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1. 发明授权

US09156198B2 Temperature controlled molding of composite components 有权
标题翻译：复合组件的温度控制成型
公开(公告)号：US09156198B2
公开(公告)日：2015-10-13
申请号：US13560506
申请日：2012-07-27
申请人： Jichen Qin , Charles R. Hill , Richard Dale Michonski , Zhong Wang , Weineng Jiang , Marlon M. Lalican
发明人： Jichen Qin , Charles R. Hill , Richard Dale Michonski , Zhong Wang , Weineng Jiang , Marlon M. Lalican
IPC分类号： B29C45/14 , B29C45/73 , B29K305/02 , B29K305/00
CPC分类号： B29C45/14778 , B29C45/73 , B29C2045/14877 , B29C2045/7343 , B29C2045/7356 , B29C2045/7393 , B29K2305/00 , B29K2305/02
摘要： Systems and processes that limit distortion of inserts (e.g., previously formed parts) in insert molding and overmolding processes. Initially, a mold may be closed (e.g., clamped) about an insert with the mold at a first temperature. After closing the mold about the insert, the mold is heated up to a second temperature (e.g., a temperature suitable for injection of the molding material) and filled with the molding material to contact (e.g., encapsulate) the insert. After the mold has been cooled, the mold may be opened and the finished part (including the insert and the solidified molding material) removed (e.g., ejected). The process may be repeated for additional finished parts. Closing the mold about the insert before heating the mold to the injection temperature advantageously limits distortion of the insert that would otherwise occur by placing the insert into the mold with the mold already at the injection temperature.
摘要翻译：在嵌件成型和包覆成型工艺中限制插入件（例如，先前形成的部件）的变形的系统和工艺。最初，模具可以在模具的第一温度下围绕插入物封闭（例如夹紧）。在围绕插入件关闭模具之后，将模具加热到第二温度（例如，适于注射成型材料的温度），并填充模制材料以接触（例如，封装）插入件。在模具冷却之后，可以打开模具，并且去除（例如，喷射）成品部件（包括插入件和固化的模制材料）。对于另外的成品可以重复该过程。在将模具加热到注射温度之前关闭插入件的模具有利地限制了插入件的变形，否则通过将模具放置在具有模具的模具中而已经处于注射温度。

2. 发明申请

US20130026678A1 TEMPERATURE CONTROLLED MOLDING OF COMPOSITE COMPONENTS 有权
标题翻译：复合材料的温度控制成型
公开(公告)号：US20130026678A1
公开(公告)日：2013-01-31
申请号：US13560506
申请日：2012-07-27
申请人： Jichen Qin , Charles R. Hill , Richard Dale Michonski , Zhong Wang , Weineng Jiang , Marlon M. Lalican
发明人： Jichen Qin , Charles R. Hill , Richard Dale Michonski , Zhong Wang , Weineng Jiang , Marlon M. Lalican
IPC分类号： B29C45/14 , B29C45/76 , B29C45/03 , B29C45/73
CPC分类号： B29C45/14778 , B29C45/73 , B29C2045/14877 , B29C2045/7343 , B29C2045/7356 , B29C2045/7393 , B29K2305/00 , B29K2305/02
摘要： Systems and processes that limit distortion of inserts (e.g., previously formed parts) in insert molding and overmolding processes. Initially, a mold may be closed (e.g., clamped) about an insert with the mold at a first temperature. After closing the mold about the insert, the mold is heated up to a second temperature (e.g., a temperature suitable for injection of the molding material) and filled with the molding material to contact (e.g., encapsulate) the insert. After the mold has been cooled, the mold may be opened and the finished part (including the insert and the solidified molding material) removed (e.g., ejected). The process may be repeated for additional finished parts. Closing the mold about the insert before heating the mold to the injection temperature advantageously limits distortion of the insert that would otherwise occur by placing the insert into the mold with the mold already at the injection temperature.
摘要翻译：在嵌件成型和包覆成型工艺中限制插入件（例如，先前形成的部件）的变形的系统和工艺。最初，模具可以在模具的第一温度下围绕插入物封闭（例如夹紧）。在围绕插入件关闭模具之后，将模具加热至第二温度（例如，适于注射成型材料的温度），并填充模制材料以接触（例如，封装）插入件。在模具冷却之后，可以打开模具，并且去除（例如，喷射）成品部件（包括插入件和固化的模制材料）。对于另外的成品可以重复该过程。在将模具加热到注射温度之前关闭插入件的模具有利地限制了插入件的变形，否则通过将模具放置在具有模具的模具中而已经处于注射温度。

3. 发明授权

US08552292B2 System and method for overmolding of decorated plastic parts 有权
标题翻译：装饰塑料件的包覆成型系统及方法
公开(公告)号：US08552292B2
公开(公告)日：2013-10-08
申请号：US12928508
申请日：2010-12-13
申请人： Jeff Qin , Charles R. Hill , Suriaprakash Narotamo , Levin Li , Spring Wu , Zhong Wang
发明人： Jeff Qin , Charles R. Hill , Suriaprakash Narotamo , Levin Li , Spring Wu , Zhong Wang
IPC分类号： H05K5/00 , B29C39/12
CPC分类号： H05K5/0243 , B29C45/06 , B29C45/162 , B29C45/1675
摘要： An electronic device enclosure includes a first structural layer having a first surface and a second surface. A decorative feature is formed on the first surface of the first structural layer. The enclosure further includes a second structural layer, which is formed directly on the first surface of the first structural layer. The second structural layer is formed over the decorative feature by an overmolding process.
摘要翻译：电子设备外壳包括具有第一表面和第二表面的第一结构层。在第一结构层的第一表面上形成装饰性特征。外壳还包括第二结构层，其直接形成在第一结构层的第一表面上。第二结构层通过包覆成型工艺形成在装饰特征上。

4. 发明申请

US20110180294A1 System and method for overmolding of decorated plastic parts 有权
标题翻译：装饰塑料件的包覆成型系统及方法
公开(公告)号：US20110180294A1
公开(公告)日：2011-07-28
申请号：US12928508
申请日：2010-12-13
申请人： Jichen (Jeff) Qin , Charles R. Hill , Suriaprakash Narotamo , Wu Bing (Levin) Li , Spring Wu , Zhong Wang
发明人： Jichen (Jeff) Qin , Charles R. Hill , Suriaprakash Narotamo , Wu Bing (Levin) Li , Spring Wu , Zhong Wang
IPC分类号： H05K5/00 , B29C39/12 , B29C39/02 , B29C39/22
CPC分类号： H05K5/0243 , B29C45/06 , B29C45/162 , B29C45/1675
摘要： An electronic device enclosure includes a first structural layer having a first surface and a second surface. A decorative feature is formed on the first surface of the first structural layer. The enclosure further includes a second structural layer, which is formed directly on the first surface of the first structural layer. The second structural layer is formed over the decorative feature by an overmolding process.
摘要翻译：电子设备外壳包括具有第一表面和第二表面的第一结构层。在第一结构层的第一表面上形成装饰性特征。外壳还包括第二结构层，其直接形成在第一结构层的第一表面上。第二结构层通过包覆成型工艺在装饰特征上形成。

5. 发明授权

US09005495B2 System and method for rapidly heating and cooling a mold 有权
标题翻译：快速加热和冷却模具的系统和方法
公开(公告)号：US09005495B2
公开(公告)日：2015-04-14
申请号：US12589123
申请日：2009-10-16
申请人： Zhong Wang , Charles R. Hill
发明人： Zhong Wang , Charles R. Hill
IPC分类号： B29C45/73 , B29C35/00 , B29C35/04
CPC分类号： B29C35/007 , B29C35/049 , B29C45/7306
摘要： A portable mold-temperature control unit includes a local heating system, a first fluid duct, a second fluid duct, and a fluid exchange system. The local heating system includes a local heater for heating fluid that is used to rapidly heat a mold. The first fluid duct carries hot fluid heated by the local heating system. The second fluid duct carries cool fluid that is used to rapidly cool a mold. The fluid exchange system includes an outlet that permits fluid to flow from the first and second fluid ducts to the mold during heating and cooling, respectively. The fluid exchange system also includes an inlet that receives the fluid as it returns from the mold. In one embodiment, the heating system reheats the fluid returning from the mold and reuses it to heat the mold again. In a more particular embodiment, the heating system includes a steam generator that generates steam used to heat the mold. In another embodiment, the portable mold-temperature control system includes a local cooling system that cools the fluid used to cool the mold. In a more particular embodiment, the local cooling system cools fluid returning from the mold and reuses it to cool the mold. A method for using the portable mold-temperature control unit is also disclosed.
摘要翻译：便携式模具温度控制单元包括局部加热系统，第一流体管道，第二流体管道和流体交换系统。局部加热系统包括用于加热用于快速加热模具的流体的局部加热器。第一流体管道承载由本地加热系统加热的热流体。第二流体管道承载用于快速冷却模具的冷却流体。流体交换系统包括分别在加热和冷却期间允许流体从第一和第二流体管道流动到模具的出口。流体交换系统还包括当从模具返回时接收流体的入口。在一个实施例中，加热系统重新加热从模具返回的流体并重新使用它以再次加热模具。在更具体的实施例中，加热系统包括产生用于加热模具的蒸汽的蒸汽发生器。在另一个实施例中，便携式模具温度控制系统包括冷却用于冷却模具的流体的局部冷却系统。在更具体的实施例中，局部冷却系统冷却从模具返回的流体并重新使用它来冷却模具。还公开了一种使用便携式模具温度控制单元的方法。

6. 发明申请

US20100187709A1 System and method for rapidly heating and cooling a mold 有权
标题翻译：快速加热和冷却模具的系统和方法
公开(公告)号：US20100187709A1
公开(公告)日：2010-07-29
申请号：US12589123
申请日：2009-10-16
申请人： Zhong Wang , Charles R. Hill
发明人： Zhong Wang , Charles R. Hill
IPC分类号： B29C33/04
CPC分类号： B29C35/007 , B29C35/049 , B29C45/7306
摘要： A portable mold-temperature control unit includes a local heating system, a first fluid duct, a second fluid duct, and a fluid exchange system. The local heating system includes a local heater for heating fluid that is used to rapidly heat a mold. The first fluid duct carries hot fluid heated by the local heating system. The second fluid duct carries cool fluid that is used to rapidly cool a mold. The fluid exchange system includes an outlet that permits fluid to flow from the first and second fluid ducts to the mold during heating and cooling, respectively. The fluid exchange system also includes an inlet that receives the fluid as it returns from the mold. In one embodiment, the heating system reheats the fluid returning from the mold and reuses it to heat the mold again. In a more particular embodiment, the heating system includes a steam generator that generates steam used to heat the mold. In another embodiment, the portable mold-temperature control system includes a local cooling system that cools the fluid used to cool the mold. In a more particular embodiment, the local cooling system cools fluid returning from the mold and reuses it to cool the mold. A method for using the portable mold-temperature control unit is also disclosed.
摘要翻译：便携式模具温度控制单元包括局部加热系统，第一流体管道，第二流体管道和流体交换系统。局部加热系统包括用于加热用于快速加热模具的流体的局部加热器。第一流体管道承载由本地加热系统加热的热流体。第二流体管道承载用于快速冷却模具的冷却流体。流体交换系统包括分别在加热和冷却期间允许流体从第一和第二流体管道流动到模具的出口。流体交换系统还包括当从模具返回时接收流体的入口。在一个实施例中，加热系统重新加热从模具返回的流体并重新使用它以再次加热模具。在更具体的实施例中，加热系统包括产生用于加热模具的蒸汽的蒸汽发生器。在另一个实施例中，便携式模具温度控制系统包括冷却用于冷却模具的流体的局部冷却系统。在更具体的实施例中，局部冷却系统冷却从模具返回的流体并重新使用它来冷却模具。还公开了一种使用便携式模具温度控制单元的方法。

7. 发明授权

US08899033B2 Brake booster leak detection system 有权
标题翻译：制动助力器泄漏检测系统
公开(公告)号：US08899033B2
公开(公告)日：2014-12-02
申请号：US12013676
申请日：2008-01-14
申请人： Zhong Wang , Tony T. Hoang , Daryl A. Wilson , Margaret C. Richards , Lan Wang
发明人： Zhong Wang , Tony T. Hoang , Daryl A. Wilson , Margaret C. Richards , Lan Wang
IPC分类号： B60T13/52 , B60T17/22 , B60T17/18
CPC分类号： B60T17/18
摘要： A control system for evaluating a brake booster system includes an engine evaluation module that detects an engine off condition. A pressure evaluation module, during the engine off condition, monitors hydraulic brake line pressure, detects a change in brake booster pressure, and determines a brake booster vacuum decay rate based on the change in brake booster pressure. A fault reporting module detects a brake booster system fault based on the brake line pressure and the brake booster vacuum decay rate.
摘要翻译：用于评估制动助力系统的控制系统包括检测发动机关闭状态的发动机评估模块。压力评估模块在发动机关闭状态下监控液压制动管路压力，检测制动助力器压力的变化，并根据制动助力器压力的变化确定制动助力器真空衰减率。故障报告模块根据制动管路压力和制动助力器真空衰减率来检测制动助力器系统故障。

8. 发明授权

US08631783B2 Method and apparatus for controlling engine torque during intrusive testing 有权
标题翻译：在侵入式测试期间控制发动机扭矩的方法和装置
公开(公告)号：US08631783B2
公开(公告)日：2014-01-21
申请号：US12620848
申请日：2009-11-18
申请人： Lan Wang , Zhong Wang , Christopher E. Whitney , Jinchun Peng , Ian J. Mac Ewen
发明人： Lan Wang , Zhong Wang , Christopher E. Whitney , Jinchun Peng , Ian J. Mac Ewen
IPC分类号： F02P5/00 , F02M7/00 , F02M33/02
CPC分类号： F02M25/0827 , F02D41/003 , F02D41/08 , F02D41/1497 , F02D2250/22 , F02P5/1508 , Y02T10/46
摘要： A control system and method for controlling an engine includes a control module. The control module includes an evaporation control valve module closing a canister purge valve during a system diagnostic. A torque determination module determines a torque change for an end of the system diagnostic. A torque adjustment module changes an engine torque to a changed torque corresponding to the torque change. The evaporation control valve module opens the purge valve at the end of the diagnostic.
摘要翻译：用于控制发动机的控制系统和方法包括控制模块。控制模块包括在系统诊断期间关闭罐式清洗阀的蒸发控制阀模块。扭矩确定模块确定系统诊断结束时的扭矩变化。扭矩调节模块将发动机扭矩改变为与转矩变化相对应的变化转矩。蒸发控制阀模块在诊断结束时打开清洗阀。

9. 发明申请

US20120290997A1 Multi-Threaded Global Routing 有权
标题翻译：多线程全局路由
公开(公告)号：US20120290997A1
公开(公告)日：2012-11-15
申请号：US13562176
申请日：2012-07-30
申请人： Hua Wen , Hsiao-Ping Tseng , Zhong Wang
发明人： Hua Wen , Hsiao-Ping Tseng , Zhong Wang
IPC分类号： G06F17/50
CPC分类号： G06F17/5077
摘要： A method is described for routing a semiconductor chip's global nets. The method includes identifying a subset of the global nets and routing the subset of global nets using multiple threads, where, each of the global nets within the subset are routed by one of the threads in isolation of the subset's other global nets. The method further includes identifying a second subset of the global nets and routing the second subset of global nets using the multiple threads, where, each of the global nets within the second subset are routed by one of the threads in isolation of the second subset's other global nets but in respect of the routes of first subset of global nets.
摘要翻译：描述了一种用于布线半导体芯片的全局网络的方法。该方法包括识别全局网络的子集，并使用多个线程来路由全局网络的子集，其中，子集内的每个全局网络被该子集的其他全局网络隔离的一个线程路由。该方法还包括识别全局网络的第二子集，并且使用多个线程来路由全局网络的第二子集，其中，第二子集中的每个全局网络被第二子集的另一个隔离的线程之一路由全球网络，但是关于全球网络的第一个子集的路由。

10. 发明授权

US08234614B1 Multi-threaded global routing 有权
标题翻译：多线程全局路由
公开(公告)号：US08234614B1
公开(公告)日：2012-07-31
申请号：US12156963
申请日：2008-06-05
申请人： Hua Wen , Hsiao-Ping Tseng , Zhong Wang
发明人： Hua Wen , Hsiao-Ping Tseng , Zhong Wang
IPC分类号： G06F17/50
CPC分类号： G06F17/5077
摘要： A method is described for routing a semiconductor chip's global nets. The method includes identifying a subset of the global nets and routing the subset of global nets using multiple threads, where, each of the global nets within the subset are routed by one of the threads in isolation of the subset's other global nets. The method further includes identifying a second subset of the global nets and routing the second subset of global nets using the multiple threads, where, each of the global nets within the second subset are routed by one of the threads in isolation of the second subset's other global nets but in respect of the routes of first subset of global nets.
摘要翻译：描述了一种用于布线半导体芯片的全局网络的方法。该方法包括识别全局网络的子集，并使用多个线程来路由全局网络的子集，其中，子集内的每个全局网络被该子集的其他全局网络隔离的一个线程路由。该方法还包括识别全局网络的第二子集，并且使用多个线程来路由全局网络的第二子集，其中，第二子集中的每个全局网络被第二子集的另一个隔离的线程之一路由全球网络，但是关于全球网络的第一个子集的路由。

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