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    • 7. 发明授权
    • Single event latch-up prevention techniques for a semiconductor device
    • 半导体器件的单事件闭锁预防技术
    • US08685800B2
    • 2014-04-01
    • US13560010
    • 2012-07-27
    • Jianan YangJames D. BurnettBrad J. GarniThomas W. ListonHuy Van Pham
    • Jianan YangJames D. BurnettBrad J. GarniThomas W. ListonHuy Van Pham
    • H01L21/332
    • H01L27/06H01L27/0921
    • A technique for addressing single-event latch-up (SEL) in a semiconductor device includes determining a location of a parasitic silicon-controlled rectifier (SCR) in an integrated circuit design of the semiconductor device. In this case, the parasitic SCR includes a parasitic pnp bipolar junction transistor (BJT) and a parasitic npn BJT. The technique also includes incorporating a first transistor between a first power supply node and an emitter of the parasitic pnp BJT in the integrated circuit design. The first transistor includes a first terminal coupled to the first power supply node, a second terminal coupled to the emitter of the parasitic pnp BJT, and a control terminal. The first transistor is not positioned between a base of the pnp BJT and the first power supply node. The first transistor limits current conducted by the parasitic pnp bipolar junction transistor following an SEL.
    • 用于在半导体器件中寻址单事件闩锁(SEL)的技术包括在半导体器件的集成电路设计中确定寄生硅控整流器(SCR)的位置。 在这种情况下,寄生SCR包括寄生pnp双极结型晶体管(BJT)和寄生npnBJT。 该技术还包括在集成电路设计中在第一电源节点和寄生pnp BJT的发射极之间并入第一晶体管。 第一晶体管包括耦合到第一电源节点的第一端子,耦合到寄生pnp BJT的发射极的第二端子和控制端子。 第一晶体管不位于pnp BJT的基极和第一电源节点之间。 第一晶体管限制了在SEL之后由寄生pnp双极结晶体传导的电流。
    • 8. 发明申请
    • SINGLE-EVENT LATCH-UP PREVENTION TECHNIQUES FOR A SEMICONDUCTOR DEVICE
    • 用于半导体器件的单事件闭锁预防技术
    • US20140027810A1
    • 2014-01-30
    • US13560010
    • 2012-07-27
    • Jianan YangJames D. BurnettBrad J. GarniThomas W. ListonHuy Van Pham
    • Jianan YangJames D. BurnettBrad J. GarniThomas W. ListonHuy Van Pham
    • H01L27/06G06F17/50
    • H01L27/06H01L27/0921
    • A technique for addressing single-event latch-up (SEL) in a semiconductor device includes determining a location of a parasitic silicon-controlled rectifier (SCR) in an integrated circuit design of the semiconductor device. In this case, the parasitic SCR includes a parasitic pnp bipolar junction transistor (BJT) and a parasitic npn BJT. The technique also includes incorporating a first transistor between a first power supply node and an emitter of the parasitic pnp BJT in the integrated circuit design. The first transistor includes a first terminal coupled to the first power supply node, a second terminal coupled to the emitter of the parasitic pnp BJT, and a control terminal. The first transistor is not positioned between a base of the pnp BJT and the first power supply node. The first transistor limits current conducted by the parasitic pnp bipolar junction transistor following an SEL.
    • 用于在半导体器件中寻址单事件闩锁(SEL)的技术包括在半导体器件的集成电路设计中确定寄生硅控整流器(SCR)的位置。 在这种情况下,寄生SCR包括寄生pnp双极结型晶体管(BJT)和寄生npnBJT。 该技术还包括在集成电路设计中在第一电源节点和寄生pnp BJT的发射极之间并入第一晶体管。 第一晶体管包括耦合到第一电源节点的第一端子,耦合到寄生pnp BJT的发射极的第二端子和控制端子。 第一晶体管不位于pnp BJT的基极和第一电源节点之间。 第一晶体管限制了在SEL之后由寄生pnp双极结晶体传导的电流。
    • 9. 发明授权
    • SRAM with embedded ROM
    • SRAM带嵌入式ROM
    • US08995178B1
    • 2015-03-31
    • US14069192
    • 2013-10-31
    • Jianan YangBrad J. GarniMark W. Jetton
    • Jianan YangBrad J. GarniMark W. Jetton
    • G11C11/00G11C11/412H01L27/11
    • G11C11/412G11C14/0054G11C17/12H01L27/1104
    • An integrated circuit includes first and second memory cells including a first pull-up transistor each having a body tie coupled to respective first and second well bias voltages. Drain electrodes of the first and second pull-up transistors are coupled to a first true bit line and a first complementary bit line, respectively. A second memory cell includes first and second pull-up transistors each having a body tie coupled to the second and first well bias voltages, respectively. Drain electrodes of the first and second pull-up transistors are coupled to a second true bit line and a second complementary bit line, respectively. The first well bias voltage is lower than the second well bias voltage during a Read-Only Memory (ROM) mode, and the first well bias voltage is the same as the second well bias voltage during a Static Random Access Memory (SRAM) mode.
    • 集成电路包括第一和第二存储器单元,其包括第一上拉晶体管,每个第一上拉晶体管具有耦合到相应的第一和第二阱偏置电压的主体带。 第一和第二上拉晶体管的漏极分别耦合到第一真位线和第一互补位线。 第二存储器单元包括分别具有耦合到第二阱偏置电压和第一阱偏置电压的主体带的第一和第二上拉晶体管。 第一和第二上拉晶体管的漏极电极分别耦合到第二真位线和第二互补位线。 在只读存储器(ROM)模式期间,第一阱偏置电压低于第二阱偏置电压,并且在静态随机存取存储器(SRAM)模式期间,第一阱偏置电压与第二阱偏置电压相同。