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1. 发明申请

US20060113450A1 SELF-LOCATING FEATURE FOR A PI-JOINT ASSEMBLY 有权
标题翻译：自动定位功能用于PI-JOINT组件
公开(公告)号：US20060113450A1
公开(公告)日：2006-06-01
申请号：US10904800
申请日：2004-11-30
申请人： Jeffrey Kilwin , Ronald Newcomer , Philip Freeman
发明人： Jeffrey Kilwin , Ronald Newcomer , Philip Freeman
IPC分类号： B23K9/12
CPC分类号： F16B11/006 , F16B5/08 , F16B17/008
摘要： A self-locating feature for a pi-joint assembly is provided. The pi-joint assembly includes a substructure, a member coupled to the substructure. The substructure includes one or more land extending above one of a front side and a back side of the substructure. The land includes an outer surface, a depth location control surface and an edge location control surface. The member includes a base, a pair of axially elongated leg extending from the base to define a channel therebetween, and one or more notch located in one of the pair of axially elongated leg. The notch includes a depth contact location control surface and an edge contact location control surface, wherein the depth location control surface of the land of the substructure is correspondingly coupled to the depth contact location control surface of the notch located in one of the axially elongated leg, and the edge location control surface of the land of the substructure is correspondingly coupled to the edge contact location control surface of the notch located in one of the axially elongated leg. A method of assembling a pi-joint assembly of the present invention is also provided.
摘要翻译：提供了一种用于pi接头组件的自定位特征。该接头组件包括一个子结构，一个连接到子结构的构件。子结构包括在底部结构的前侧和后侧之一上延伸的一个或多个平台。地面包括外表面，深度位置控制表面和边缘位置控制表面。该构件包括一个底座，一对轴向细长的腿从基座延伸以在其间限定通道，以及一个或多个凹口，位于一对轴向细长腿中的一个中。切口包括深度接触位置控制表面和边缘接触位置控制表面，其中底部结构的平台的深度位置控制表面对应地联接到位于轴向细长腿之一中的凹口的深度接触位置控制表面并且底座的台面的边缘位置控制表面相应地联接到位于轴向细长的腿之一中的凹口的边缘接触位置控制表面。还提供了组装本发明的接头组件的方法。

2. 发明申请

US20060113451A1 MINIMUM BOND THICKNESS ASSEMBLY FEATURE ASSURANCE 有权
标题翻译：最小粘结厚度组件特征保证
公开(公告)号：US20060113451A1
公开(公告)日：2006-06-01
申请号：US10904801
申请日：2004-11-30
申请人： Jeffrey Kilwin , Ronald Newcomer
发明人： Jeffrey Kilwin , Ronald Newcomer
IPC分类号： F16B1/00
CPC分类号： F16B11/006
摘要： A minimum bond assurance feature for a pi-joint assembly is provided. The pi-joint assembly includes a substructure, a member coupled to the substructure. The substructure includes one or more standoff extending above one of the lower side, the front side and the back side of the substructure. The standoff includes a space location control surface. The member includes a base, a pair of axially elongated leg extending from the base to define a channel therebetween. The channel of the member has a first channel side, a channel floor and a second channel side, wherein the space location control surface may contact the member maintaining a standoff distance between the one of the lower side, the front side and the back side of the substructure and corresponding one of the channel floor, the first channel side and the second channel side of the member. A method of assembling a pi-joint assembly of the present invention is also provided.
摘要翻译：提供了一种用于连接组合件的最小粘结保证特征。该接头组件包括一个子结构，一个连接到子结构的构件。子结构包括在底部结构的下侧，前侧和后侧之一上延伸的一个或多个支座。对立包括一个空间位置控制面。该构件包括一个基部，一对轴向细长的腿从基部延伸以在它们之间限定通道。构件的通道具有第一通道侧，通道底板和第二通道侧，其中空间位置控制表面可以与构件接触，从而保持下侧，前侧和后侧之间的间隔距离子结构和相应的一个通道底板，构件的第一通道侧和第二通道侧。还提供了组装本发明的接头组件的方法。

3. 发明申请

US20060243382A1 Adhesive injection process for Pi-joint assemblies 有权
标题翻译：用于Pi接头组件的粘合剂注射过程
公开(公告)号：US20060243382A1
公开(公告)日：2006-11-02
申请号：US11111318
申请日：2005-04-21
申请人： Jeffrey Kilwin , Jim Piszar , Christopher Mathiesen
发明人： Jeffrey Kilwin , Jim Piszar , Christopher Mathiesen
IPC分类号： B29C65/00
CPC分类号： B29C65/542 , B29C65/483 , B29C65/544 , B29C66/00145 , B29C66/112 , B29C66/12441 , B29C66/131 , B29C66/43441 , B29C66/474 , B29C66/721 , B29C66/742 , B29K2705/00 , B29L2031/3076
摘要： An adhesive injection process for a Pi-joint assembly comprises the steps of: machining at least two ports into a female part of a Pi-joint assembly; inserting a filler into a gap between a male part and the female part; applying a sealant above the filler; creating a vacuum with a vacuum pump at one port; injecting an adhesive through another port; and drawing the adhesive towards the vacuum pump until the gap under the filler is completely filled with the adhesive. The adhesive injection process incorporates lean technologies that enable increased productivity during the assembly of a Pi-joint design using adhesive bonding. The adhesive injection process is suitable for, but not limited to, applications in the aerospace industry, such as the aircraft airframe assembly. The adhesive injection process may be used for the bonding of upper and lower skins to airframe structure as well as for structure-to-structure bonding.
摘要翻译：用于Pi接头组件的粘合剂注射方法包括以下步骤：将至少两个端口加工到Pi接头组件的阴部分中; 将填料插入阳部件和阴部件之间的间隙中; 在填料上施加密封剂; 在一个端口用真空泵产生真空; 通过另一个端口注入粘合剂; 并将粘合剂拉向真空泵，直到填料下面的间隙完全被粘合剂填满。粘合剂注射过程结合了精益技术，其在使用粘合剂粘合的Pi接头设计的组装期间能够提高生产率。粘合剂注射方法适用于但不限于在航空航天工业中的应用，例如飞行器机身组件。粘合剂注射方法可以用于将上皮和下皮粘合到机身结构以及结构 - 结构粘合。

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