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    • 5. 发明授权
    • Microfabricated RF capacitor
    • 微型RF电容器
    • US08199457B1
    • 2012-06-12
    • US12856748
    • 2010-08-16
    • Robert L. PalandechNathan P. LowerMark M. MulbrookNathaniel P. Wyckoff
    • Robert L. PalandechNathan P. LowerMark M. MulbrookNathaniel P. Wyckoff
    • H01G4/06
    • H01G4/01H01G4/33H01L28/86
    • The present invention is directed to a microfabricated RF capacitor. The capacitor includes two signal wirebond pads configured for being connected to an electrical current source. The capacitor further includes two backbone structures which are connected to the wirebond pads and receive electrical current from the electrical current source via the wirebond pads, each backbone structure including a first backbone portion and a second backbone portion. The capacitor further includes a plurality of protrusions which are connected to the backbone portions of the backbone structures. The protrusions are spaced apart from each other and parallel to each other. Further, the protrusions are configured for distributing current received by the backbone structures and for promoting structural stability of the capacitor. The capacitor further includes a ground wall structure which may be configured for receiving ground current from a ground current source.
    • 本发明涉及一种微加工的RF电容器。 电容器包括被配置为连接到电流源的两个信号线焊垫。 电容器还包括两个骨架结构,其连接到引线焊盘并且经由引线焊盘接收来自电流源的电流,每个骨架结构包括第一主干部分和第二主干部分。 电容器还包括多个突起,其连接到骨架结构的骨架部分。 突起彼此间隔开并且彼此平行。 此外,突起构造成用于分配由骨架结构接收的电流并且用于促进电容器的结构稳定性。 电容器还包括接地壁结构,其可被配置为从接地电流源接收接地电流。