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1. 发明申请

US20090014739A1 LIGHT-EMITTING DIODE PACKAGE STRUCTURE 审中-公开
标题翻译：发光二极管封装结构
公开(公告)号：US20090014739A1
公开(公告)日：2009-01-15
申请号：US12114459
申请日：2008-05-02
申请人： Jen-Ta Chiang , Yi-Tsuo Wu , Chia-Hsien Chang , Hsiao-Chiao Li
发明人： Jen-Ta Chiang , Yi-Tsuo Wu , Chia-Hsien Chang , Hsiao-Chiao Li
IPC分类号： H01L23/00
CPC分类号： H01L33/486 , H01L33/641 , H01L33/647 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： The present invention is an improved Light-Emitting Diode (LED) package structure comprising a light-emitting diode chip, a package board of heat conductive semiconductor material, a lead frame, and a circuit. Whereon the package board installs plural thermal vias to conduct the electricity circuit and transmit the heat out of the package due to the LED luminescing as well.
摘要翻译：本发明是一种改进的发光二极管（LED）封装结构，其包括发光二极管芯片，导热半导体材料的封装板，引线框架和电路。而由于LED发光，封装板安装了多个热通孔来传导电路并将热量传送出封装。

2. 发明授权

US08168992B2 Light-emitting diode backlight module 有权
标题翻译：发光二极管背光模组
公开(公告)号：US08168992B2
公开(公告)日：2012-05-01
申请号：US13033856
申请日：2011-02-24
申请人： Chia-Hsien Chang , Yi-Tsuo Wu , Hsiao-Chiao Li
发明人： Chia-Hsien Chang , Yi-Tsuo Wu , Hsiao-Chiao Li
IPC分类号： H01L33/60
CPC分类号： H05K1/021 , F21K9/68 , F21V29/505 , F21V29/70 , F21V29/86 , F21V29/87 , F21V29/89 , H05K1/182 , H05K3/0061 , H05K2201/10106 , H05K2201/10446 , Y10S257/918
摘要： A light-emitting diode backlight module includes a base and a light source disposed on the base. The light source comprises a substrate, a heat sink and an LED chip. The base has a heat conductor. The heat sink of the light source is coupled between the substrate of the light source and the heat conductor of the base. The heat sink has a first part which is adjacent a first side of the substrate and a second part which is adjacent a second side of the substrate. The heat sink is in contact with the heat conductor. The LED chip is disposed on the first part of the heat sink and emits light laterally.
摘要翻译：发光二极管背光模块包括设置在基座上的基座和光源。光源包括基板，散热片和LED芯片。底座有一个导热体。光源的散热器耦合在光源的基板和基座的热导体之间。散热器具有与衬底的第一侧相邻的第一部分和与衬底的第二侧相邻的第二部分。散热片与导热体接触。 LED芯片设置在散热器的第一部分上并且横向地发光。

3. 发明授权

US07919789B2 Lateral light-emitting diode backlight module 有权
标题翻译：侧面发光二极管背光模组
公开(公告)号：US07919789B2
公开(公告)日：2011-04-05
申请号：US12344108
申请日：2008-12-24
申请人： Chia-Hsien Chang , Yi-Tsuo Wu , Hsiao-Chiao Li
发明人： Chia-Hsien Chang , Yi-Tsuo Wu , Hsiao-Chiao Li
IPC分类号： H01L33/00
CPC分类号： H05K1/021 , F21K9/68 , F21V29/505 , F21V29/70 , F21V29/86 , F21V29/87 , F21V29/89 , H05K1/182 , H05K3/0061 , H05K2201/10106 , H05K2201/10446 , Y10S257/918
摘要： A lateral light-emitting diode backlight module includes a base, a circuit board, and at least a light emitting diode wherein the base having a heat conductor, the circuit board having a conductive pad formed on a surface thereof, and the circuit board disposed on the heat conductor and connected to the heat conductor. Each light emitting diode comprising a substrate, a heat sink fastened to the substrate and connected to the heat conductor, an LED chip disposed on the heat sink and emits light laterally, and a pin mounted on the substrate and extended to the conductive pad of the circuit board.
摘要翻译：侧面发光二极管背光模块包括基座，电路板和至少一个发光二极管，其中基座具有热导体，该电路板具有形成在其表面上的导电焊盘，并且电路板设置在热导体并连接到导热体上。每个发光二极管包括衬底，固定到衬底并连接到热导体的散热器，布置在散热器上的LED芯片并且侧向发射光;以及安装在衬底上并延伸到衬底的导电焊盘的引脚电路板。

4. 发明授权

US08368110B2 Side view LED package structure 有权
标题翻译：侧视LED封装结构
公开(公告)号：US08368110B2
公开(公告)日：2013-02-05
申请号：US11902141
申请日：2007-09-19
申请人： Yi-Tsuo Wu , Chung-Chuan Hsieh , Chia-Hsien Chang
发明人： Yi-Tsuo Wu , Chung-Chuan Hsieh , Chia-Hsien Chang
IPC分类号： H01L33/00 , H01L21/02
CPC分类号： H01L33/64 , H01L33/486 , H01L2224/48247 , H01L2224/48465 , H01L2924/00
摘要： A side view light emitting diode (LED) package structure includes a package housing, a side view LED chip and a thermal conductive member. The side view LED chip is enclosed by the package housing and an emitting direction of the side view LED chip is perpendicular to a thickness direction of a substrate. The thermal conductive member connected with the side view LED chip is disposed inside the package housing and a portion of which extends out of a dissipation opening of the package housing to be exposed so that heat of the side view LED chip is dissipated.
摘要翻译：侧视发光二极管（LED）封装结构包括封装壳体，侧视LED芯片和导热构件。侧视LED芯片由封装外壳封装，侧视LED芯片的发射方向垂直于基板的厚度方向。与侧视LED芯片连接的导热构件设置在封装壳体的内部，并且其一部分从封装壳体的散热开口延伸出来，以使侧视LED芯片的热量消散。

5. 发明申请

US20080067535A1 Side view LED package structure 有权
标题翻译：侧视LED封装结构
公开(公告)号：US20080067535A1
公开(公告)日：2008-03-20
申请号：US11902141
申请日：2007-09-19
申请人： Yi-Tsuo Wu , Chung-Chuan Hsieh , Chia-Hsien Chang
发明人： Yi-Tsuo Wu , Chung-Chuan Hsieh , Chia-Hsien Chang
IPC分类号： H01L33/00
CPC分类号： H01L33/64 , H01L33/486 , H01L2224/48247 , H01L2224/48465 , H01L2924/00
摘要： A side view light emitting diode (LED) package structure includes a package housing, a side view LED chip and a thermal conductive member. The side view LED chip is enclosed by the package housing and an emitting direction of the side view LED chip is perpendicular to a thickness direction of a substrate. The thermal conductive member connected with the side view LED chip is disposed inside the package housing and a portion of which extends out of a dissipation opening of the package housing to be exposed so that heat of the side view LED chip is dissipated.
摘要翻译：侧视发光二极管（LED）封装结构包括封装壳体，侧视LED芯片和导热构件。侧视LED芯片由封装外壳封装，侧视LED芯片的发射方向垂直于基板的厚度方向。与侧视LED芯片连接的导热构件设置在封装壳体的内部，并且其一部分从封装壳体的散热开口延伸出来，以使侧视LED芯片的热量消散。

6. 发明授权

US07872277B2 Light emitting diode device 有权
标题翻译：发光二极管装置
公开(公告)号：US07872277B2
公开(公告)日：2011-01-18
申请号：US11932588
申请日：2007-10-31
申请人： Chin-Yuan Hsu , Chia-Hsien Chang , Szu-Wei Huang
发明人： Chin-Yuan Hsu , Chia-Hsien Chang , Szu-Wei Huang
IPC分类号： H01L33/00
CPC分类号： H01L33/641 , H01L2224/16145 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A light emitting diode device is disclosed, and the light emitting diode device includes a base, a substrate, a lead frame, a chip, a first mixed layer and a second mixed layer. The first mixed layer and the second mixed layer respectively contain a glue and a thermal conductance insulating material, such as diamond carbon, diamond-like carbon or ceramic. The substrate and the lead frame are set on the base. The first mixed layer is formed between the chip and the substrate to fix the chip and strengthen heat dissipation. The second mixed layer is covered on the substrate and the chip to reduce the difference of the refraction index such that the total internal reflection angle is wider and the emitting efficiency is enhanced.
摘要翻译：公开了一种发光二极管器件，并且发光二极管器件包括基底，基底，引线框架，芯片，第一混合层和第二混合层。第一混合层和第二混合层分别含有胶和导热绝缘材料，例如金刚石碳，类金刚石碳或陶瓷。基板和引线框架设置在基座上。在芯片和基板之间形成第一混合层以固定芯片并加强散热。第二混合层被覆盖在基板和芯片上，以减小折射率的差异，使得全内反射角更宽并且发射效率增强。

7. 发明申请

US20090085051A1 Light emitting diode device 审中-公开
标题翻译：发光二极管装置
公开(公告)号：US20090085051A1
公开(公告)日：2009-04-02
申请号：US12078490
申请日：2008-04-01
申请人： Chung-Chuan Hsieh , Chien-Chang Pei , Chia-Hsien Chang
发明人： Chung-Chuan Hsieh , Chien-Chang Pei , Chia-Hsien Chang
IPC分类号： H01L33/00
CPC分类号： H01L33/64 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48247 , H01L2924/19107 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting diode device includes a light emitting diode chip, a thermal conducting part, two electric conducting parts and two first conducting wires. The light emitting diode chip has a surface and two electrodes disposed on the surface. The thermal conducting part is electrically insulated to the electrodes. The thermal conducting part includes a core bearing the light emitting diode chip, and four outward lead-frames connected to the core. The electric conducting parts are electrically insulated to the thermal conducting part. The first conducting wires have ends electrically connected to the electrodes.
摘要翻译：发光二极管器件包括发光二极管芯片，导热部件，两个导电部件和两个第一导线。发光二极管芯片具有设置在表面上的表面和两个电极。导热部分与电极电绝缘。导热部件包括承载发光二极管芯片的芯和连接到芯的四个外部引线框架。导电部件与导热部件电绝缘。第一导线具有电连接到电极的端部。

8. 发明授权

US07355371B2 Voltage regulator and method thereof 有权
标题翻译：电压调节器及其方法
公开(公告)号：US07355371B2
公开(公告)日：2008-04-08
申请号：US11421164
申请日：2006-05-31
申请人： Chun-An Chao , Chia-Hsien Chang
发明人： Chun-An Chao , Chia-Hsien Chang
IPC分类号： G05F1/577 , G05F1/575
CPC分类号： H02M3/1584 , H02M3/157 , H02M2001/009
摘要： A voltage regulator. A first analog to digital converter generates first data according to a first output voltage. A second analog to digital converter generates second data according to a second output voltage. A voltage adjustment device generates a voltage control signal according to the first data and the second data. A switching module respectively provides the first output voltage and the second output voltage to a first load and a second load according to the voltage control signal.
摘要翻译：电压调节器。第一模数转换器根据第一输出电压产生第一数据。第二模数转换器根据第二输出电压产生第二数据。电压调节装置根据第一数据和第二数据产生电压控制信号。开关模块根据电压控制信号分别将第一输出电压和第二输出电压提供给第一负载和第二负载。

9. 发明申请

US20110101393A1 LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：发光二极管封装结构及其制造方法
公开(公告)号：US20110101393A1
公开(公告)日：2011-05-05
申请号：US12703744
申请日：2010-02-10
申请人： Chin-Yuan Hsu , Chia-Hsien Chang
发明人： Chin-Yuan Hsu , Chia-Hsien Chang
IPC分类号： H01L33/00 , H01L21/60
CPC分类号： H01L33/62 , H01L2224/16 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H05K1/113 , H05K3/3431 , H05K2201/10106 , H05K2201/10924
摘要： A light-emitting diode (LED) package structure includes a LED chip, an interconnecting substrate, a first conductive lead and a second conductive lead. The LED chip is provided with first and second electrical contacts formed on the same side thereof. The upper surface of the interconnecting substrate is provided with two conductive traces and first, second, third and fourth conductive pads. The first and second conductive pads are electrically connected to the third and fourth conductive pads by the two conductive traces, respectively. The first and second conductive leads are directly soldered to the third and fourth conductive pads, respectively. The LED chip is mounted onto the upper surface of the interconnecting substrate in a flip-chip configuration so that the first and second conductive pads thereof are mechanically and electrically connected to the first and second electrical contacts, respectively.
摘要翻译：发光二极管（LED）封装结构包括LED芯片，互连衬底，第一导电引线和第二导电引线。 LED芯片设置有形成在其同一侧上的第一和第二电触点。互连基板的上表面设置有两个导电迹线和第一，第二，第三和第四导电焊盘。第一和第二导电焊盘分别通过两个导电迹线电连接到第三和第四导电焊盘。第一和第二导电引线分别直接焊接到第三和第四导电焊盘。 LED芯片以倒装芯片配置安装在互连基板的上表面上，使得其第一和第二导电焊盘分别机械地和电连接到第一和第二电触点。

10. 发明申请

US20090026484A1 LIGHT EMITTING DIODE DEVICE 有权
标题翻译：发光二极管装置
公开(公告)号：US20090026484A1
公开(公告)日：2009-01-29
申请号：US11932588
申请日：2007-10-31
申请人： Chin-Yuan Hsu , Chia-Hsien Chang , Szu-Wei Huang
发明人： Chin-Yuan Hsu , Chia-Hsien Chang , Szu-Wei Huang
IPC分类号： H01L33/00
CPC分类号： H01L33/641 , H01L2224/16145 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A light emitting diode device is disclosed, and the light emitting diode device includes a base, a substrate, a lead frame, a chip, a first mixed layer and a second mixed layer. The first mixed layer and the second mixed layer respectively contain a glue and a thermal conductance insulating material, such as diamond carbon, diamond-like carbon or ceramic. The substrate and the lead frame are set on the base. The first mixed layer is formed between the chip and the substrate to fix the chip and strengthen heat dissipation. The second mixed layer is covered on the substrate and the chip to reduce the difference of the refraction index such that the total internal reflection angle is wider and the emitting efficiency is enhanced.
摘要翻译：公开了一种发光二极管器件，并且发光二极管器件包括基底，基底，引线框架，芯片，第一混合层和第二混合层。第一混合层和第二混合层分别含有胶和导热绝缘材料，例如金刚石碳，类金刚石碳或陶瓷。基板和引线框架设置在基座上。在芯片和基板之间形成第一混合层以固定芯片并加强散热。第二混合层被覆盖在基板和芯片上，以减小折射率的差异，使得全内反射角更宽并且发射效率增强。

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