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    • 2. 发明申请
    • Methods of inserting or removing a species from a substrate
    • 从基材中插入或除去物质的方法
    • US20050229947A1
    • 2005-10-20
    • US11036585
    • 2005-01-13
    • Jeffrey SpiegelmanDaniel AlvarezJoshua Cook
    • Jeffrey SpiegelmanDaniel AlvarezJoshua Cook
    • H01L21/306H01L21/44
    • B08B7/00H01L21/02052H01L21/02057H01L21/76814H01L21/76826
    • Methods of inserting and removing species from substrates utilizing pressure-vent cycling are revealed in embodiments of the invention. Various embodiments introduce a fluid to a vessel containing the substrate while setting pressure at an elevated level. The pressure is maintained at the elevated level for a predetermined period of time, the lowered by removing fluid from the vessel. The steps of introducing fluid, maintaining pressure, and lowering pressure are repeated at least once. Embodiments of the invention may allow a species to be removed from the voids of a substrate, or allow a new species to be inserted into the voids. Particular embodiments also have special application to preconditioning, activating, and/or regenerating gas purification substrates, or removing and/or delivering species with respect to semiconductor substrates. Embodiments of the invention allow faster transport of species to and from substrates with less use of purging or filling fluids.
    • 在本发明的实施方案中揭示了使用压力 - 排气循环从底物中插入和除去物质的方法。 各种实施例在将压力设定在较高水平的同时将流体引入到容纳衬底的容器中。 压力在升高的水平上保持预定的时间,通过从容器中除去流体而降低。 引入流体,保持压力和降低压力的步骤至少重复一次。 本发明的实施方案可以允许物质从基底的空隙中除去,或允许将新物质插入空隙中。 具体实施方案还具有预处理,活化和/或再生气体净化衬底或相对于半导体衬底去除和/或递送物质的特殊应用。 本发明的实施方案允许物种更快地使用清洗或填充液体将物质运送到基底和从基底移走。