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1. 发明授权

US08217507B1 Edge mount semiconductor package 有权
标题翻译：边缘安装半导体封装
公开(公告)号：US08217507B1
公开(公告)日：2012-07-10
申请号：US12692522
申请日：2010-01-22
申请人： Jesse E. Galloway , Bob-Shih Wei Kuo , Ahmer Syed
发明人： Jesse E. Galloway , Bob-Shih Wei Kuo , Ahmer Syed
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K1/189 , H01L23/5387 , H01L24/97 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/14 , H01L2924/1815 , H05K1/028 , H05K3/284 , H05K2203/1316 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor package which is structured to allow for the edge mounting thereof in a vertical mount orientation. The semiconductor package comprises a flexible substrate or “flex circuit.” The flexible substrate includes a conductive pattern disposed on a first surface thereof, and a plurality of conductive pads or terminals disposed on a second surface thereof which is disposed in opposed relation to the first surface. Mounted to the first surface of the flexible substrate are one or more electronic components such as semiconductor dies. The semiconductor die(s) is/are electrically connected to the conductive pattern, and thereafter covered or encapsulated by a package body applied to a portion of the first surface of the flexible substrate. That portion of the flexible substrate including the conductive pads or terminals formed on the second surface thereof is thereafter folded and adhered to a portion of the package body through the use of a suitable adhesive.
摘要翻译：半导体封装，其被构造成允许其在垂直安装方向上的边缘安装。半导体封装包括柔性基板或“柔性电路”。柔性基板包括设置在其第一表面上的导电图案，以及设置在其第二表面上的多个导电焊盘或端子，该导电焊盘或端子设置成与第一表面。安装到柔性基板的第一表面是一个或多个电子部件，例如半导体管芯。半导体管芯电连接到导电图案，然后被施加到柔性基板的第一表面的一部分的封装体覆盖或封装。包括形成在其第二表面上的导电焊盘或端子的柔性基板的该部分此后通过使用合适的粘合剂折叠并粘附到封装体的一部分上。

2. 发明授权

US08866002B1 Through wafer via structures for concentrated photovoltaic cells 有权
标题翻译：通过用于集中光伏电池的晶片通孔结构
公开(公告)号：US08866002B1
公开(公告)日：2014-10-21
申请号：US12626512
申请日：2009-11-25
申请人： Garry Pycroft , Bob-Shih Wei Kuo , Frederick Reed
发明人： Garry Pycroft , Bob-Shih Wei Kuo , Frederick Reed
IPC分类号： H01L31/00
CPC分类号： H01L31/022433 , H01L31/0201 , Y02E10/50
摘要： In accordance with the present invention, there is provided multiple embodiments of a concentrated photovoltaic (CPV) receiver cell or die. In each embodiment of the present invention, the receiver die includes a multiplicity of through wafer vias or TWV's which are etched therethrough to effectively eliminate the bus bars on the top or front surface of the receiver die, connectors such as bus bars instead being effectively moved to the bottom or back surface of the receiver die. The movement of the connectors to the back surface of the receiver die provides the potential for a greater active surface area on the front surface for solar input.
摘要翻译：根据本发明，提供了集中光伏（CPV）接收器单元或管芯的多个实施例。在本发明的每个实施例中，接收器管芯包括多个通过晶片通孔或TWV，其被蚀刻穿过其中以有效地消除接收器管芯的顶表面或前表面上的母线，而不是有效地移动连接器到接收器模具的底部或后表面。连接器到接收器管芯的后表面的运动提供了用于太阳能输入的前表面上更大的有效表面积的潜力。

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