专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

2. 发明申请

US20080166500A1 CATALYTIC SURFACE ACTIVATION METHOD FOR ELECTROLESS DEPOSITION 审中-公开
标题翻译：用于电沉积的催化表面活化方法
公开(公告)号：US20080166500A1
公开(公告)日：2008-07-10
申请号：US11767178
申请日：2007-06-22
申请人： Jeong-Hoon BYEON , Jae-Hong PARK , Ki-Young YOON , Jung-Ho HWANG
发明人： Jeong-Hoon BYEON , Jae-Hong PARK , Ki-Young YOON , Jung-Ho HWANG
IPC分类号： H05H1/24 , B05D3/10 , H01T1/20
CPC分类号： C23C18/1848 , C23C18/1837 , C23C18/31
摘要： Provided is a catalytic surface activation method for electroless deposition comprising a metallic aerosol nanoparticle generation step of generating metallic aerosol nanoparticles, which act as plating initiation catalyst; a metallic aerosol nanoparticle fixation step of fixing the resultant metallic aerosol nanoparticles on a plating surface; and an electroless deposition step of impregnating the material to be plated in an electroless deposition solution to form a plating layer on the plating surface on which the metallic aerosol nanoparticles have been fixed. The catalytic surface activation method for electroless deposition of the present invention is applicable to large-scale plating with simple process and superior applicability, improves the plating characteristics with little impurity generation, requires no post-treatment process for removing impurities and is environment-friendly with no wastewater generation by directly fixing metallic aerosol nanoparticles on the material to be plated.
摘要翻译：提供一种用于无电沉积的催化表面活化方法，其包括产生作为电镀起始催化剂的金属气溶胶纳米颗粒的金属气溶胶纳米颗粒生成步骤; 金属气溶胶纳米颗粒固定步骤，将所得到的金属气溶胶纳米粒子固定在电镀表面上; 以及无电沉积步骤，将待镀材料浸渍在无电解沉积溶液中，以在已经固定有金属气溶胶纳米颗粒的电镀表面上形成镀层。本发明的无电解沉积的催化表面活化方法适用于工艺简单，适用性优异的大规模电镀，提高电镀特性，杂质产生少，不需要后处理工艺除去杂质，环保，通过将金属气溶胶纳米颗粒直接固定在待镀材料上，不产生废水。

IPRDB

热门服务

关于我们

友情链接

联系方式