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1. 发明申请

US20120241116A1 REMOVING MATERIAL FROM DEFECTIVE OPENING IN GLASS MOLD 有权
标题翻译：从玻璃模具中的缺陷开启中去除材料
公开(公告)号：US20120241116A1
公开(公告)日：2012-09-27
申请号：US13491093
申请日：2012-06-07
申请人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
发明人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
IPC分类号： B22D46/00 , B22D25/02
CPC分类号： B23K1/018 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L2224/11 , H01L2224/11003 , H01L2224/111 , H01L2924/14 , H05K3/3478 , H05K2203/0113 , H05K2203/107 , Y10T156/10
摘要： Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.
摘要翻译：公开了使用激光脉冲从玻璃模具中的缺陷开口移除材料的方法，修理玻璃模具和用于注射成型焊料的相关玻璃模具（IMS）。在一个实施例中，一种方法包括提供包括多个焊料填充开口的玻璃模具; 识别玻璃模具中有缺陷的开口; 通过向缺陷开口施加激光脉冲从缺陷开口移除材料; 并通过以下方式填补缺陷开口来修复缺陷开口：通过向开口施加激光脉冲从玻璃模具中的开口去除冗余的，无缺陷的焊料部分，并且将冗余的，无缺陷的缺陷开口处的焊料部分。

2. 发明授权

US08237086B2 Removing material from defective opening in glass mold 有权
标题翻译：从玻璃模具中打开的缺陷中取出材料
公开(公告)号：US08237086B2
公开(公告)日：2012-08-07
申请号：US12014959
申请日：2008-01-16
申请人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
发明人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
IPC分类号： B23K26/36
CPC分类号： B23K1/018 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L2224/11 , H01L2224/11003 , H01L2224/111 , H01L2924/14 , H05K3/3478 , H05K2203/0113 , H05K2203/107 , Y10T156/10
摘要： Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.
摘要翻译：公开了使用激光脉冲从玻璃模具中的缺陷开口移除材料的方法，修理玻璃模具和用于注射成型焊料的相关玻璃模具（IMS）。在一个实施例中，一种方法包括提供包括多个焊料填充开口的玻璃模具; 识别玻璃模具中有缺陷的开口; 通过向缺陷开口施加激光脉冲从缺陷开口移除材料; 并通过以下方式填补缺陷开口来修复缺陷开口：通过向开口施加激光脉冲从玻璃模具中的开口去除冗余的，无缺陷的焊料部分，并且将冗余的，无缺陷的缺陷开口处的焊料部分。

3. 发明申请

US20090179020A1 REMOVING MATERIAL FROM DEFECTIVE OPENING IN GLASS MOLD AND RELATED GLASS MOLD FOR INJECTION MOLDED SOLDER 有权
标题翻译：从玻璃模具中的有缺陷的开放中去除材料以及用于注射成型的焊接的相关玻璃模具
公开(公告)号：US20090179020A1
公开(公告)日：2009-07-16
申请号：US12014959
申请日：2008-01-16
申请人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
发明人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
IPC分类号： B23K26/36 , B22C9/20
CPC分类号： B23K1/018 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L2224/11 , H01L2224/11003 , H01L2224/111 , H01L2924/14 , H05K3/3478 , H05K2203/0113 , H05K2203/107 , Y10T156/10
摘要： Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.
摘要翻译：公开了使用激光脉冲从玻璃模具中的缺陷开口移除材料的方法，修理玻璃模具和用于注射成型焊料的相关玻璃模具（IMS）。在一个实施例中，一种方法包括提供包括多个焊料填充开口的玻璃模具; 识别玻璃模具中有缺陷的开口; 通过向缺陷开口施加激光脉冲从缺陷开口移除材料; 并通过以下方式填补缺陷开口来修复缺陷开口：通过向开口施加激光脉冲从玻璃模具中的开口去除冗余的，无缺陷的焊料部分，并且将冗余的，无缺陷的缺陷开口处的焊料部分。

4. 发明授权

US09254533B2 Removing material from defective opening in glass mold 有权
标题翻译：从玻璃模具中打开的缺陷中取出材料
公开(公告)号：US09254533B2
公开(公告)日：2016-02-09
申请号：US13491093
申请日：2012-06-07
申请人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
发明人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
IPC分类号： B23K1/018 , B23K1/005 , H05K3/34 , B23K26/40
CPC分类号： B23K1/018 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L2224/11 , H01L2224/11003 , H01L2224/111 , H01L2924/14 , H05K3/3478 , H05K2203/0113 , H05K2203/107 , Y10T156/10
摘要： Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.
摘要翻译：公开了使用激光脉冲从玻璃模具中的缺陷开口移除材料的方法，修理玻璃模具和用于注射成型焊料的相关玻璃模具（IMS）。在一个实施例中，一种方法包括提供包括多个焊料填充开口的玻璃模具; 识别玻璃模具中有缺陷的开口; 通过向缺陷开口施加激光脉冲从缺陷开口移除材料; 并通过以下方式填补缺陷开口来修复缺陷开口：通过向开口施加激光脉冲从玻璃模具中的开口去除冗余的，无缺陷的焊料部分，并且将冗余的，无缺陷的缺陷开口处的焊料部分。

5. 发明授权

US08800952B2 Removing material from defective opening in glass mold and related glass mold for injection molded solder 有权
标题翻译：从注射成型焊料玻璃模具及相关玻璃模具中取出有缺陷的材料
公开(公告)号：US08800952B2
公开(公告)日：2014-08-12
申请号：US13432966
申请日：2012-03-28
申请人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
发明人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
IPC分类号： B23K26/36
CPC分类号： B23K1/018 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L2224/11 , H01L2224/11003 , H01L2224/111 , H01L2924/14 , H05K3/3478 , H05K2203/0113 , H05K2203/107 , Y10T156/10
摘要： Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.
摘要翻译：公开了使用激光脉冲从玻璃模具中的缺陷开口移除材料的方法，修理玻璃模具和用于注射成型焊料的相关玻璃模具（IMS）。在一个实施例中，一种方法包括提供包括多个焊料填充开口的玻璃模具; 识别玻璃模具中有缺陷的开口; 通过向缺陷开口施加激光脉冲从缺陷开口移除材料; 并通过以下方式填补缺陷开口来修复缺陷开口：通过向开口施加激光脉冲从玻璃模具中的开口去除冗余的，无缺陷的焊料部分，并且将冗余的，无缺陷的缺陷开口处的焊料部分。

6. 发明申请

US20120186771A1 REMOVING MATERIAL FROM DEFECTIVE OPENING IN GLASS MOLD AND RELATED GLASS MOLD FOR INJECTION MOLDED SOLDER 有权
标题翻译：从玻璃模具中的有缺陷的开放中去除材料以及用于注射成型的焊接的相关玻璃模具
公开(公告)号：US20120186771A1
公开(公告)日：2012-07-26
申请号：US13432966
申请日：2012-03-28
申请人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
发明人： Jerome D. Cohen , Robert G. Haas , Enrico Herz , Michael Teich , Christopher L. Tessler
IPC分类号： B22C9/00
CPC分类号： B23K1/018 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L2224/11 , H01L2224/11003 , H01L2224/111 , H01L2924/14 , H05K3/3478 , H05K2203/0113 , H05K2203/107 , Y10T156/10
摘要： Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.
摘要翻译：公开了使用激光脉冲从玻璃模具中的缺陷开口移除材料的方法，修理玻璃模具和用于注射成型焊料的相关玻璃模具（IMS）。在一个实施例中，一种方法包括提供包括多个焊料填充开口的玻璃模具; 识别玻璃模具中有缺陷的开口; 通过向缺陷开口施加激光脉冲从缺陷开口移除材料; 并通过以下方式填补缺陷开口来修复缺陷开口：通过向开口施加激光脉冲从玻璃模具中的开口去除冗余的，无缺陷的焊料部分，并且将冗余的，无缺陷的缺陷开口处的焊料部分。

7. 发明申请

US20080173697A1 METHOD AND APPARATUS FOR THE CORRECTION OF DEFECTIVE SOLDER BUMP ARRAYS 失效
标题翻译：用于纠正缺陷焊接块阵列的方法和装置
公开(公告)号：US20080173697A1
公开(公告)日：2008-07-24
申请号：US12018506
申请日：2008-01-23
申请人： Enrico Herz , Michael Teich , Axel Becker
发明人： Enrico Herz , Michael Teich , Axel Becker
IPC分类号： B23K31/02 , B23Q16/00 , B23K26/00
CPC分类号： B23K3/0623 , H05K3/225 , H05K3/3478 , H05K2203/0113 , H05K2203/0338
摘要： Disclosed is a method and apparatus for the correction of defective solder bump arrays arranged in a plurality of cavities in a mold. In the method, a faulty solder bump is searched, identified and located (i.e., its position is determined) in an arrangement of solder bumps disposed in cavities of a mold and the faulty solder bump is subsequently replaced by a prefabricated solder bump. The apparatus for carrying out the method comprises a mold holder, a scanning and locating device for finding and locating faulty solder bumps and a repair device for replacing the faulty solder bump by a prefabricated solder bump.
摘要翻译：公开了一种用于校正布置在模具中的多个空腔中的有缺陷的焊料凸块阵列的方法和装置。在该方法中，在布置在模具的空腔中的焊料凸块的布置中搜索，识别和定位故障的焊料凸块（即，其位置），并且随后由预制的焊料凸块代替故障的焊料凸块。用于执行该方法的装置包括：模具夹持器，用于发现和定位故障焊料凸块的扫描和定位装置;以及用于通过预制焊料凸块来替换故障焊料凸块的修复装置。

8. 发明授权

US08044320B2 Method and apparatus for the correction of defective solder bump arrays 失效
标题翻译：用于校正有缺陷的焊料凸块阵列的方法和装置
公开(公告)号：US08044320B2
公开(公告)日：2011-10-25
申请号：US12018506
申请日：2008-01-23
申请人： Enrico Herz , Michael Teich , Axel Becker
发明人： Enrico Herz , Michael Teich , Axel Becker
IPC分类号： H01L23/48
CPC分类号： B23K3/0623 , H05K3/225 , H05K3/3478 , H05K2203/0113 , H05K2203/0338
摘要： Disclosed is a method and apparatus for the correction of defective solder bump arrays arranged in a plurality of cavities in a mold. In the method, a faulty solder bump is searched, identified and located (i.e., its position is determined) in an arrangement of solder bumps disposed in cavities of a mold and the faulty solder bump is subsequently replaced by a prefabricated solder bump. The apparatus for carrying out the method comprises a mold holder, a scanning and locating device for finding and locating faulty solder bumps and a repair device for replacing the faulty solder bump by a prefabricated solder bump.
摘要翻译：公开了一种用于校正布置在模具中的多个空腔中的有缺陷的焊料凸块阵列的方法和装置。在该方法中，在布置在模具的空腔中的焊料凸块的布置中搜索，识别和定位故障的焊料凸块（即，其位置），并且随后由预制的焊料凸块替换故障的焊料凸块。用于执行该方法的装置包括：模具夹持器，用于发现和定位故障焊料凸块的扫描和定位装置;以及用于通过预制焊料凸块来替换故障焊料凸块的修复装置。

9. 发明授权

US08344744B2 Probe station for on-wafer-measurement under EMI-shielding 有权
标题翻译：探测台用于EMI屏蔽下的晶圆测量
公开(公告)号：US08344744B2
公开(公告)日：2013-01-01
申请号：US12818442
申请日：2010-06-18
申请人： Axel Schmidt , Botho Hirschfeld , Stojan Kanev , Andrej Rumiantsev , Michael Teich
发明人： Axel Schmidt , Botho Hirschfeld , Stojan Kanev , Andrej Rumiantsev , Michael Teich
IPC分类号： G01R31/00
CPC分类号： G01R31/2886 , G01R1/18
摘要： An arrangement is provided for testing DUTs with a chuck that has a support surface for supporting of a DUT as well as for supplying the support surface with a defined potential, or for connecting the DUT. The arrangement further includes a positioning device for positioning the chuck as well as an electromagnetic shielding housing enclosing at least the chuck. Inside the housing and adjacent to the chuck, a signal preamplifier is arranged whose signal port facing the chuck is electrically connected with the support surface, wherein the signal preamplifier is moveable together with the chuck by the positioning device in a way that it holds its position constant relative to the chuck during positioning. The signal preamplifier is connected to a measurement unit outside of the housing via a measurement cable.
摘要翻译：提供了一种用于使用具有用于支撑DUT的支撑表面以及用于向支撑表面提供限定电位或用于连接DUT的卡盘来测试DUT的布置。该装置还包括用于定位卡盘的定位装置以及至少包围卡盘的电磁屏蔽壳体。在壳体内部和卡盘附近，布置了一个信号前置放大器，其信号端口面向卡盘与支撑表面电连接，其中信号前置放大器可以通过定位装置与卡盘一起移动，使其保持其位置在定位期间相对于卡盘是恒定的。信号前置放大器通过测量电缆连接到壳体外部的测量单元。

10. 发明申请

US20110013011A1 ARRANGEMENT AND METHOD FOR FOCUSING A MULTIPLANE IMAGE ACQUISITION ON A PROBER 有权
标题翻译：用于聚焦探测器上多幅图像采集的布置方法
公开(公告)号：US20110013011A1
公开(公告)日：2011-01-20
申请号：US12847723
申请日：2010-07-30
申请人： Michael Teich , Ulf Hackius , Juliane Busch , Joerg Kiesewetter , Axel Becker
发明人： Michael Teich , Ulf Hackius , Juliane Busch , Joerg Kiesewetter , Axel Becker
IPC分类号： H04N7/18
CPC分类号： G02B21/365 , G02B21/06 , G02B21/244 , G02B21/26 , G02B21/32
摘要： A focused multi-planar image acquisition in real time even while a test object is moving, is achieved with a system and a method for a focused multi-planar image acquisition in a prober. When a surface of a test object is positioned laterally in relation to tips of separated probe needles, a microscope is focused on the surface of the test object at a first time and on a plane of the probe needles at a second time. The objective lens is provided with a microscope objective lens focusing system, which can focus the objective lens, independently of a vertical adjustment drive of the microscope, on the surface of the test object in a first focal plane and in a second focal plane, which is on a level with the probe needle tips.
摘要翻译：使用用于在探测器中聚焦的多平面图像采集的系统和方法来实现即使在测试对象移动时实时聚焦的多平面图像采集。当测试对象的表面相对于分离的探针的尖端横向定位时，显微镜在第一时间和第二次在探针的平面上聚焦在测试对象的表面上。物镜上设有显微镜物镜聚焦系统，该系统可独立于显微镜的垂直调节驱动物体将物镜聚焦在第一焦平面和第二焦平面上的测试物体的表面上，在探针针尖的水平上。

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