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    • 5. 发明授权
    • Method for laser-scribing brittle substrates and apparatus therefor
    • 激光划片脆性基板的方法及其设备
    • US06787732B1
    • 2004-09-07
    • US10228066
    • 2002-08-27
    • Jialuo Jack XuanChung-Yuang ShihThanh Duc Nguyen
    • Jialuo Jack XuanChung-Yuang ShihThanh Duc Nguyen
    • B23K2636
    • B23K26/40B23K26/0823B23K26/389B23K26/53B23K2103/50B28D1/221C03B33/04C03B33/091Y02P40/57
    • A method of separating a sheet of a brittle material into portions by means of laser-scribing, comprising steps of: (a) providing a sheet of a brittle material having first and second opposing major surfaces separated by a thicknesst; (b) providing a source of laser energy adjacent said first surface, adapted for supplying a focussed beam of laser energy converging to a focal spot in a plane parallel to the first surface; (c) irradiating the sheet of brittle material with the focussed beam of laser energy, the plane of the focal spot of the beam initially being positioned within the sheet just below the first surface; and (d) continuing irradiating while simultaneously providing relative movement between the focal spot of the laser beam and the sheet to move the focal spot at a pre-selected rate and path extending over the first surface, and moving the depth of the plane of the focal spot at a pre-selected rate through a major portion of thickness t of the sheet to form a micro-crack zone extending along the pre-selected path from just below the first surface to a shallow depth just below the second surface.
    • 一种通过激光划线将脆性材料片分离成部分的方法,包括以下步骤:(a)提供具有由厚度分隔的第一和第二相对主表面的脆性材料片;(b)提供 与所述第一表面相邻的激光能量源,适于提供聚焦于与所述第一表面平行的平面中的焦斑的激光能量的聚焦束;(c)用所述聚焦激光能束照射所述脆性材料片, 梁的焦点的平面最初位于第一表面正下方的片材内; 和(d)继续照射,同时在激光束的焦斑和片材之间提供相对运动,以便以预先选择的速率和在第一表面上延伸的路径移动焦点,并且移动 焦点以片材的厚度t的大部分以预先选定的速率形成微裂纹区域,该微裂纹区域沿着从第一表面的正下方延伸到刚好在第二表面正下方的浅深度的预选路径延伸。