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1. 发明申请

US20130071636A1 MICROCAVITY CARRIER BELT AND METHOD OF MANUFACTURE 有权
标题翻译：微型载体带和制造方法
公开(公告)号：US20130071636A1
公开(公告)日：2013-03-21
申请号：US13233360
申请日：2011-09-15
申请人： Jiannrong Lee , Yuhao Sun , Maung Kyaw Aung , Chin-Jen Tseng , Chiapu Chang , Shuji Rokutanda , Rong-Chang Liang
发明人： Jiannrong Lee , Yuhao Sun , Maung Kyaw Aung , Chin-Jen Tseng , Chiapu Chang , Shuji Rokutanda , Rong-Chang Liang
IPC分类号： B32B5/16 , B32B3/10 , B65G17/36 , B32B38/10 , B32B37/14
CPC分类号： C09J9/02 , B32B3/10 , B32B5/16 , B32B7/12 , B32B27/14 , B32B27/281 , B32B27/285 , B32B27/286 , B32B27/308 , B32B27/36 , B32B27/365 , B32B37/12 , B32B37/14 , B32B37/226 , B32B38/06 , B32B38/10 , B32B2255/10 , B32B2255/26 , B32B2264/105 , B32B2266/045 , B32B2307/202 , B32B2309/08 , B32B2310/0843 , B32B2457/00 , B65G17/36 , C08K9/02 , C08K2201/001 , C09J7/00 , C09J7/10 , C09J2201/28 , C09J2201/602 , C09J2203/326 , C09J2205/102 , C09J2433/00 , C09J2461/00 , C09J2463/00 , H05K3/321 , Y10T156/1066 , Y10T428/24893 , Y10T428/249921
摘要： A method for fabricating an electronic device or component such as an anisotropic conductive film comprising: distributing a plurality of conductive particles into an array of microcavities formed on a surface of a continuous carrier belt, rotating the belt carrying the conductive particles while conveying a surface of an adhesive layer into contact with the surface of the rotating belt, transferring the conductive particles from the microcavities on the belt to the adhesive layer in predefined locations in the adhesive layer corresponding to the array of microcavities on the belt, and separating the adhesive layer from the surface of the belt. In one embodiment, the position of the microcavities is varied in a controlled manner.
摘要翻译：一种用于制造诸如各向异性导电膜的电子器件或部件的方法，包括：将多个导电粒子分布在形成在连续载体带的表面上的微腔阵列中，使携带导电颗粒的带旋转，同时传送将粘合剂层与旋转带的表面接触，将导电颗粒从带上的微腔转移到粘合剂层中的粘合剂层中的对应于带上的微腔阵列的预定位置，并将粘合剂层从皮带的表面。在一个实施例中，微腔的位置以受控的方式变化。

2. 发明授权

US09102851B2 Microcavity carrier belt and method of manufacture 有权
标题翻译：微腔载体带及其制造方法
公开(公告)号：US09102851B2
公开(公告)日：2015-08-11
申请号：US13233360
申请日：2011-09-15
申请人： Jiannrong Lee , Yuhao Sun , Maung Kyaw Aung , Chin-Jen Tseng , Chiapu Chang , Shuji Rokutanda , Rong-Chang Liang
发明人： Jiannrong Lee , Yuhao Sun , Maung Kyaw Aung , Chin-Jen Tseng , Chiapu Chang , Shuji Rokutanda , Rong-Chang Liang
IPC分类号： B32B5/16 , B32B3/10 , B65G17/36 , B32B38/10 , B32B37/14 , C09J9/02 , B32B37/22 , C09J7/00 , B32B7/12 , B32B27/14 , B32B27/28 , B32B27/30 , B32B27/36 , B32B37/12 , B32B38/06 , C08K9/02 , H05K3/32
CPC分类号： C09J9/02 , B32B3/10 , B32B5/16 , B32B7/12 , B32B27/14 , B32B27/281 , B32B27/285 , B32B27/286 , B32B27/308 , B32B27/36 , B32B27/365 , B32B37/12 , B32B37/14 , B32B37/226 , B32B38/06 , B32B38/10 , B32B2255/10 , B32B2255/26 , B32B2264/105 , B32B2266/045 , B32B2307/202 , B32B2309/08 , B32B2310/0843 , B32B2457/00 , B65G17/36 , C08K9/02 , C08K2201/001 , C09J7/00 , C09J7/10 , C09J2201/28 , C09J2201/602 , C09J2203/326 , C09J2205/102 , C09J2433/00 , C09J2461/00 , C09J2463/00 , H05K3/321 , Y10T156/1066 , Y10T428/24893 , Y10T428/249921
摘要： A method for fabricating an electronic device or component such as an anisotropic conductive film comprising: distributing a plurality of conductive particles into an array of microcavities formed on a surface of a continuous carrier belt, rotating the belt carrying the conductive particles while conveying a surface of an adhesive layer into contact with the surface of the rotating belt, transferring the conductive particles from the microcavities on the belt to the adhesive layer in predefined locations in the adhesive layer corresponding to the array of microcavities on the belt, and separating the adhesive layer from the surface of the belt. In one embodiment, the position of the microcavities is varied in a controlled manner.
摘要翻译：一种用于制造诸如各向异性导电膜的电子器件或部件的方法，包括：将多个导电粒子分布在形成在连续载体带的表面上的微腔阵列中，使携带导电颗粒的带旋转，同时传送将粘合剂层与旋转带的表面接触，将导电颗粒从带上的微腔转移到粘合剂层中的粘合剂层中的对应于带上的微腔阵列的预定位置，并将粘合剂层从皮带的表面。在一个实施例中，微腔的位置以受控的方式变化。

3. 发明申请

US20140312501A1 NON-RANDOM ARRAY ANISOTROPIC CONDUCTIVE FILM (ACF) AND MANUFACTURING PROCESSES 审中-公开
标题翻译：非随机阵列非线性导电膜（ACF）和制造工艺
公开(公告)号：US20140312501A1
公开(公告)日：2014-10-23
申请号：US14282590
申请日：2014-05-20
申请人： Rong-Chang Liang , Hsiao-Ken Chuang , Jerry Chung , Chin-Jen Tseng , Shuji Rokutanda , Yuhao Sun
发明人： Rong-Chang Liang , Hsiao-Ken Chuang , Jerry Chung , Chin-Jen Tseng , Shuji Rokutanda , Yuhao Sun
IPC分类号： H05K1/02 , H05K3/00 , H01L23/48
CPC分类号： H05K1/0296 , B32B3/08 , B32B3/30 , B32B7/06 , B32B7/12 , B32B27/08 , B32B27/16 , B32B27/28 , B32B27/30 , B32B27/32 , B32B27/34 , B32B27/36 , B32B27/38 , B32B27/40 , B32B2264/02 , B32B2264/10 , B32B2307/202 , B32B2307/706 , B32B2457/00 , B32B2457/08 , B32B2457/202 , H01B1/22 , H01L23/48 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/07811 , H01L2924/12042 , H05K3/00 , H05K3/323 , H05K2201/10378 , H05K2203/0113 , H05K2203/0338 , Y10T428/24289 , H01L2924/00
摘要： Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, of selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution.
摘要翻译：使用具有预定构型，形状和尺寸的微腔的非随机阵列的ACF阵列的结构和制造工艺。该制造方法包括将导电颗粒流体填充到包含预定阵列的微腔的衬底或载体网上，阵列的选择性金属化，然后用填充材料填充阵列，并在填充的微腔阵列上进行第二选择性金属化。然后将由此制备的填充的导电微腔阵列用粘合剂膜覆盖或层压。阵列中的腔和填充腔的颗粒可以具有单峰，双峰或多峰分布。

4. 发明申请

US20120295098A1 FIXED-ARRAY ANISOTROPIC CONDUCTIVE FILM USING SURFACE MODIFIED CONDUCTIVE PARTICLES 审中-公开
标题翻译：使用表面改性的导电颗粒固定阵列导电薄膜
公开(公告)号：US20120295098A1
公开(公告)日：2012-11-22
申请号：US13111300
申请日：2011-05-19
申请人： Jiunn-Jye Hwang , Jiannrong Lee , Shuji Rokutanda , Chin-Jen Tseng , Rong-Chang Liang
发明人： Jiunn-Jye Hwang , Jiannrong Lee , Shuji Rokutanda , Chin-Jen Tseng , Rong-Chang Liang
IPC分类号： B32B5/16 , B32B5/00 , B32B7/12
CPC分类号： H01B1/22 , C08K3/08 , C08K9/04 , C08K9/06 , C08K2201/001 , C09J7/10 , C09J9/02 , C09J11/04 , C09J2201/602 , C09J2203/326 , C09J2463/00 , Y10T428/249921 , Y10T428/25 , Y10T428/256 , Y10T428/264
摘要： Structures and manufacturing processes of an ACF array and more particularly a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles surface-treated with a coupling agent onto a substrate or carrier web comprising a predetermined array of microcavities. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film, the conductive particles are transferred to the adhesive film such that they are only partially embedded in the film.
摘要翻译： ACF阵列的结构和制造过程，更具体地，是具有预定构型，形状和尺寸的非随机阵列的微腔。该制造方法包括用偶联剂将表面处理的导电颗粒流体填充到包含预定阵列的微腔的基底或载体网上。然后将如此制备的填充的导电微腔阵列用粘合剂膜覆盖或层压，将导电颗粒转移到粘合剂膜，使得它们仅部分地嵌入膜中。

5. 发明申请

US20140261992A1 MICROCAVITY CARRIER WITH IMAGE ENHANCEMENT FOR LASER ABLATION 有权
标题翻译：微波载波与图像增强激光雷射
公开(公告)号：US20140261992A1
公开(公告)日：2014-09-18
申请号：US13796873
申请日：2013-03-12
申请人： Rong-Chang Liang , Chin-Jen Tseng , Ta-Ching Wu , Jia Yen Leong , Zhiyao AN , An-Yu Ma , Maung Kyaw Aung
发明人： Rong-Chang Liang , Chin-Jen Tseng , Ta-Ching Wu , Jia Yen Leong , Zhiyao AN , An-Yu Ma , Maung Kyaw Aung
IPC分类号： B32B37/00 , B32B38/00
CPC分类号： B32B38/10 , B32B3/26 , B32B7/12 , B32B27/08 , B32B27/20 , B32B27/205 , B32B27/281 , B32B27/285 , B32B27/286 , B32B27/302 , B32B27/34 , B32B27/36 , B32B27/365 , B32B27/38 , B32B2255/10 , B32B2255/26 , B32B2264/0235 , B32B2264/025 , B32B2264/0257 , B32B2264/0264 , B32B2264/0292 , B32B2264/105 , B32B2270/00 , B32B2307/202 , B32B2307/714 , B32B2310/0843 , B32B2413/00 , C08J7/04 , H05K3/323 , Y10T428/249978 , Y10T428/24998 , Y10T428/31504 , Y10T428/31507 , Y10T428/31663 , Y10T428/31721 , Y10T428/31725 , Y10T428/31786 , Y10T428/31935 , Y10T428/31938 , Y10T428/31942
摘要： A carrier belt for fabricating a device or component such as an anisotropic conductive film. The carrier belt includes a substrate having a sacrificial image enhancing layer. Microcavities are formed in the carrier by laser ablation through the image enhancing layer. After the image enhancement layer is removed, a plurality of conductive particles are distributed into an array of microcavities formed by laser ablation on a surface of a carrier belt and transferred to an adhesive layer. The image enhancing layer enables one to form microcavities with a fine pitch and spacing and partitions having a high aspect ratio.
摘要翻译：用于制造诸如各向异性导电膜的器件或部件的载体带。载体带包括具有牺牲图像增强层的基底。通过激光烧蚀通过图像增强层在载体中形成微腔。在去除图像增强层之后，将多个导电颗粒分布到由载体带的表面上的激光烧蚀形成的微腔阵列中并转移到粘合剂层。图像增强层使得能够以细间距和间隔形成具有高纵横比的分隔壁的微腔。

6. 发明授权

US09352539B2 Microcavity carrier with image enhancement for laser ablation 有权
标题翻译：具有激光消融图像增强的微腔载体
公开(公告)号：US09352539B2
公开(公告)日：2016-05-31
申请号：US13796873
申请日：2013-03-12
申请人： Rong-Chang Liang , Chin-Jen Tseng , Ta-Ching Wu , Jia Yen Leong , Zhiyao An , An-Yu Ma , Maung Kyaw Aung
发明人： Rong-Chang Liang , Chin-Jen Tseng , Ta-Ching Wu , Jia Yen Leong , Zhiyao An , An-Yu Ma , Maung Kyaw Aung
IPC分类号： B32B3/00 , B32B38/10 , B32B3/26 , C08J7/04 , B32B7/12 , B32B27/08 , B32B27/20 , B32B27/28 , B32B27/30 , B32B27/34 , B32B27/36 , B32B27/38 , H05K3/32
CPC分类号： B32B38/10 , B32B3/26 , B32B7/12 , B32B27/08 , B32B27/20 , B32B27/205 , B32B27/281 , B32B27/285 , B32B27/286 , B32B27/302 , B32B27/34 , B32B27/36 , B32B27/365 , B32B27/38 , B32B2255/10 , B32B2255/26 , B32B2264/0235 , B32B2264/025 , B32B2264/0257 , B32B2264/0264 , B32B2264/0292 , B32B2264/105 , B32B2270/00 , B32B2307/202 , B32B2307/714 , B32B2310/0843 , B32B2413/00 , C08J7/04 , H05K3/323 , Y10T428/249978 , Y10T428/24998 , Y10T428/31504 , Y10T428/31507 , Y10T428/31663 , Y10T428/31721 , Y10T428/31725 , Y10T428/31786 , Y10T428/31935 , Y10T428/31938 , Y10T428/31942
摘要： A carrier belt for fabricating a device or component such as an anisotropic conductive film. The carrier belt includes a substrate having a sacrificial image enhancing layer. Microcavities are formed in the carrier by laser ablation through the image enhancing layer. After the image enhancement layer is removed, a plurality of conductive particles are distributed into an array of microcavities formed by laser ablation on a surface of a carrier belt and transferred to an adhesive layer. The image enhancing layer enables one to form microcavities with a fine pitch and spacing and partitions having a high aspect ratio.
摘要翻译：用于制造诸如各向异性导电膜的器件或部件的载体带。载体带包括具有牺牲图像增强层的基底。通过激光烧蚀通过图像增强层在载体中形成微腔。在去除图像增强层之后，将多个导电颗粒分布到由载体带的表面上的激光烧蚀形成的微腔阵列中并转移到粘合剂层。图像增强层使得能够以细间距和间隔形成具有高纵横比的分隔壁的微腔。

7. 发明申请

US20140141195A1 FIXED ARRAY ACFs WITH MULTI-TIER PARTIALLY EMBEDDED PARTICLE MORPHOLOGY AND THEIR MANUFACTURING PROCESSES 审中-公开
标题翻译：具有多个部分嵌入颗粒形态的固定阵列ACF及其制造过程
公开(公告)号：US20140141195A1
公开(公告)日：2014-05-22
申请号：US13678935
申请日：2012-11-16
申请人： Rong-Chang Liang , Maung Kyaw Aung , Yuhao Sun , An-Yu Ma
发明人： Rong-Chang Liang , Maung Kyaw Aung , Yuhao Sun , An-Yu Ma
IPC分类号： H01B7/00
CPC分类号： H05K3/323 , C08K7/04 , C08K7/16 , C08K2201/001 , C08K2201/005 , C09J7/20 , C09J9/02 , C09J2203/326 , C09J2205/102 , Y10T428/24
摘要： An anisotropic conductive film (ACF) comprising: (a) an adhesive layer having a substantially uniform thickness; and (b) a plurality of conductive particles individually adhered to the adhesive layer, wherein the conductive particles include a first non-random array of particle sites partially embedded at a first depth within the adhesive layer and a second fixed non-random array or dispersion of conductive particles partially embedded at a second depth or a dispersion of conductive particles fully embedded within the adhesive layer, wherein the first depth and the second depth are distinctly different. The ACF may be supplied as a sheet, a continuous film or as a roll and the multi-tier morphology may be present throughout the length of the product or in select areas.
摘要翻译：一种各向异性导电膜（ACF），包括：（a）具有基本均匀厚度的粘合剂层; 和（b）多个导电颗粒分别粘附到粘合剂层上，其中导电颗粒包括部分嵌入粘合剂层内的第一深度的第一非随机阵列的颗粒部位和第二固定非随机阵列或分散体导电颗粒部分地嵌入在完全嵌入粘合剂层内的导电颗粒的第二深度或分散体上，其中第一深度和第二深度明显不同。 ACF可以作为片材，连续膜片或辊片提供，并且多层形态可以存在于整个产品的整个长度或选择的区域中。

8. 发明申请

US20110253943A1 ONE PART EPOXY RESIN INCLUDING A LOW PROFILE ADDITIVE 审中-公开
标题翻译：一部分环氧树脂，包括一个低配置添加剂
公开(公告)号：US20110253943A1
公开(公告)日：2011-10-20
申请号：US12762623
申请日：2010-04-19
申请人： Rong-Chang Liang , Yuhao Sun , Hua Song , Chin-Jen Tseng , Hsiao Ken Chuang
发明人： Rong-Chang Liang , Yuhao Sun , Hua Song , Chin-Jen Tseng , Hsiao Ken Chuang
IPC分类号： H01B1/12 , C09J163/00
CPC分类号： C09J163/00 , C08K3/36 , C08K5/3445 , C08K5/5435 , C08L33/00 , C08L2666/04 , C08L2666/24 , H05K3/323
摘要： An adhesive composition comprising: (i) a one part curable epoxy adhesive and (ii) a low profile additive (LPA), the low profile additive being a polymer that is compatible with the epoxy adhesive such that it forms a single phase when admixed with the adhesive composition and that separates from the adhesive to form a network of stress-absorbing nodules therein when the adhesive is cured, the low profile additive being present in an amount sufficient to prevent or reduce shrinkage and/or the formation of voids or cracks when the adhesive is cured. In one embodiment the LPA is a block copolymer including at least one flexible block and at least one rigid block that makes the low profile additive compatible with the epoxy adhesive such that a mixture of the uncured epoxy resin and the low profile additive forms a homogenous solution and as the epoxy resin is cured, the low profile additive forms a stress absorbing network of nodules in the cured epoxy resin matrix.
摘要翻译：一种粘合剂组合物，其包含：（i）一部分可固化环氧粘合剂和（ii）低分子添加剂（LPA），所述低轮廓添加剂是与环氧粘合剂相容的聚合物，使得当与环氧粘合剂混合时形成单相粘合剂组合物并且当粘合剂固化时，其与粘合剂分离以形成其中的应力吸收结节网络，所述低轮廓添加剂以足以防止或减少收缩和/或形成空隙或裂纹的量存在，当粘合剂固化。在一个实施方案中，LPA是包含至少一个柔性嵌段和至少一个刚性嵌段的嵌段共聚物，其使得低轮廓添加剂与环氧粘合剂相容，使得未固化环氧树脂和低轮廓添加剂的混合物形成均匀溶液并且随着环氧树脂固化，低分子添加剂在固化的环氧树脂基质中形成结节的应力吸收网络。

9. 发明申请

US20130146816A1 ONE PART EPOXY RESIN INCLUDING ACRYLIC BLOCK COPOLYMER 审中-公开
标题翻译：一部分环氧树脂，包括丙烯酸嵌段共聚物
公开(公告)号：US20130146816A1
公开(公告)日：2013-06-13
申请号：US13761703
申请日：2013-02-07
申请人： Rong-Chang Liang , Yuhao Sun , Chin-Jen Tseng
发明人： Rong-Chang Liang , Yuhao Sun , Chin-Jen Tseng
IPC分类号： C09J163/00
CPC分类号： C09J163/00 , C08G2650/56 , C08K5/01 , C08K5/07 , C08K5/101 , C08L33/00 , C08L33/08 , C08L33/10 , C08L53/00 , C08L63/00 , C08L2666/04 , C08L2666/24 , C09J9/02 , C09J171/00 , H01L24/29 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2924/00011 , H01L2924/07811 , H01L2924/181 , H05K3/323 , H01L2224/83851 , H01L2924/00
摘要： An adhesive composition comprising a phenoxy resin, a latent hardener, an acrylic block co-polymer dispersant and a weak solvent wherein the dispersant enables the phenoxy resin to be dispersed in a weak solvent that does not attack the latent hardener thereby providing a composition with good shelf life. The compositions are useful in making anisotropic conductive films.
摘要翻译：一种粘合剂组合物，其包含苯氧树脂，潜在硬化剂，丙烯酸嵌段共聚物分散剂和弱溶剂，其中所述分散剂使得苯氧基树脂能够分散在不侵蚀潜在硬化剂的弱溶剂中，从而提供良好的组合物保质期。该组合物可用于制备各向异性导电膜。

10. 发明授权

US08802214B2 Non-random array anisotropic conductive film (ACF) and manufacturing processes 有权
标题翻译：非随机阵列各向异性导电膜（ACF）和制造工艺
公开(公告)号：US08802214B2
公开(公告)日：2014-08-12
申请号：US12608955
申请日：2009-10-29
申请人： Rong-Chang Liang , Jerry Chung , Chinjen Tseng , Shuji Rokutanda , Yuhao Sun , Hsiao-Ken Chuang
发明人： Rong-Chang Liang , Jerry Chung , Chinjen Tseng , Shuji Rokutanda , Yuhao Sun , Hsiao-Ken Chuang
IPC分类号： B32B3/10
CPC分类号： H05K1/0296 , B32B3/08 , B32B3/30 , B32B7/06 , B32B7/12 , B32B27/08 , B32B27/16 , B32B27/28 , B32B27/30 , B32B27/32 , B32B27/34 , B32B27/36 , B32B27/38 , B32B27/40 , B32B2264/02 , B32B2264/10 , B32B2307/202 , B32B2307/706 , B32B2457/00 , B32B2457/08 , B32B2457/202 , H01B1/22 , H01L23/48 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/07811 , H01L2924/12042 , H05K3/00 , H05K3/323 , H05K2201/10378 , H05K2203/0113 , H05K2203/0338 , Y10T428/24289 , H01L2924/00
摘要： Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, or selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution.
摘要翻译：使用具有预定构型，形状和尺寸的微腔的非随机阵列的ACF阵列的结构和制造过程。该制造方法包括将导电颗粒流体填充到包含预定阵列的微腔的衬底或载体纤维网上，或者阵列的选择性金属化，然后用填充材料填充阵列，并在填充的微腔阵列上进行第二选择性金属化。然后将由此制备的填充的导电微腔阵列用粘合剂膜覆盖或层压。阵列中的腔和填充腔的颗粒可以具有单峰，双峰或多峰分布。

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