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    • 1. 发明授权
    • Vapor cell atomic clock physics package
    • 蒸汽电池原子钟物理包
    • US08624682B2
    • 2014-01-07
    • US13327417
    • 2011-12-15
    • Jeff A. RidleyRobert ComptonMary K. SalitJeffrey Kriz
    • Jeff A. RidleyRobert ComptonMary K. SalitJeffrey Kriz
    • H03B17/00H05K13/04
    • G04F5/14G04F5/145Y10T29/49117
    • In an example, a chip-scale atomic clock physics package is provided. This chip-scale atomic clock physics package includes a body defining a cavity, and a first scaffold mounted in the cavity. A laser is mounted on the first surface of the first scaffold. A second scaffold is also mounted in the cavity. The second scaffold is disposed such that the first surface of the second scaffold is facing the first scaffold. A first photodetector is mounted on the first surface of the second scaffold. A vapor cell is mounted on the first surface of the second scaffold. A waveplate is also included, wherein the laser, waveplate, first photodetector, and vapor cell are disposed such that a beam from the laser can propagate through the waveplate and the vapor cell and be detected by the first photodetector. A lid is also included for covering the cavity.
    • 在一个示例中,提供了芯片级原子钟物理包。 该芯片级原子钟物理封装包括限定空腔的主体和安装在空腔中的第一脚手架。 激光器安装在第一支架的第一表面上。 第二个脚手架也安装在腔中。 第二支架设置成使得第二支架的第一表面面向第一支架。 第一光电检测器安装在第二支架的第一表面上。 蒸气室安装在第二支架的第一表面上。 还包括波片,其中激光器,波片,第一光电检测器和蒸汽单元被布置成使得来自激光器的光束可以传播通过波片和蒸汽单元并且被第一光电检测器检测。 还包括盖以覆盖空腔。
    • 2. 发明申请
    • VAPOR CELL ATOMIC CLOCK PHYSICS PACKAGE
    • 蒸汽细胞原子钟物理包装
    • US20120313717A1
    • 2012-12-13
    • US13327417
    • 2011-12-15
    • Jeff A. RidleyRobert ComptonMary K. SalitJeffrey Kriz
    • Jeff A. RidleyRobert ComptonMary K. SalitJeffrey Kriz
    • H03B17/00H05K13/00
    • G04F5/14G04F5/145Y10T29/49117
    • In an example, a chip-scale atomic clock physics package is provided. This chip-scale atomic clock physics package includes a body defining a cavity, and a first scaffold mounted in the cavity. A laser is mounted on the first surface of the first scaffold. A second scaffold is also mounted in the cavity. The second scaffold is disposed such that the first surface of the second scaffold is facing the first scaffold. A first photodetector is mounted on the first surface of the second scaffold. A vapor cell is mounted on the first surface of the second scaffold. A waveplate is also included, wherein the laser, waveplate, first photodetector, and vapor cell are disposed such that a beam from the laser can propagate through the waveplate and the vapor cell and be detected by the first photodetector. A lid is also included for covering the cavity.
    • 在一个示例中,提供了芯片级原子钟物理包。 该芯片级原子钟物理封装包括限定空腔的主体和安装在空腔中的第一脚手架。 激光器安装在第一支架的第一表面上。 第二个脚手架也安装在腔中。 第二支架设置成使得第二支架的第一表面面向第一支架。 第一光电检测器安装在第二支架的第一表面上。 蒸气室安装在第二支架的第一表面上。 还包括波片,其中激光器,波片,第一光电检测器和蒸汽单元被布置成使得来自激光器的光束可以传播通过波片和蒸汽单元并且被第一光电检测器检测。 还包括盖以覆盖空腔。
    • 8. 发明授权
    • Fabrication techniques to enhance pressure uniformity in anodically bonded vapor cells
    • 制造技术,以提高阳极结合蒸气细胞的压力均匀性
    • US09146540B2
    • 2015-09-29
    • US13570363
    • 2012-08-09
    • Daniel W. YoungnerJeff A. RidleySon T. Lu
    • Daniel W. YoungnerJeff A. RidleySon T. Lu
    • H01L31/02G04F5/14
    • G04F5/14Y10T428/24149
    • A method of fabricating vapor cells comprises forming a plurality of vapor cell dies in a first wafer having an interior surface region and a perimeter, and forming a plurality of interconnected vent channels in the first wafer. The vent channels provide at least one pathway for gas from each vapor cell die to travel outside of the perimeter of the first wafer. The method further comprises anodically bonding a second wafer to one side of the first wafer, and anodically bonding a third wafer to an opposing side of the first wafer. The vent channels allow gas toward the interior surface region of the first wafer to be in substantially continuous pressure-equilibrium with gas outside of the perimeter of the first wafer during the anodic bonding of the second and third wafers to the first wafer.
    • 一种制造蒸汽池的方法包括在具有内表面区域和周边的第一晶片中形成多个蒸汽池模具,并在第一晶片中形成多个互连的排气通道。 通气通道为来自每个蒸汽池模具的气体提供至少一个通路,以便在第一晶片的周边外行进。 该方法还包括将第二晶片阳极结合到第一晶片的一侧,并将第三晶片阳极结合到第一晶片的相对侧。 在第二和第三晶片与第一晶片的阳极接合期间,排气通道允许气体朝向第一晶片的内表面区域与第一晶片的周边外的气体基本上连续的压力平衡。
    • 10. 发明申请
    • HYBRID HERMETIC INTERFACE CHIP
    • 混合界面切片
    • US20100320595A1
    • 2010-12-23
    • US12488847
    • 2009-06-22
    • Robert D. HorningJeff A. Ridley
    • Robert D. HorningJeff A. Ridley
    • H01L23/02H01L23/48H01L21/50
    • B81B7/007B81C2203/019H01L2224/48091H01L2924/1461H01L2924/00014H01L2924/00
    • A hermetically sealed MEMS device package comprises a MEMS device platform, a hermetic interface chip, and an outer seal ring. The MEMS device platform includes a MEMS device surrounded by a continuous outer boundary wall with a top surface. The hermetic interface chip includes a glass substrate and at least one silicon mesa. The glass substrate includes at least one hole and has a lower surface with an inner portion surrounded by an outer portion. The at least one silicon mesa is bonded to the inner portion of the lower surface of the glass substrate, such that the at least one silicon mesa is aligned with the at least one hole in the glass substrate. The outer seal ring bonds the outer portion of the lower surface of the glass substrate to the top surface of the continuous outer boundary wall of the MEMS device platform.
    • 密封的MEMS器件封装包括MEMS器件平台,密封接口芯片和外部密封环。 MEMS器件平台包括由具有顶表面的连续外边界壁包围的MEMS器件。 密封接口芯片包括玻璃基板和至少一个硅台面。 玻璃基板包括至少一个孔,并且具有下表面,内部被外部包围。 至少一个硅台面结合到玻璃基板的下表面的内部,使得至少一个硅台面与玻璃基板中的至少一个孔对准。 外密封环将玻璃基板的下表面的外部部分结合到MEMS器件平台的连续外边界壁的顶表面。