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    • 2. 发明申请
    • Lateral bipolar transistor with additional ESD implant
    • 具有附加ESD植入物的侧向双极晶体管
    • US20060226488A1
    • 2006-10-12
    • US11092368
    • 2005-03-29
    • Jens SchneiderMartin Wendel
    • Jens SchneiderMartin Wendel
    • H01L23/62
    • H01L27/0259H01L29/1008H01L29/735
    • A semiconductor device (10) includes a semiconductor body (12) of a first conductivity type (e.g., p-type). A first doped region (14) of a second conductivity type (e.g., n-type) is disposed at an upper surface of the semiconductor body (12). A second doped region (16) of the second conductivity type is disposed at the upper surface of the semiconductor body (12) and is separated from the first doped region (14) by an isolation region (18). A first contact (26) overlies and is electrically coupled to the first doped region (14) and a second contact (28) overlies and is electrically coupled to the second doped region (16). A third doped region (32) of the first conductivity type is disposed within the semiconductor body (12) beneath the first doped region (14).
    • 半导体器件(10)包括第一导电类型(例如p型)的半导体本体(12)。 在半导体本体(12)的上表面设置有第二导电类型的第一掺杂区(14)(例如,n型)。 第二导电类型的第二掺杂区域(16)设置在半导体本体(12)的上表面处,并且通过隔离区域(18)与第一掺杂区域(14)分离。 第一触点(26)覆盖并电耦合到第一掺杂区域(14),并且第二触点(28)覆盖并电耦合到第二掺杂区域(16)。 第一导电类型的第三掺杂区域(32)设置在第一掺杂区域(14)下面的半导体本体(12)内。
    • 6. 发明授权
    • Lateral bipolar transistor with additional ESD implant
    • 具有附加ESD植入物的侧向双极晶体管
    • US07875933B2
    • 2011-01-25
    • US11092368
    • 2005-03-29
    • Jens SchneiderMartin Wendel
    • Jens SchneiderMartin Wendel
    • H01L23/62
    • H01L27/0259H01L29/1008H01L29/735
    • A semiconductor device (10) includes a semiconductor body (12) of a first conductivity type (e.g., p-type). A first doped region (14) of a second conductivity type (e.g., n-type) is disposed at an upper surface of the semiconductor body (12). A second doped region (16) of the second conductivity type is disposed at the upper surface of the semiconductor body (12) and is separated from the first doped region (14) by an isolation region (18). A first contact (26) overlies and is electrically coupled to the first doped region (14) and a second contact (28) overlies and is electrically coupled to the second doped region (16). A third doped region (32) of the first conductivity type is disposed within the semiconductor body (12) beneath the first doped region (14).
    • 半导体器件(10)包括第一导电类型(例如p型)的半导体本体(12)。 在半导体本体(12)的上表面设置有第二导电类型的第一掺杂区(14)(例如,n型)。 第二导电类型的第二掺杂区域(16)设置在半导体本体(12)的上表面处,并且通过隔离区域(18)与第一掺杂区域(14)分离。 第一触点(26)覆盖并电耦合到第一掺杂区域(14),并且第二触点(28)覆盖并电耦合到第二掺杂区域(16)。 第一导电类型的第三掺杂区域(32)设置在第一掺杂区域(14)下面的半导体本体(12)内。