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    • 1. 发明申请
    • VEHICLE LIGHT
    • 车辆灯
    • US20120243203A1
    • 2012-09-27
    • US13426318
    • 2012-03-21
    • Teruo KOIKEJi-Hao Liang
    • Teruo KOIKEJi-Hao Liang
    • F21V9/00F21V9/14
    • F21S41/24F21S41/14F21S41/16
    • A vehicle light which uses a laser light source device and has a shorter dimension in an optical axis direction than conventional vehicle lights. The vehicle light comprises a laser light source device and an optical system configured so as to form a predetermined light distribution pattern. The laser light source device includes: a cylindrical light-guiding part having a diffusing surface set in a region other than a light-introducing surface; a phosphor arranged in a light-emitting region on an outer circumferential surface of the light-guiding part; a reflective film arranged in a region of the light-guiding part other than the light-introducing surface and the light-emitting region; and a laser light source that outputs a laser beam which is introduced into the light-guiding part from the light-introducing surface and enters the phosphor. The light-guiding part and the laser light source are arranged adjacent to each other.
    • 一种车辆用灯具,其使用激光光源装置,其光轴方向的尺寸比传统车辆灯短。 车辆光包括激光光源装置和配置为形成预定配光图案的光学系统。 激光光源装置包括:具有设置在除了光导入面以外的区域的扩散面的圆柱形导光部; 配置在所述导光部的外周面的发光区域的荧光体; 布置在所述导光部分的除了所述光导入表面和所述发光区域之外的区域中的反射膜; 以及激光源,其输出从所述光导入面导入所述导光部并进入所述荧光体的激光束。 导光部和激光光源彼此相邻配置。
    • 4. 发明申请
    • WAVELENGTH CONVERTING MEMBER AND LIGHT SOURCE DEVICE
    • 波长转换会员和光源设备
    • US20120224378A1
    • 2012-09-06
    • US13409676
    • 2012-03-01
    • Teruo KOIKEJi-Hao Liang
    • Teruo KOIKEJi-Hao Liang
    • F21V13/14F21V13/02
    • H01S5/005C09K11/7774H01S5/32341
    • A wavelength converting member radiates light having a wavelength different from that of laser light introduced into the wavelength converting member. The wavelength converting member has a phosphor layer that contains a phosphor therein. The phosphor layer has a laser light incidence surface capable of receiving the laser light. The wavelength converting member also has a high-refractive layer that is bonded to an opposite surface of the phosphor layer to the laser light incidence surface thereof. A refractive index of the high-refractive layer is higher than a refractive index of the phosphor layer. The high-refractive layer has concaves on at least either the bonding surface where the high-refractive layer is bonded to the phosphor layer or a light extraction surface that is opposite the bonding surface.
    • 波长转换构件辐射具有与引入到波长转换构件的激光的波长不同的波长的光。 波长转换构件具有在其中含有荧光体的荧光体层。 荧光体层具有能够接收激光的激光入射面。 波长转换部件还具有与荧光体层相对的激光入射面接合的高折射率层。 高折射层的折射率高于荧光体层的折射率。 高折射层在高折射层与荧光体层接合的接合面或与接合面相反的光提取面的至少一面具有凹部。
    • 7. 发明授权
    • Production process for semiconductor device
    • 半导体器件的生产工艺
    • US08530256B2
    • 2013-09-10
    • US13416635
    • 2012-03-09
    • Yasuyuki ShibataJi-Hao LiangTakako Chinone
    • Yasuyuki ShibataJi-Hao LiangTakako Chinone
    • H01L21/205H01L33/32
    • H01L21/0254H01L21/0242H01L21/02458H01L21/02494H01L21/02576H01L21/0262H01L21/02639H01L21/0265H01L21/02664H01L33/007H01L33/0079
    • (a) Forming on a growth substrate a void-containing layer that is made of a group III nitride compound semiconductor and contains voids. (b) Forming on the void-containing layer an n-type layer that is made of an n-type group III nitride compound semiconductor and serves to close the voids. (c) Forming on the n-type layer an active layer made of a group III nitride compound semiconductor. (d) Forming on the active layer a p-type layer made of a p-type group III nitride compound semiconductor. (e) Bonding a support substrate above the p-type layer. (f) Peeling off the growth substrate at the boundary where the void are produced. (g) Planarizing the n-type layer. Step (b) comprises (b1) forming part of the n-type layer under conditions where horizontal growth is relatively weak and (b2) forming the remaining part of the n-type layer under conditions where horizontal growth is relatively strong.
    • (a)在生长衬底上形成由III族氮化物化合物半导体制成且含有空隙的含空隙层。 (b)在含空隙层上形成由n型III族氮化物化合物半导体制成并用于封闭空隙的n型层。 (c)在n型层上形成由III族氮化物化合物半导体制成的有源层。 (d)在有源层上形成由p型III族氮化物半导体构成的p型层。 (e)将支撑衬底粘合在p型层上。 (f)在生成空隙的边界处剥离生长衬底。 (g)平面化n型层。 步骤(b)包括(b1)在水平生长相对较弱的条件下形成n型层的一部分,(b2)在水平生长相对较强的条件下形成n型层的剩余部分。
    • 10. 发明申请
    • PRODUCTION PROCESS FOR SEMICONDUCTOR DEVICE
    • 半导体器件的生产工艺
    • US20120231608A1
    • 2012-09-13
    • US13416635
    • 2012-03-09
    • Yasuyuki SHIBATAJi-Hao LiangTakako Chinone
    • Yasuyuki SHIBATAJi-Hao LiangTakako Chinone
    • H01L21/20
    • H01L21/0254H01L21/0242H01L21/02458H01L21/02494H01L21/02576H01L21/0262H01L21/02639H01L21/0265H01L21/02664H01L33/007H01L33/0079
    • (a) Forming on a growth substrate a void-containing layer that is made of a group III nitride compound semiconductor and contains voids. (b) Forming on the void-containing layer an n-type layer that is made of an n-type group III nitride compound semiconductor and serves to close the voids. (c) Forming on the n-type layer an active layer made of a group III nitride compound semiconductor. (d) Forming on the active layer a p-type layer made of a p-type group III nitride compound semiconductor. (e) Bonding a support substrate above the p-type layer. (f) Peeling off the growth substrate at the boundary where the void are produced. (g) Planarizing the n-type layer. Step (b) comprises (b1) forming part of the n-type layer under conditions where horizontal growth is relatively weak and (b2) forming the remaining part of the n-type layer under conditions where horizontal growth is relatively strong.
    • (a)在生长衬底上形成由III族氮化物化合物半导体制成且含有空隙的含空隙层。 (b)在含空隙层上形成由n型III族氮化物化合物半导体制成并用于封闭空隙的n型层。 (c)在n型层上形成由III族氮化物化合物半导体制成的有源层。 (d)在有源层上形成由p型III族氮化物半导体构成的p型层。 (e)将支撑衬底粘合在p型层上。 (f)在生成空隙的边界处剥离生长衬底。 (g)平面化n型层。 步骤(b)包括(b1)在水平生长相对较弱的条件下形成n型层的一部分,(b2)在水平生长相对较强的条件下形成n型层的剩余部分。