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1. 发明申请

US20050104206A1 Mounting structure in integrated circuit module 失效
标题翻译：集成电路模块中的安装结构
公开(公告)号：US20050104206A1
公开(公告)日：2005-05-19
申请号：US10988390
申请日：2004-11-12
申请人： Jeong-Hyeon Cho , Byung-Se So , Jin-Kyu Chang
发明人： Jeong-Hyeon Cho , Byung-Se So , Jin-Kyu Chang
IPC分类号： H01L25/10 , G11C5/00 , H01L21/50 , H01L23/48 , H01L25/18 , H05K1/18
CPC分类号： H05K1/181 , H01L2924/0002 , H05K2201/097 , H05K2201/10378 , H05K2201/10515 , H05K2201/10734 , Y02P70/611 , H01L2924/00
摘要： Embodiments of the present invention may include an integrated circuit module structure for a high-density mounting. An embodiment may include a wiring board, having a mounting space with a mounting length determined in a first direction and a mounting width determined in a second direction, on at least one surface thereof, and a plurality of integrated circuit packages having a package mounting combination length longer than the mounting length of the wiring board. An embodiment may also have some packages among the plurality of integrated circuit packages mounted directly on the mounting space, while other packages are mounted indirectly on the mounting space. The present embodiment may have packages that are overlapped horizontally and vertically distant from one another. Embodiments allow a plurality of chips or packages to be mounted in a limited area without changing a form factor of integrated circuit module even when integrated circuit chip or package size increases.
摘要翻译：本发明的实施例可以包括用于高密度安装的集成电路模块结构。一个实施例可以包括布线板，具有在其至少一个表面上具有沿第一方向确定的安装长度的安装长度和在第二方向上确定的安装宽度的安装空间以及具有封装安装组合的多个集成电路封装长度比布线板的安装长度长。实施例还可以在直接安装在安装空间上的多个集成电路封装中具有一些封装，而其他封装间接安装在安装空间上。本实施例可以具有水平和垂直地彼此重叠的封装。即使在集成电路芯片或封装尺寸增加时，实施例允许多个芯片或封装被安装在有限的区域中而不改变集成电路模块的外形尺寸。

2. 发明授权

US07227258B2 Mounting structure in integrated circuit module 失效
标题翻译：集成电路模块中的安装结构
公开(公告)号：US07227258B2
公开(公告)日：2007-06-05
申请号：US10988390
申请日：2004-11-12
申请人： Jeong-Hyeon Cho , Byung-Se So , Jin-Kyu Chang
发明人： Jeong-Hyeon Cho , Byung-Se So , Jin-Kyu Chang
IPC分类号： H01L23/34
CPC分类号： H05K1/181 , H01L2924/0002 , H05K2201/097 , H05K2201/10378 , H05K2201/10515 , H05K2201/10734 , Y02P70/611 , H01L2924/00
摘要： Embodiments of the present invention may include an integrated circuit module structure for a high-density mounting. An embodiment may include a wiring board, having a mounting space with a mounting length determined in a first direction and a mounting width determined in a second direction, on at least one surface thereof, and a plurality of integrated circuit packages having a package mounting combination length longer than the mounting length of the wiring board. An embodiment may also have some packages among the plurality of integrated circuit packages mounted directly on the mounting space, while other packages are mounted indirectly on the mounting space. The present embodiment may have packages that are overlapped horizontally and vertically distant from one another. Embodiments allow a plurality of chips or packages to be mounted in a limited area without changing a form factor of integrated circuit module even when integrated circuit chip or package size increases.
摘要翻译：本发明的实施例可以包括用于高密度安装的集成电路模块结构。一个实施例可以包括布线板，具有在其至少一个表面上具有在第一方向上确定的安装长度和在第二方向上确定的安装宽度的安装空间的安装空间以及具有封装安装组合的多个集成电路封装长度比布线板的安装长度长。实施例还可以在直接安装在安装空间上的多个集成电路封装中具有一些封装，而其他封装间接安装在安装空间上。本实施例可以具有水平和垂直地彼此重叠的封装。即使在集成电路芯片或封装尺寸增加时，实施例允许多个芯片或封装被安装在有限的区域中而不改变集成电路模块的外形尺寸。

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