复用器/驱动器混合封装结构
    • US20060125910A1
    • 2006-06-15
    • US11009431
    • 2004-12-09
    • Jin ShieThunter HwangChin-Wen HuangChien Lin
    • Jin ShieThunter HwangChin-Wen HuangChien Lin
    • B41J2/435G01D15/14
    • B41J2/45
    • The present invention discloses a packaging structure of LED-multiplexer/driver hybridization for LED printer head. In order to connect the LED-multiplexer module to the LED chip without wire bonding, a multiplexer chip, made of silicon material, has multiplexer circuit on one side and a through engraved U-shape trench on the other side, a linear array LED chip, made of non-silicon material, is stack-hybridized into the through engraved U-shape trench, to form a hybridized wafer with all the upper surfaces of LEDs and the multiplexer circuit in the same plane to form a co-planar surface. A plurality of joint-metal, made by photo-lithography and etching, screen printing of any solder paste, ink-jet printing of any appropriate solder paste or by lift-off method, is formed on said co-planar surface of said multiplexer circuit and linear array LED to connect the bonding pad of the multiplexer device and the positive electrode of the LED of each pixel.
    • 本发明公开了一种用于LED打印头的LED复用器/驱动器杂交的封装结构。 为了将LED多路复用器模块连接到LED芯片而无需引线接合,由硅材料制成的复用器芯片在一侧具有多路复用器电路,另一侧具有通过雕刻的U形沟槽,线阵列LED芯片 由非硅材料制成的叠层杂交到通过雕刻的U形沟槽中,以形成与LED的所有上表面和多路复用器电路在同一平面中的杂化晶片,以形成共面。 通过光刻和蚀刻制造的多个接合金属,任何焊膏的丝网印刷,任何合适的焊膏的喷墨印刷或通过剥离方法形成在所述多路复用器电路的所述共平面上 和线性阵列LED,以连接多路复用器件的焊盘和每个像素的LED的正电极。