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    • 4. 发明授权
    • Liquid crystal display having fastening device
    • 具有紧固装置的液晶显示器
    • US08264827B2
    • 2012-09-11
    • US12468227
    • 2009-05-19
    • Jie YuanGong-Yi Dai
    • Jie YuanGong-Yi Dai
    • H05K5/00
    • F16B5/0664F16B5/0642G06F1/1605
    • A fastening device is provided for fastening at least one article on a carrier. The fastening device includes at least one positioning component, a fixed plate fixed on the carrier, and a pressing plate positioned on the fixed plate by the positioning component. The pressing plate has at least one positioned portion and a retaining plate corresponding to the fixed plate. The retaining plate abuts against a side edge of the article for preventing the article from moving along a first direction. The positioning component movably passes through the positioned portion to allow the pressing plate to selectively move along the first direction and be positioned on the fixed plate for adjusting the distance between the retaining plate and the fixed plate.
    • 提供紧固装置用于将至少一个物品紧固在载体上。 紧固装置包括至少一个定位部件,固定在载体上的固定板和通过定位部件定位在固定板上的按压板。 压板具有至少一个定位部分和与固定板对应的保持板。 保持板抵靠物品的侧边缘,以防止物品沿着第一方向移动。 定位组件可移动地穿过定位部分,以允许按压板沿着第一方向选择性地移动,并且定位在固定板上,用于调整保持板和固定板之间的距离。
    • 10. 发明授权
    • Method of pattern etching a low K dielectric layer
    • 图案蚀刻低K电介质层的方法
    • US06331380B1
    • 2001-12-18
    • US09549262
    • 2000-04-14
    • Yan YePavel IonovAllen ZhaoPeter Chang-Lin HsiehDiana Xiaobing MaChun YanJie Yuan
    • Yan YePavel IonovAllen ZhaoPeter Chang-Lin HsiehDiana Xiaobing MaChun YanJie Yuan
    • G03C558
    • H01L21/31138H01L21/02115H01L21/02118H01L21/0212H01L21/02274H01L21/0274H01L21/31116H01L21/31144H01L21/3127H01L21/3146H01L21/31612H01L21/32136H01L21/32139
    • A first embodiment of the present invention pertains to a method of patterning a semiconductor device conductive feature while permitting easy removal of any residual masking layer which remains after completion of the etching process. A multi-layered masking structure is used which includes a layer of high-temperature organic-based masking material overlaid by either a patterned layer of inorganic masking material or by a layer of patterned high-temperature imageable organic masking material. The inorganic masking material is used to transfer a pattern to the high-temperature organic-based masking material and is then removed. The high-temperature organic-based masking material is used to transfer the pattern and then may be removed if desired. This method is also useful in the pattern etching of aluminum, even though aluminum can be etched at lower temperatures. A second embodiment of the present invention pertains to a specialized etch chemistry useful in the patterning of organic polymeric layers such as low k dielectrics, or other organic polymeric interfacial layers. This etch chemistry is useful for mask opening during the etch of a conductive layer or is useful in etching damascene structures where a metal fill layer is applied over the surface of a patterned organic-based dielectric layer. The etch chemistry provides for the use of etchant plasma species which minimize oxygen, fluorine, chlorine, and bromine content.
    • 本发明的第一实施例涉及一种图案化半导体器件导电特征的方法,同时允许容易地去除在蚀刻工艺完成之后保留的任何残留掩模层。 使用多层掩模结构,其包括由无机掩模材料的图案化层或由图案化的高温可成像有机掩蔽材料层覆盖的高温有机基掩蔽材料层。 无机掩模材料用于将图案转印到高温有机基掩蔽材料上,然后除去。 高温有机基掩蔽材料用于转移图案,然后如果需要可以去除。 这种方法在铝的图案蚀刻中也是有用的,即使在较低温度下可以蚀刻铝。 本发明的第二个实施方案涉及可用于图案化有机聚合物层如低k电介质或其它有机聚合物界面层的专用蚀刻化学物质。 该蚀刻化学物质可用于在导电层的蚀刻过程中的掩模开口,或者可用于蚀刻镶嵌结构,其中金属填充层施加在图案化有机基介质层的表面上。 蚀刻化学提供了使氧化物,氟,氯和溴含量最小化的蚀刻剂等离子体物质的使用。