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    • 6. 发明授权
    • System for testing connections between chips
    • 用于测试芯片之间连接的系统
    • US08533543B2
    • 2013-09-10
    • US12414394
    • 2009-03-30
    • Jens BarrenscheenHarry Siebert
    • Jens BarrenscheenHarry Siebert
    • G01R31/28
    • G01R31/046G01R31/31717
    • In accordance with an aspect of the application, there is provided a system for testing, including a first chip, a second chip, and first and second connections. The first connection is configured to couple a first pin of the first chip to a first pin of the second chip, and to transmit an initial signal from the first chip to the second chip. The second connection is configured to couple a second pin of the first chip to a second pin of the second chip to return the signal as a returned signal to the first chip. The first chip comprises comparison circuitry configured to compare the returned signal with the initial signal.
    • 根据应用的一个方面,提供了一种用于测试的系统,包括第一芯片,第二芯片以及第一和第二连接。 第一连接被配置为将第一芯片的第一引脚耦合到第二芯片的第一引脚,并将初始信号从第一芯片传输到第二芯片。 第二连接被配置为将第一芯片的第二引脚耦合到第二芯片的第二引脚,以将信号作为返回信号返回到第一芯片。 第一芯片包括比较电路,其被配置为将返回的信号与初始信号进行比较。