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    • 4. 发明申请
    • PARASITIC PIN DEVICE IN A BICMOS PROCESS AND MANUFACTURING METHOD OF THE SAME
    • BICMOS工艺中的PARASITIC PIN DEVICE及其制造方法
    • US20120049319A1
    • 2012-03-01
    • US13218316
    • 2011-08-25
    • Wensheng QianJu Hu
    • Wensheng QianJu Hu
    • H01L29/73H01L21/331
    • H01L27/0635H01L21/8249
    • A parasitic PIN device in a BiCMOS process is disclosed. The device is formed on a silicon substrate, in which an active region is isolated by shallow trenches. The device includes: an N-type region, consisting of N-type pseudo buried layers respectively formed at the bottom of shallow trench isolation oxide layers and extending into the active region; an I-type region, consisting of an N-type collector implantation region formed in the active region and contacting with the N-type region; a P-type region, consisting of a P-doped intrinsic base epitaxial layer on a surface of the active region and contacting with the I-type region. The device of the present invention has a low insertion loss and a high isolation. A manufacturing method of parasitic PIN device in compatible with existing BiCMOS process is also disclosed.
    • 公开了一种BiCMOS工艺中的寄生PIN器件。 该器件形成在硅衬底上,其中有源区被浅沟槽隔离。 该器件包括:N型区域,由分别形成在浅沟槽隔离氧化物层的底部并延伸到有源区域中的N型伪埋层构成; I型区域,由在有源区域形成并与N型区域接触的N型集电极注入区域构成; P型区域,由有源区域的表面上的P掺杂的本征基极外延层组成并与I型区域接触。 本发明的器件具有低插入损耗和高隔离度。 还公开了与现有BiCMOS工艺兼容的寄生PIN器件的制造方法。
    • 5. 发明授权
    • Parasitic PIN device in a BiCMOS process and manufacturing method of the same
    • 寄生PIN器件在BiCMOS工艺及其制造方法中的应用
    • US08476728B2
    • 2013-07-02
    • US13218316
    • 2011-08-25
    • Wensheng QianJu Hu
    • Wensheng QianJu Hu
    • H01L31/102H01L29/66
    • H01L27/0635H01L21/8249
    • A parasitic PIN device in a BiCMOS process is disclosed. The device is formed on a silicon substrate, in which an active region is isolated by shallow trenches. The device includes: an N-type region, consisting of N-type pseudo buried layers respectively formed at the bottom of shallow trench isolation oxide layers and extending into the active region; an I-type region, consisting of an N-type collector implantation region formed in the active region and contacting with the N-type region; a P-type region, consisting of a P-doped intrinsic base epitaxial layer on a surface of the active region and contacting with the I-type region. The device of the present invention has a low insertion loss and a high isolation. A manufacturing method of parasitic PIN device in compatible with existing BiCMOS process is also disclosed.
    • 公开了一种BiCMOS工艺中的寄生PIN器件。 该器件形成在硅衬底上,其中有源区被浅沟槽隔离。 该器件包括:N型区域,由分别形成在浅沟槽隔离氧化物层的底部并延伸到有源区域中的N型伪埋层构成; I型区域,由在有源区域形成并与N型区域接触的N型集电极注入区域构成; P型区域,由有源区域的表面上的P掺杂的本征基极外延层组成并与I型区域接触。 本发明的器件具有低插入损耗和高隔离度。 还公开了与现有BiCMOS工艺兼容的寄生PIN器件的制造方法。